Patents by Inventor Billy R. Bodiford

Billy R. Bodiford has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230407071
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Application
    Filed: August 29, 2023
    Publication date: December 21, 2023
    Inventors: Billy R. Bodiford, Ross Michael Mahan
  • Patent number: 11781000
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: October 10, 2023
    Assignee: INV Polypropylene, LLC
    Inventors: Billy R. Bodiford, Ross Michael Mahan
  • Publication number: 20230057559
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Application
    Filed: October 13, 2022
    Publication date: February 23, 2023
    Applicant: INV Polypropylene, LLC
    Inventors: Billy R. BODIFORD, Ross Michael MAHAN
  • Patent number: 11512193
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: November 29, 2022
    Inventors: Ross Michael Mahan, Billy R. Bodiford
  • Publication number: 20210206954
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Application
    Filed: December 11, 2020
    Publication date: July 8, 2021
    Inventors: Ross Michael Mahan, Billy R. Bodiford
  • Patent number: 10150858
    Abstract: Blended compositions that can include one or more thermoplastic polymers and one or more organic fillers and methods for making and using same. The blended composition can have a Notched Izod Impact Strength of at least 20 J/m to about 600 J/m, measured according to ASTM D256-10, and a melt index of about 1 g/10 min to about 100 g/10 min, measured according to ASTM D1238-13, procedure B. The thermoplastic copolymer can include a blend of a polypropylene homopolymer and a copolymer of propylene and a comonomer. The comonomer can include ethylene, a C4 to C20 olefin, or any mixture thereof. The copolymer of propylene and the comonomer can include about 0.5 wt % to about 40 wt % of the comonomer. The blended composition can include about 5 wt % to about 30 wt % of the organic filler based on the combined weight of the thermoplastic copolymer and the organic filler.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: December 11, 2018
    Assignee: Flint Hills Resources, LP
    Inventors: Thoi H. Ho, Pierre Donaldson, Billy R. Bodiford, Steve Hooker, Mark Wolverton
  • Publication number: 20160347945
    Abstract: Blended compositions that can include one or more thermoplastic polymers and one or more organic fillers and methods for making and using same. The blended composition can have a Notched Izod Impact Strength of at least 20 J/m to about 600 J/m, measured according to ASTM D256-10, and a melt index of about 1 g/10 min to about 100 g/10 min, measured according to ASTM D1238-13, procedure B. The thermoplastic copolymer can include a blend of a polypropylene homopolymer and a copolymer of propylene and a comonomer. The comonomer can include ethylene, a C4 to C20 olefin, or any mixture thereof. The copolymer of propylene and the comonomer can include about 0.5 wt % to about 40 wt % of the comonomer. The blended composition can include about 5 wt % to about 30 wt % of the organic filler based on the combined weight of the thermoplastic copolymer and the organic filler.
    Type: Application
    Filed: February 11, 2015
    Publication date: December 1, 2016
    Applicant: Flint Hills Resources, LP
    Inventors: Thoi H. Ho, Pierre Donaldson, Billy R. Bodiford, Steve Hooker, Mark Wolverton