Patents by Inventor Bing Dang
Bing Dang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11424152Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.Type: GrantFiled: February 3, 2020Date of Patent: August 23, 2022Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Kang-I Tsang
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Publication number: 20220248958Abstract: A system for interfacing an in-body medical device with an external network includes a subdermal wideband on-body network (WON) hub, which in turn includes a hub rechargeable battery, a hub processor coupled to the hub rechargeable battery, a device interface configured to communicate with the in-body medical device, and coupled to the hub processor, and a hub-satellite near field communications wireless interface coupled to the hub processor. The system also includes a wearable WON server that in turn includes a server processor, a server-satellite interface coupled to the server processor, and an external network interface coupled to the server processor.Type: ApplicationFiled: February 10, 2021Publication date: August 11, 2022Inventors: Bo Wen, Bing Dang, Jeffrey L. Rogers, Duixian Liu
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Patent number: 11411272Abstract: A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.Type: GrantFiled: November 13, 2017Date of Patent: August 9, 2022Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath Narasgond, Bucknell C. Webb
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Publication number: 20220200086Abstract: A method of manufacturing a micro-battery is provided. The method includes forming a micro-battery device by forming a first metal anode via and a first metal cathode via in a first substrate, forming a first metal layer on a bottom side of the first substrate, forming a first battery element on a top side of the substrate, forming an encapsulation layer around the first battery element, forming trenches through the encapsulation layer and the first substrate on different sides of the first battery element, and forming a metal sealing layer in the trenches to cover at least a plurality of sidewall surfaces of the first battery element. The metal sealing layer is electrically connected to the battery element through the first metal layer and the first metal cathode via.Type: ApplicationFiled: December 21, 2020Publication date: June 23, 2022Inventors: Qianwen Chen, Jae-Woong Nah, Bing Dang, Leanna Pancoast, John Knickerbocker
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Publication number: 20220199235Abstract: A mechanism is provided in a data processing system to implement a multi-sensor health monitoring platform. The mechanism applies a machine learning model to predict patient needs and patient activity trends based on physiological features and activity features of the patient. The mechanism applies the machine learning model to predict energy requirements for a plurality of medical sensors based on the predicted patient needs and patient activity trends. The mechanism schedules recharging of the plurality of medical sensors based on the predicted energy requirements and identifying one or more sensors to set to an activate state based on the predicted patient needs and patient activity trends. The mechanism collecting sensor data from the one or more sensors and applies the machine learning model to generate a point-of-care recommendation based on the collected sensor data.Type: ApplicationFiled: December 22, 2020Publication date: June 23, 2022Inventors: John Knickerbocker, Bing Dang, Qianwen Chen, Leanna Pancoast
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Patent number: 11362382Abstract: A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.Type: GrantFiled: January 26, 2017Date of Patent: June 14, 2022Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath Narasgond, Bucknell C. Webb
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Patent number: 11348833Abstract: A support structure for use in fan-out wafer level packaging is provided that includes, a silicon handler wafer having a first surface and a second surface opposite the first surface, a release layer is located above the first surface of the silicon handler wafer, and a layer selected from the group consisting of an adhesive layer and a redistribution layer is located on a surface of the release layer. After building-up a fan-out wafer level package on the support structure, infrared radiation is employed to remove (via laser ablation) the release layer, and thus remove the silicon handler wafer from the fan-out wafer level package.Type: GrantFiled: November 25, 2019Date of Patent: May 31, 2022Assignee: International Business Machines CorporationInventors: Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker
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Patent number: 11342108Abstract: Techniques regarding one or more NFC antennas that can comprise vertically stacked coils of electrically conductive material are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise can a first substrate layer that can comprise a first coil of electrically conductive material that can be wound in a first direction. The apparatus can also comprise a second substrate layer that can comprise a second coil of electrically conductive material that can be wound in a second direction opposite the first direction. The first substrate layer can be stacked onto the second substrate layer. Also, the first coil of electrically conductive material can be operably coupled to the second coil of electrically conductive material through an interconnection via to form an NFC antenna.Type: GrantFiled: May 11, 2018Date of Patent: May 24, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bo Wen, Bing Dang, Rajeev Narayanan
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Publication number: 20220142571Abstract: Embodiments of the present invention provide an oral device. According to one embodiment of the present invention, a mouthpiece suitable to detachably engage teeth of an upper jaw is provided. The mouthpiece comprises an adhesive layer configured to attach a hermetically sealed chamber to the mouthpiece. The hermitically sealed chamber fits within a concave space created by the mouthpiece. The hermitically sealed chamber comprises two layers and embedded between those two layers are a pressure sensor, a microphone, an optical sensor, a temperature sensor, a communications module, a storage enclosure, and a biosensor. Each of the pressure sensor, the microphone, the optical sensor, the temperature sensor, the communications module, the storage enclosure, and the biosensor are operably connected within the hermetically sealed chamber.Type: ApplicationFiled: November 11, 2020Publication date: May 12, 2022Inventors: Bing Dang, RAJEEV NARAYANAN, JEFFREY L. ROGERS
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Patent number: 11222862Abstract: Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 ?m to about 100 ?m, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.Type: GrantFiled: October 21, 2019Date of Patent: January 11, 2022Assignee: International Business Machines CorporationInventors: Qianwen Chen, Bing Dang, Russell Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah, John Knickerbocker
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Patent number: 11201138Abstract: A method of manufacturing a multi-layer wafer is provided. Under bump metallization (UMB) pads are created on each of two heterogeneous wafers. A conductive means is applied above the UMB pads on at least one of the two heterogeneous wafers. The two heterogeneous wafers are low temperature bonded to adhere the UMB pads together via the conductive means. At least one stress compensating polymer layer may be applied to at least one of two heterogeneous wafers. The stress compensating polymer layer has a polymer composition of a molecular weight polymethylmethacrylate polymer at a level of 10-50% with added liquid multifunctional acrylates forming the remaining 50-90% of the polymer composition.Type: GrantFiled: December 17, 2019Date of Patent: December 14, 2021Assignee: International Business Machines CorporationInventors: Bing Dang, Li-Wen Hung, John U. Knickerbocker, Jae-Woong Nah
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Publication number: 20210366789Abstract: One or more die stacks are disposed on a redistribution layer (RDL) to make an electronic package. The die stacks include a die and one or more Through Silicon Via (TSV) dies. Other components and/or layers, e.g. interposes layers, can be included in the structure. An epoxy layer disposed on the RDL top surface and surrounds and attached to all the TSV die sides and all the die sides. Testing circuitry is located in various locations in some embodiments. Locations including in the handler, die, TSV dies, interposes, etc. Testing methods are disclosed, Methods of making including “die first” and “die last” methods are also disclosed. Methods of making heterogenous integrated structure and the resulting structures are also disclosed, particularly for large scale, e.g. wafer and panel size, applications.Type: ApplicationFiled: May 25, 2020Publication date: November 25, 2021Inventors: John Knickerbocker, Bing Dang, Qianwen Chen, Joshua M. Rubin, Arvind Kumar
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Publication number: 20210353219Abstract: A sleeping mask includes a signal processor for processing sensor data, an infrared light source coupled to the signal processor and configured to emit infrared light toward an eyelid of a user, and an array of infrared sensors coupled to the signal processor and configured to receive infrared light reflected from the eyelid of the user.Type: ApplicationFiled: May 14, 2020Publication date: November 18, 2021Inventors: RAJEEV NARAYANAN, BING DANG, JENNA REINEN, JEFFREY L. ROGERS
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Patent number: 11171374Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.Type: GrantFiled: December 14, 2017Date of Patent: November 9, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Qianwen Chen, Bing Dang, John Knickerbocker, Bo Wen
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Publication number: 20210288022Abstract: An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.Type: ApplicationFiled: May 31, 2021Publication date: September 16, 2021Inventors: William EMMETT BERNIER, BING DANG, JOHN KNICKERBOCKER, SON KIM TRAN, Mario J. Interrante
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Patent number: 11121005Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.Type: GrantFiled: January 31, 2020Date of Patent: September 14, 2021Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
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Publication number: 20210280834Abstract: Microbatteries and methods for forming microbatteries are provided. The microbatteries and methods address at least one or both of edge sealing issues for edges of a stack forming part of a microbatteries and overall sealing for individual cells for microbatteries in a batch process. A transferable solder molding apparatus and sealing structure are proposed in an example to provide a metal casing for a solid-state thin-film microbattery. An exemplary proposed process involves deposition or pre-forming low-temperature solder casing separately from the microbatteries. Then a thermal compression may be used to transfer the solder casing to each battery cell, with a handler apparatus in a batch process in an example. These exemplary embodiments can address the temperature tolerance constrain for solid state thin film battery during handling, metal sealing, and packaging.Type: ApplicationFiled: March 9, 2020Publication date: September 9, 2021Inventors: Bing Dang, Leanna Pancoast, Jae-Woong Nah, John Knickerbocker
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Publication number: 20210265606Abstract: Thin Film Batteries are made of battery layers. Each battery layer has a substrate with one or more battery structures on the substrate surface. The battery structures have a first electrode connection and a second electrode, a first electrode (e.g. a cathode or anode) is electrically connected to the first electrode connection and a second electrode (e.g. an anode or cathode) is electrically connected to the second electrode connection. An electrolyte is at least partial disposed between and electrically connected to the first and second electrodes. A first edge connection on one of the substrate edges is physically and electrically connected to the first electrode connection. A second edge connection on one of the substrate edges is physically and electrically connected to the second electrode connection. An electrically insulating lamination is disposed on the substrate and covers the components except for the first and second edge connections, connected to respective battery electrodes.Type: ApplicationFiled: February 20, 2020Publication date: August 26, 2021Inventors: Bing Dang, John Knickerbocker, Qianwen Chen
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Patent number: 11101513Abstract: Techniques regarding a thin film battery, which can comprise one or more sealing layers, and a method of manufacturing thereof are provided. For example, one or more embodiments described herein can regard an apparatus that can comprise a thin film battery cell encapsulated in a multi-layer stack comprising an adhesive layer located between a first substrate layer and a second substrate layer. The apparatus can also comprise a metal sealing layer at least partially surrounding the multi-layer stack.Type: GrantFiled: September 4, 2018Date of Patent: August 24, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Qianwen Chen, Bing Dang, Bo Wen, Marlon Agno, John Knickerbocker
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Patent number: 11094407Abstract: A drug delivery form includes a drug and electronics. The electronics includes memory(ies) having drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The electronics includes communication circuitry configured to read data from and write data to the drug delivery form information. An apparatus includes memory(ies) having computer readable code, and processor(s). The processor(s) cause the apparatus to perform operations including communicating with a drug delivery form including a drug and drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The processor(s) cause the apparatus to perform reading data from or writing data into the drug and drug delivery form information.Type: GrantFiled: June 13, 2019Date of Patent: August 17, 2021Assignee: International Business Machines CorporationInventors: John Knickerbocker, Li-Wen Hung, Bing Dang, Katsuyuki Sakuma, Jeffrey Donald Gelorme, Rajeev Narayanan, Qianwen Chen