Patents by Inventor Biay-Cheng Hseih

Biay-Cheng Hseih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125975
    Abstract: Systems and techniques are provided for imaging with a meta-lens. For instance, a process can include receiving light at a first substrate, the first substrate comprising a first meta-lens; receiving a first portion of the light at a second substrate, the second substrate including an optical sensor, wherein: the optical sensor is directly covered by a solid covering, and the first substrate is mechanically coupled to the second substrate such that the solid covering is between the first substrate and the second substrate; and receiving, by the optical sensor and through the solid covering, at least a second portion of the light focused by the first meta-lens.
    Type: Application
    Filed: October 9, 2023
    Publication date: April 18, 2024
    Inventors: Matthieu Jean Olivier DUPRE, Biay-Cheng HSEIH, Jian MA, Sergiu Radu GOMA
  • Patent number: 11818462
    Abstract: Various embodiments are directed to a device including an infrared phase detection autofocus (PDAF) sensor. The device may include a projector configured to transmit a source light onto a scene. The device may include the infrared PDAF sensor configured to receive reflections of the source light off of objects within the scene. The infrared PDAF sensor may include a first set of pixels including focus pixels. The device may include a processor coupled to the infrared PDAF sensor and a memory. The processor may be configured to generate first depth data based on the received reflections of the source light. The processor may be configured to generate second depth data based on signals generated from corresponding pairs of the focus pixels. The processor may be configured to generate combined depth data based on the first depth data and the second depth data.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: November 14, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Micha Galor Gluskin, Biay-Cheng Hseih
  • Patent number: 11763425
    Abstract: Techniques and systems are provided for high resolution time-of-flight (ToF) depth imaging. In some examples, an apparatus includes a projection system including one or more light-emitting devices, each light-emitting device being configured to illuminate at least one portion of an entire field-of-view (FOV) of the projection system. The entire FOV includes a plurality of FOV portions. The apparatus also includes a receiving system including a sensor configured to sequentially capture a plurality of images based on a plurality of illumination reflections corresponding to light emitted by the one or more light-emitting devices. Each image of the plurality of images corresponds to one of the plurality of FOV portions. An image resolution associated with each image corresponds to a full resolution of the sensor. The apparatus further includes a processor configured to generate, using the plurality of images, an increased resolution depth map associated with the entire FOV.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: September 19, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Jian Ma, Sergiu Radu Goma, Biay-Cheng Hseih
  • Patent number: 11561085
    Abstract: Aspects of the present disclosure relate to depth sensing using a device. An example device includes a light projector configured to project light in a first and a second distribution. The first and the second distribution include a flood projection when the device operates in a first mode and a pattern projection when the device operates in a second mode, respectively. The example device includes a receiver configured to detect reflections of light projected by the light projector. The example device includes a processor connected to a memory storing instructions. The processor is configured to determine first depth information based on reflections detected by the receiver when the device operates in the first mode, determine second depth information based on reflections detected by the receiver when the device operates in the second mode, and resolve multipath interference (MPI) using the first depth information and the second depth information.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: January 24, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Biay-Cheng Hseih, Jian Ma, Sergiu Radu Goma
  • Patent number: 11563873
    Abstract: Aspects of the present disclosure relate to depth sensing using a device. An example device includes a first light projector configured to project light towards a second light projector configured to project light towards the first light projector. The example device includes a reflective component positioned between the first and second light projectors, the reflective component configured to redirect the light projected by the first light projector onto a first portion of a scene and to redirect the light projected by the second light projector onto a second portion of the scene, and the first and second portions of the scene being adjacent to one another and non-overlapping relative to one another. The example device includes a receiver configured to detect reflections of redirected light projected by the first and second light projectors.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: January 24, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Jian Ma, Sergiu Goma, Biay-Cheng Hseih
  • Publication number: 20230012003
    Abstract: Systems and techniques are provided for meta-lens cameras. For example, an apparatus can include a first substrate including a first aperture and a second substrate including a first meta-lens. The first substrate and the second substrate are mechanically coupled such that at least a first portion of the first aperture is disposed over at least a second portion of the first meta-lens.
    Type: Application
    Filed: July 5, 2022
    Publication date: January 12, 2023
    Inventors: Jian MA, Biay-Cheng HSEIH, Matthieu Jean Olivier DUPRE, Sergiu Radu GOMA
  • Patent number: 11488999
    Abstract: Aspects of the present disclosure relate to an image sensor. An example apparatus includes an image sensor including one or more pixels. Each pixel of the one or more pixels includes a photodetector, and the photodetector includes a photosensitive surface including germanium. In some implementations, the photodetector includes a photodiode including an intrinsic silicon layer doped with germanium or including germanium crystals. The intrinsic layer may be between a p? layer and an n? layer not including germanium. The intrinsic layer may be configured to absorb photons of the light received at the intrinsic layer. The light may include one or more reflections of an emitted light for active depth sensing. For example, the emitted light may be frequency modulated and having a first wavelength for indirect time-of-flight depth sensing. Sampling circuits may generate voltages indicating a phase difference between the emitted light and a reflection of the emitted light.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: November 1, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Biay-Cheng Hseih, Sergiu Radu Goma
  • Patent number: 11438486
    Abstract: This disclosure provides systems, methods, and apparatuses for sensing a scene. In one aspect, a device may illuminate the scene using a sequence of two or more periods. Each period may include a transmission portion during which a plurality of light pulses are emitted onto the scene. Each period may include a non-transmission portion corresponding to an absence of emitted light. The device may receive, during each transmission portion, a plurality of light pulses reflected from the scene. The device may continuously accumulate photoelectric charge indicative of the received light pulses during an entirety of the sequence. The device may transfer the accumulated photoelectric charge to a readout circuit after an end of the sequence.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: September 6, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Jian Ma, Biay-Cheng Hseih, Sergiu Radu Goma
  • Publication number: 20220245762
    Abstract: Techniques and systems are provided for high resolution time-of-flight (ToF) depth imaging. In some examples, an apparatus includes a projection system including one or more light-emitting devices, each light-emitting device being configured to illuminate at least one portion of an entire field-of-view (FOV) of the projection system. The entire FOV includes a plurality of FOV portions. The apparatus also includes a receiving system including a sensor configured to sequentially capture a plurality of images based on a plurality of illumination reflections corresponding to light emitted by the one or more light-emitting devices. Each image of the plurality of images corresponds to one of the plurality of FOV portions. An image resolution associated with each image corresponds to a full resolution of the sensor. The apparatus further includes a processor configured to generate, using the plurality of images, an increased resolution depth map associated with the entire FOV.
    Type: Application
    Filed: February 3, 2021
    Publication date: August 4, 2022
    Inventors: Jian MA, Sergiu Radu GOMA, Biay-Cheng HSEIH
  • Patent number: 11297258
    Abstract: A high dynamic range solid state image sensor and camera system are disclosed. In one aspect, the solid state image sensor includes a first wafer including an array of pixels, each of the pixels comprising a photosensor, and a second wafer including an array of readout circuits. Each of the readout circuits is configured to output a readout signal indicative of an amount of light received by a corresponding one of the pixels and each of the readout circuits includes a counter. Each of the counters is configured to increment in response to the corresponding photosensor receiving an amount of light that is greater than a photosensor threshold. Each of the readout circuits is configured to generate the readout signal based on a value stored in the corresponding counter and a remainder stored in the corresponding pixel.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: April 5, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Sergiu Goma, Biay-Cheng Hseih
  • Publication number: 20210321021
    Abstract: Aspects of the present disclosure relate to depth sensing using a device. An example device includes a first light projector configured to project light towards a second light projector configured to project light towards the first light projector. The example device includes a reflective component positioned between the first and second light projectors, the reflective component configured to redirect the light projected by the first light projector onto a first portion of a scene and to redirect the light projected by the second light projector onto a second portion of the scene, and the first and second portions of the scene being adjacent to one another and non-overlapping relative to one another. The example device includes a receiver configured to detect reflections of redirected light projected by the first and second light projectors.
    Type: Application
    Filed: April 14, 2020
    Publication date: October 14, 2021
    Inventors: Jian Ma, Sergiu Goma, Biay-Cheng Hseih
  • Publication number: 20210210543
    Abstract: Aspects of the present disclosure relate to an image sensor. An example apparatus includes an image sensor including one or more pixels. Each pixel of the one or more pixels includes a photodetector, and the photodetector includes a photosensitive surface including germanium. In some implementations, the photodetector includes a photodiode including an intrinsic silicon layer doped with germanium or including germanium crystals. The intrinsic layer may be between a p? layer and an n? layer not including germanium. The intrinsic layer may be configured to absorb photons of the light received at the intrinsic layer. The light may include one or more reflections of an emitted light for active depth sensing. For example, the emitted light may be frequency modulated and having a first wavelength for indirect time-of-flight depth sensing. Sampling circuits may generate voltages indicating a phase difference between the emitted light and a reflection of the emitted light.
    Type: Application
    Filed: January 6, 2020
    Publication date: July 8, 2021
    Inventors: Biay-Cheng HSEIH, Sergiu Radu GOMA
  • Patent number: 11037966
    Abstract: Various embodiments are directed to an image sensor that includes a first sensor portion and a second sensor portion. The second sensor portion may be positioned relative to the first sensor portion such that the second sensor portion may initially detect light entering the image sensor, and some of that light passes through the second sensor portion and may be detected by the first sensor portion. In some embodiments, one more optical filters may be disposed within the image sensor. The one or more optical filters may include at least one of a dual bandpass filter disposed above the second photodetector or a narrow bandpass filter disposed between the first photodetector and the second photodetector.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: June 15, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Biay-Cheng Hseih, Todor Georgiev Georgiev, Jian Ma, Sergiu Goma
  • Publication number: 20210067662
    Abstract: This disclosure provides systems, methods, and apparatuses for sensing a scene. In one aspect, a device may illuminate the scene using a sequence of two or more periods. Each period may include a transmission portion during which a plurality of light pulses are emitted onto the scene. Each period may include a non-transmission portion corresponding to an absence of emitted light. The device may receive, during each transmission portion, a plurality of light pulses reflected from the scene. The device may continuously accumulate photoelectric charge indicative of the received light pulses during an entirety of the sequence. The device may transfer the accumulated photoelectric charge to a readout circuit after an end of the sequence.
    Type: Application
    Filed: August 26, 2019
    Publication date: March 4, 2021
    Inventors: Jian Ma, Biay-Cheng Hseih, Sergiu Radu Goma
  • Publication number: 20210067705
    Abstract: Various embodiments are directed to a device including an infrared phase detection autofocus (PDAF) sensor. The device may include a projector configured to transmit a source light onto a scene. The device may include the infrared PDAF sensor configured to receive reflections of the source light off of objects within the scene. The infrared PDAF sensor may include a first set of pixels including focus pixels. The device may include a processor coupled to the infrared PDAF sensor and a memory. The processor may be configured to generate first depth data based on the received reflections of the source light. The processor may be configured to generate second depth data based on signals generated from corresponding pairs of the focus pixels. The processor may be configured to generate combined depth data based on the first depth data and the second depth data.
    Type: Application
    Filed: August 26, 2020
    Publication date: March 4, 2021
    Inventors: Micha Galor Gluskin, Biay-Cheng HSEIH
  • Publication number: 20200386540
    Abstract: Aspects of the present disclosure relate to depth sensing using a device. An example device includes a light projector configured to project light in a first and a second distribution. The first and the second distribution include a flood projection when the device operates in a first mode and a pattern projection when the device operates in a second mode, respectively. The example device includes a receiver configured to detect reflections of light projected by the light projector. The example device includes a processor connected to a memory storing instructions. The processor is configured to determine first depth information based on reflections detected by the receiver when the device operates in the first mode, determine second depth information based on reflections detected by the receiver when the device operates in the second mode, and resolve multipath interference (MPI) using the first depth information and the second depth information.
    Type: Application
    Filed: November 13, 2019
    Publication date: December 10, 2020
    Inventors: Biay-Cheng Hseih, Jian Ma, Sergiu Radu Goma
  • Patent number: 10608036
    Abstract: Various embodiments are directed to a light pipe. The light pipe may include a channel within a substrate of an image sensor. The channel may be formed by a plurality of layers. The plurality of layers may include a first layer and a second layer. The second layer may be spaced apart from the first layer along an axis of the channel.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: March 31, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Jian Ma, Biay-Cheng Hseih, Sergiu Radu Goma
  • Publication number: 20190115386
    Abstract: Various embodiments are directed to a light pipe. The light pipe may include a channel within a substrate of an image sensor. The channel may be formed by a plurality of layers. The plurality of layers may include a first layer and a second layer. The second layer may be spaced apart from the first layer along an axis of the channel.
    Type: Application
    Filed: October 16, 2018
    Publication date: April 18, 2019
    Inventors: Jian MA, Biay-Cheng HSEIH, Sergiu Radu GOMA
  • Publication number: 20190096932
    Abstract: Various embodiments are directed to an image sensor that includes a first sensor portion and a second sensor portion. The second sensor portion may be positioned relative to the first sensor portion such that the second sensor portion may initially detect light entering the image sensor, and some of that light passes through the second sensor portion and may be detected by the first sensor portion. In some embodiments, one more optical filters may be disposed within the image sensor. The one or more optical filters may include at least one of a dual bandpass filter disposed above the second photodetector or a narrow bandpass filter disposed between the first photodetector and the second photodetector.
    Type: Application
    Filed: September 22, 2017
    Publication date: March 28, 2019
    Inventors: Biay-Cheng HSEIH, Todor Georgiev GEORGIEV, Jian MA, Sergiu GOMA
  • Patent number: 9986223
    Abstract: Certain aspects relate to systems and techniques for folded optic stereoscopic imaging, wherein a number of folded optic paths each direct a different one of a corresponding number of stereoscopic images toward a portion of a single image sensor. Each folded optic path can include a set of optics including a first light folding surface positioned to receive light propagating from a scene along a first optical axis and redirect the light along a second optical axis, a second light folding surface positioned to redirect the light from the second optical axis to a third optical axis, and lens elements positioned along at least the first and second optical axes and including a first subset having telescopic optical characteristics and a second subset lengthening the optical path length. The sensor can be a three-dimensionally stacked backside illuminated sensor wafer and reconfigurable instruction cell array processing wafer that performs depth processing.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: May 29, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Sergiu Radu Goma, Todor Georgiev Georgiev, Biay-Cheng Hseih, Zheng-wu Li, Wen-Yu Sun