Abstract: A hearing system includes a hearing device, the hearing device comprising: an input module for providing a first input signal, the input module comprising a first microphone; a processor for processing the first input signal and providing a processor output signal based on the first input signal; and a receiver for providing an audio output signal based on the processor output signal; wherein the hearing system is configured to obtain a user input indicative of a change from a first primary setting to a first secondary setting of the hearing device, and wherein the hearing device, upon a detection of the change from the first primary setting to the first secondary setting, is configured to output a secondary audio output signal according to the first secondary setting.

Abstract: Disclosed herein are sanitary tools including a sanitary tool for opening a door, which sanitary tool may include: a housing: an arm capable of ingress into or egress from the housing, or both; and a cartridge removably coupled to the housing, the cartridge having a sanitizing portion capable of receiving sanitizing material and capable of being abutted against a portion of the arm.

Abstract: A hearing system includes a hearing device, the hearing device comprising: an input module for providing a first input signal, the input module comprising a first microphone; a processor for processing the first input signal and providing a processor output signal based on the first input signal; and a receiver for providing an audio output signal based on the processor output signal; wherein the hearing system is configured to obtain a user input indicative of a change from a first primary setting to a first secondary setting of the hearing device, and wherein the hearing device, upon a detection of the change from the first primary setting to the first secondary setting, is configured to output a secondary audio output signal according to the first secondary setting.

Abstract: A hearing system includes a hearing device, the hearing device comprising: an input module for providing a first input signal, the input module comprising a first microphone; a processor for processing the first input signal and providing a processor output signal based on the first input signal; and a receiver for providing an audio output signal based on the processor output signal; wherein the hearing system is configured to obtain a user input indicative of a change from a first primary setting to a first secondary setting of the hearing device, and wherein the hearing device, upon a detection of the change from the first primary setting to the first secondary setting, is configured to output a secondary audio output signal according to the first secondary setting.

Abstract: Disclosed herein are sanitary tools including a sanitary tool for opening a door, which sanitary tool may include: a housing: an arm capable of ingress into or egress from the housing, or both; and a cartridge removably coupled to the housing, the cartridge having a sanitizing portion capable of receiving sanitizing material and capable of being abutted against a portion of the arm.

Abstract: A hearing system includes a hearing device, the hearing device comprising: an input module for providing a first input signal, the input module comprising a first microphone; a processor for processing the first input signal and providing a processor output signal based on the first input signal; and a receiver for providing an audio output signal based on the processor output signal; wherein the hearing system is configured to obtain a user input indicative of a change from a first primary setting to a first secondary setting of the hearing device, and wherein the hearing device, upon a detection of the change from the first primary setting to the first secondary setting, is configured to output a secondary audio output signal according to the first secondary setting.

Abstract: A surface mounted LED package includes a pair of metal contact plates, an LED mounted to one (or both) metal contact plates, and glue encapsulating the LED and holding the LED and both metal contact plates together to form a LED package to be soldered to a motherboard. The contact plates have side notches and bottom recesses of various shapes and dimensions, as well as through holes extending through the entire width of the contact plates to facilitate the glue flow for filling out the side notches and bottom recesses for improved solidifying of the LED package. The contact plates have portions uncovered by the glue to provide extended areas for soldering to a motherboard.

Abstract: A package substrate having a chip on a substrate has a die pad on the substrate. The chip is attached on the die pad via ah adhesive. A plurality of gold contacts is distributed on the die pad for electrically connecting to the chip. A plurality of traces is distributed around the die pad to connect to the chip via wires. An adhesive dike is formed between the die pad and the traces to prevent the adhesive from flowing out of the die pad when the chip is attached on the die pad.

Abstract: The present invention provides a package structure of optical sensitive device. The package structure includes a silicon substrate, an optical sensitive device, a supporting pad, a transparent plate and a plurality of conductive wires. The optical sensitive device is positioned on the silicon substrate, and the transparent plate is fixedly positioned on the supporting pad and corresponds to the optical sensitive area of the optical sensitive device. The transparent plate can be positioned on the substrate, and the electrical wires are electrically connected between the optical sensitive device and the substrate.

Abstract: A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue on an insulating substrate.

Abstract: A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue on an insulating substrate.

Abstract: A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue.

Abstract: Surface mount diodes are mass produced by first cutting a metal plate to form a plurality of vertical slits within metal plate. Parallel lines are cut midway between the slits to form wings for the slits. The wings are folded to form the bottoms for surface mounting. Glue is applied over the metal plate to form focusing cups.

Abstract: The bottom metal contacts of a surface mount LED are extended wider than the glue covering the LED. The extensions provide more area for soldering to a motherboard.

Abstract: The focusing cup of a LED package is coated exteriorly with or made of opaque material to reduce the spurious external light interference due to the reflections of the surfaces of focusing cup.

Abstract: A surface-mount package for multiple LED chips is constructed by inscribing a groove in an insulating substrate. The LED chips are mounted in the groove and the leads are connected to metal plates, which wrap around the substrate to provide bottom contacts for surface-mounting.

Abstract: A focusing cup is directly glued to two or more preformed folded metal frames. Parts of the top surfaces of the folded metal frames contact the electrodes of semiconductor device placed inside the focusing cup. The bottoms of the metallic frames serve as the bottom contacts for surface mounting to a motherboard. The preformed metallic frames need not withstand the stress of folding and the package can be made thinner than prior art. The elimination of the through holes makes the package narrower. The bottoms of the metallic frames can be aligned one side of the bottom surface of the package, so that the package can be surface-mounted normally to or in parallel with a motherboard with light emitting respectively in parallel with or normally to the surface of the motherboard.

Abstract: The leads of a light emitting device package are extended is flexible pins. These pins can be bent with respect to a motherboard so that the direction of the light entitled from the light emitting device can be adjusted. The package is tab-mounted to the motherboard for heat sinking or serving as a lead.

Abstract: The bottom metal contacts of a surface mount LED are extended wider than the glue covering the LED. The extensions provide more area for soldering to a motherboard.

Abstract: In a surface mount LED chips mounted on an insulating substrate, plated through conduits to interconnect the chips on both sides are placed at the corners of the outer terminals at two horizontal ends. The depressions caused by wire-bonding the chip to the terminals are lined up vertically with the corner conduits to reduce horizontal dimension.