Patents by Inventor Bidyut K. Bhattacharyya

Bidyut K. Bhattacharyya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of attaching a die to a substrate using gold/silicon seed
    Patent number: 4771018
    Abstract: An improved method for eutectically bonding a silicon wafer onto a gold preform is described. A gold/silicon seed is placed on a pure gold preform. Then a die is placed onto the pure gold preform and the gold/silicon seed, wherein the seed acts as a catalyst to form an eutectic bond.
    Type: Grant
    Filed: March 19, 1987
    Date of Patent: September 13, 1988
    Assignee: Intel Corporation
    Inventors: Bidyut K. Bhattacharyya, Eric S. Tosaya