Patents by Inventor Bill Weng

Bill Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition and application thereof
    Patent number: 7786029
    Abstract: A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: August 31, 2010
    Assignee: ITEQ Corporation
    Inventors: Li-Chun Chen, Jeng-I Chen, Bill Weng
  • RESIN COMPOSITION AND APPLICATION THEREOF
    Publication number: 20090176104
    Abstract: A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.
    Type: Application
    Filed: January 5, 2009
    Publication date: July 9, 2009
    Inventors: Li-Chun CHEN, Jeng-I Chen, Bill Weng