Patents by Inventor Binghua Pan

Binghua Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220068753
    Abstract: An automotive power package includes a heat sink layer fabricated onto at least one surface of the automotive power package. The heat sink layer includes a material having a thermal conductivity higher than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.
    Type: Application
    Filed: August 28, 2020
    Publication date: March 3, 2022
    Inventors: Binghua PAN, Wai Kwan WONG, David W. IHMS
  • Patent number: 10830887
    Abstract: An illustrative example sensor device includes a plurality of range finders that each have an emitter configured to emit a selected type of radiation and a detector configured to detect the selected type of radiation reflected from an object. A plurality of cameras are configured to generate an image of an object based upon receiving the selected type of radiation from the object. A processor is configured to determine a distance between the sensor device and an object based on at least two of the images, wherein the images are each from a different camera.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: November 10, 2020
    Assignee: Aptiv Technologies Limited
    Inventors: Yew Kwang Low, Kok Wee Yeo, Binghua Pan, Ronald M. Taylor, Ward K. Everly
  • Publication number: 20190227168
    Abstract: An illustrative example sensor device includes a plurality of range finders that each have an emitter configured to emit a selected type of radiation and a detector configured to detect the selected type of radiation reflected from an object. A plurality of cameras are configured to generate an image of an object based upon receiving the selected type of radiation from the object. A processor is configured to determine a distance between the sensor device and an object based on at least two of the images, wherein the images are each from a different camera.
    Type: Application
    Filed: January 23, 2018
    Publication date: July 25, 2019
    Inventors: Yew Kwang Low, Kok Wee Yeo, Binghua Pan, Ronald M. Taylor, Ward K. Everly
  • Patent number: 10351103
    Abstract: An illustrative example embodiment of a detector device includes a sensor portion that is configured to at least emit or receive a first type of radiation. A cover near the sensor portion is transparent to the first type of radiation to allow the first type of radiation to pass through the cover. A radiation source emits a second, different type of radiation. A plurality of reflecting surfaces are transparent to the first type of radiation and at least partially opaque to the second type of radiation to at least partially reflect the second type of radiation into the cover to increase a temperature of at least a portion of the cover.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: July 16, 2019
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: Kok Wee Yeo, Yew Kwang Low, Binghua Pan
  • Publication number: 20190100167
    Abstract: An illustrative example embodiment of a detector device includes a sensor portion that is configured to at least emit or receive a first type of radiation. A cover near the sensor portion is transparent to the first type of radiation to allow the first type of radiation to pass through the cover. A radiation source emits a second, different type of radiation. A plurality of reflecting surfaces are transparent to the first type of radiation and at least partially opaque to the second type of radiation to at least partially reflect the second type of radiation into the cover to increase a temperature of at least a portion of the cover.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: Kok Wee Yeo, Yew Kwang Low, Binghua Pan
  • Publication number: 20160006908
    Abstract: A molded camera suitable for use on a vehicle to capture an image of a field-of-view about the vehicle includes a circuit board assembly, a pigtail connector, an imager device, a lens assembly, and a polymeric compound. The pigtail connector is attached to the circuit board assembly. The imager device is attached to the circuit board assembly. The lens assembly is configured to focus the image of the field-of-view about the vehicle on the imager device. The polymeric compound is configured to encapsulate the circuit board assembly, seal/protect the molded camera and define an external portion of an exterior surface of the molded camera.
    Type: Application
    Filed: July 3, 2014
    Publication date: January 7, 2016
    Inventors: BINGHUA PAN, YEW KWANG LOW, SIM YING YONG, LAY BOON ONG, ZHIWU ZHANG
  • Patent number: 9231124
    Abstract: An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: January 5, 2016
    Assignee: Delphi Technologies, Inc.
    Inventors: Binghua Pan, Yew Kwang Low, Sim Ying Yong
  • Publication number: 20150084150
    Abstract: An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 26, 2015
    Inventors: BINGHUA PAN, YEW KWANG LOW, SIM YING YONG
  • Publication number: 20110037530
    Abstract: A stripline to waveguide transition is provided that includes a shielded stripline having a transmission line in a dielectric, between two ground planes. The transition includes a stripline patch electrically coupled to the transmission line within an opening of the first ground plane and a stripline impedance matching transformer. The transition further includes a waveguide comprising a waveguide wall defining a waveguide opening. The waveguide is arranged substantially perpendicular to the patch, and the waveguide opening is aligned with an opening in the first ground plane. The electric field of the stripline transitions to a transverse electric propagation in the waveguide. The transition may be integrated with a transceiver and antenna.
    Type: Application
    Filed: August 11, 2009
    Publication date: February 17, 2011
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: Sankara N. Mangalahgari, Kiat C. Teo, Binghua Pan, Wun Leng Lee
  • Patent number: 7453154
    Abstract: An electronic device that facilitates improved electrical and thermal performance and/or allows fabrication of smaller electronic devices exhibiting excellent performance characteristics, especially for devices operating at microwave frequencies, includes an input/output pad, and a carbon nanotube extending from the input/output pad to provide wafer-level nano-interconnect for flip chip interconnections and die stacking on a substrate.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: November 18, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Kiat Choon Teo, Wai Kwan Wong, Binghua Pan
  • Patent number: 7324715
    Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: January 29, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Tecktiong Tan, Binghua Pan, Jeffrey H. Burns, Arun K. Chaudhuri, John R. Troxell, Su Liang Chan
  • Patent number: 7294827
    Abstract: An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: November 13, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Teck Tiong Tan, Binghua Pan, Jeffrey H. Burns, John R. Troxell
  • Publication number: 20070228926
    Abstract: An electronic device that facilitates improved electrical and thermal performance and/or allows fabrication of smaller electronic devices exhibiting excellent performance characteristics, especially for devices operating at microwave frequencies, includes an input/output pad, and a carbon nanotube extending from the input/output pad to provide wafer-level nano-interconnect for flip chip interconnections and die stacking on a substrate.
    Type: Application
    Filed: March 29, 2006
    Publication date: October 4, 2007
    Inventors: Kiat Teo, Wai Wong, Binghua Pan
  • Publication number: 20070119911
    Abstract: A composite standoff is formed on a circuit board during the processing of the circuit board while an array of electrical circuit traces including contact pads are formed, portions of the electrical circuit traces are covered by a solder mask, and legend ink is applied to the circuit board for locating electronic components on the circuit board without any need for an additional step.
    Type: Application
    Filed: November 28, 2005
    Publication date: May 31, 2007
    Inventors: Su Chan, Binghua Pan, Cheng Cheok, Chih Nah, Robert Schofield, Mahesh Chengalva
  • Patent number: 7148554
    Abstract: An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: December 12, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Chih Kai Nah, Morris D Stillabower, Binghua Pan, Sim Ying Yong, Przemyslaw Gromala
  • Publication number: 20060131732
    Abstract: An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.
    Type: Application
    Filed: December 16, 2004
    Publication date: June 22, 2006
    Inventors: Chih Nah, Morris Stillabower, Binghua Pan, Sim Yong, Przemyslaw Gromala
  • Publication number: 20060061889
    Abstract: An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.
    Type: Application
    Filed: September 21, 2004
    Publication date: March 23, 2006
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: Tech Tiong Tan, Binghua Pan, Jeffrey Burns, John Troxell
  • Publication number: 20040114851
    Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.
    Type: Application
    Filed: December 12, 2002
    Publication date: June 17, 2004
    Inventors: Tecktiong Tan, Binghua Pan, Jeffrey H. Burns, Arun K. Chaudhuri, John R. Troxell, Su Liang Chan