Abstract: A method or process for making polycrystalline diamond or polycrystalline CBN cutting tools (Superabrasives), which have integral chip-breaking features is disclosed. This method involves pressing a die or other like rigid component against either the outer can cover or the diamond or CBN region directly. This invention provides economical manufacture of diamond chip-breaker tools, while avoiding unnecessary EDM EDG, grinding, or laser processes. This process forms the chip-breaker on the upper surface of the diamond region, during or prior to sintering. This invention permits a wide variety of chip-breaker or other diamond surface features, while minimizing cost and processing steps. Disclosed embodiments include: pressing through the can assembly; pressing within the assembly by introducing a rigid component in the can; and pressing two cans together with an intervening rigid component imposing the desired diamond surface features.

Abstract: Prosthetic joints, components for prosthetic joints, superhard bearing and articulation surfaces, diamond bearing and articulation surfaces, substrate surface topographical features, materials for making joints, bearing and articulation surfaces, and methods for manufacturing and finishing the same, and related information are disclosed, including a prosthetic hip joint having sintered polycrystalline diamond articulation.

Abstract: A prosthetic joint with polycrystalline diamond compact coated interfaces and a method for making the same are disclosed. The prosthetic joint has a diamond layer formed on at least one of the interacting, load-bearing surfaces of the joint. The diamond layer adds resistance to damage from impacts and, when polished, gives the joint a low coefficient of friction, thereby increasing the life of the joint. In accordance with one aspect of the invention, the diamond layer is formed of polycrystalline diamond compact having a common diamond particle diameter of less than 1 micron to further reduce friction.

Abstract: A prosthetic joint with polycrystalline diamond compact coated interfaces and a method for making the same are disclosed. The prosthetic joint has a diamond layer formed on at least one of the interacting, load-bearing surfaces of the joint. The diamond layer adds resistance to damage from impacts and, when polished, gives the joint a low coefficient of friction, thereby increasing the life of the joint. In accordance with one aspect of the invention, the diamond layer is formed of polycrystalline diamond compact having a common diamond particle diameter of less than 1 micron to further reduce friction.

Abstract: A cutting implement formed from a substrate of carbide, or other hard substance, bonded to a polycrystalline layer which serves as the cutting portion of the implement. The interface between the substrate and polycrystalline layer is defined by surface topography with radially spaced-apart protuberances and depressions forming smooth transitional surfaces.

Abstract: A high thermal conductivity substrate is formed by making a sintered diamond composite and thereafter modifying the electrical properties of the composite by leaching graphite and other non-diamond materials from the composite and subsequently infusing the leached composite with material having known electrical properties. Alternatively, a diamond composite having high thermal conductivity known electrical properties if prepared and subsequently leached to remove graphite and other materials which interfere with the known electrical properties of the composite material.

Abstract: A high thermal conductivity substrate is formed by making a sintered diamond composite and thereafter modifying the electrical properties of the composite by leaching graphite and other non-diamond materials from the composite and subsequently infusing the leached composite with material having known electrical properties. Alternatively, a diamond composite having high thermal conductivity known electrical properties is prepared and subsequently leached to remove graphite and other materials which interfere with the known electrical properties of the composite material.