Abstract: The present application provides a comfortable lightweight bullet-proof and stab-resistant suit and a preparation method thereof. A first aspect of the present application provides a comfortable lightweight bullet-proof and stab-resistant suit, including a sheath and a protection core sheet disposed in the sheath, and the protection core sheet includes a first protection layer, a second protection layer, a third protection layer and a buffer layer which are sequentially stacked together. The bullet-proof and stab-resistant suit provided in the present application has better response protection characteristics in the process of bullet penetration or knife tip stab, and the prepared aramid unidirectional cloth has low areal density, apparent flatness, no bubbles, and excellent softness, so that any bending within 180° can be realized.

Abstract: A method for locating a fault of a server includes: physically connecting a GPIO pin of a BMC to a GPIO pin of target hardware in advance; reading a current state value of the GPIO signal of the target hardware in a power-on and activation process of a mainboard, and loading a corresponding version of the firmware according to the current state value and the condition for switching; and in response to determining that the corresponding version of the firmware is the debug version, outputting serial port log information of the debug version to the BMC, and in response to determining that the corresponding version of the firmware is the release version, determining whether to change the state value of the GPIO signal on a connection between the BMC and the target hardware according to a preset normal activation condition and a system event log.

Abstract: The present invention provides a printed circuit board (PCB) board, a core for manufacturing the PCB board and a method for manufacturing the PCB board. The PCB board is in a shape of a rectangle and comprises a fiber layer formed of interlacedly weaved fiberglasses, a metal layer affixed onto a surface of the fiber layer, and a pair of differential signal traces formed on the metal layer, wherein extending directions of the fiberglasses lie at acute angles with respect to a length direction of the rectangle, and the pair of differential signal traces extends along a width direction or the length direction of the rectangle. The PCB board can effectively reduce the possibility of the skew distortion during the transmitting process of the differential signal through adjusting the angle between the fiberglasses and the edge of the core without adjusting or redesigning the original circuit layout.

Abstract: A printed circuit board, an in-circuit test structure and a method for producing the in-circuit test structure thereof are disclosed. The in-circuit test structure comprises a via and a test pad. The via passes through the printed circuit board for communicating with an electrical device to be tested on the printed circuit board. The test pad is formed on an upper surface of the printed circuit board and covering the via, wherein a center of the via deviates from a center of the test pad. In the in-circuit test, the accuracy of the test data can be improved by means of the in-circuit test structure provided by the present invention, and thus the reliability of the test result is ensured. Also, the test efficiency of the in-circuit test is improved.

Abstract: The present invention provides a printed circuit board (PCB) board, a core for manufacturing the PCB board and a method for manufacturing the PCB board. The PCB board is in a shape of a rectangle and comprises a fiber layer formed of interlacedly weaved fiberglasses, a metal layer affixed onto a surface of the fiber layer, and a pair of differential signal traces formed on the metal layer, wherein extending directions of the fiberglasses lie at acute angles with respect to a length direction of the rectangle, and the pair of differential signal traces extends along a width direction or the length direction of the rectangle. The PCB board can effectively reduce the possibility of the skew distortion during the transmitting process of the differential signal through adjusting the angle between the fiberglasses and the edge of the core without adjusting or redesigning the original circuit layout.

Abstract: An exemplary backlight module (20) includes a light guide plate (21), a plurality of point light sources (22), and a transparent light diffusing element (23). The light guide plate includes a light incident surface (211). The point light sources are positioned adjacent to the light incident surface. The light diffusing element is positioned between the point light sources and has a light incident surface. The light diffusing element includes a plurality of recesses (231) which face the light incident surface and correspond to the point light sources. The light diffusing element can diffuse light from the point light sources, therefore increasing emitting angles of the point light sources. The recesses of the light diffusing element can make light from the point light sources more uniform.