Abstract: A bend correction apparatus for bending a workpiece subject to springback, the apparatus having a pressure die for holding a workpiece, a radius die for providing a radius form about which the workpiece is bent, and a clamping die for engaging and bending the workpiece relative to the pressure die and about a portion of the radius die. A microprocessor moves the clamping die between a bend angle position in which the workpiece is bent about the radius die to a predetermined angle relative to the clamping die and a relieved position in which the clamping die is not bending the workpiece. A sensor, movable conjointly with the radius die, engages the workpiece in a springback position upon rotation of the radius die toward the workpiece and sends a signal to the microprocessor upon contact with the workpiece.