Patents by Inventor Binghua Pan
Binghua Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220068753Abstract: An automotive power package includes a heat sink layer fabricated onto at least one surface of the automotive power package. The heat sink layer includes a material having a thermal conductivity higher than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.Type: ApplicationFiled: August 28, 2020Publication date: March 3, 2022Inventors: Binghua PAN, Wai Kwan WONG, David W. IHMS
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Patent number: 10830887Abstract: An illustrative example sensor device includes a plurality of range finders that each have an emitter configured to emit a selected type of radiation and a detector configured to detect the selected type of radiation reflected from an object. A plurality of cameras are configured to generate an image of an object based upon receiving the selected type of radiation from the object. A processor is configured to determine a distance between the sensor device and an object based on at least two of the images, wherein the images are each from a different camera.Type: GrantFiled: January 23, 2018Date of Patent: November 10, 2020Assignee: Aptiv Technologies LimitedInventors: Yew Kwang Low, Kok Wee Yeo, Binghua Pan, Ronald M. Taylor, Ward K. Everly
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Publication number: 20190227168Abstract: An illustrative example sensor device includes a plurality of range finders that each have an emitter configured to emit a selected type of radiation and a detector configured to detect the selected type of radiation reflected from an object. A plurality of cameras are configured to generate an image of an object based upon receiving the selected type of radiation from the object. A processor is configured to determine a distance between the sensor device and an object based on at least two of the images, wherein the images are each from a different camera.Type: ApplicationFiled: January 23, 2018Publication date: July 25, 2019Inventors: Yew Kwang Low, Kok Wee Yeo, Binghua Pan, Ronald M. Taylor, Ward K. Everly
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Patent number: 10351103Abstract: An illustrative example embodiment of a detector device includes a sensor portion that is configured to at least emit or receive a first type of radiation. A cover near the sensor portion is transparent to the first type of radiation to allow the first type of radiation to pass through the cover. A radiation source emits a second, different type of radiation. A plurality of reflecting surfaces are transparent to the first type of radiation and at least partially opaque to the second type of radiation to at least partially reflect the second type of radiation into the cover to increase a temperature of at least a portion of the cover.Type: GrantFiled: September 29, 2017Date of Patent: July 16, 2019Assignee: APTIV TECHNOLOGIES LIMITEDInventors: Kok Wee Yeo, Yew Kwang Low, Binghua Pan
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Publication number: 20190100167Abstract: An illustrative example embodiment of a detector device includes a sensor portion that is configured to at least emit or receive a first type of radiation. A cover near the sensor portion is transparent to the first type of radiation to allow the first type of radiation to pass through the cover. A radiation source emits a second, different type of radiation. A plurality of reflecting surfaces are transparent to the first type of radiation and at least partially opaque to the second type of radiation to at least partially reflect the second type of radiation into the cover to increase a temperature of at least a portion of the cover.Type: ApplicationFiled: September 29, 2017Publication date: April 4, 2019Inventors: Kok Wee Yeo, Yew Kwang Low, Binghua Pan
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Publication number: 20160006908Abstract: A molded camera suitable for use on a vehicle to capture an image of a field-of-view about the vehicle includes a circuit board assembly, a pigtail connector, an imager device, a lens assembly, and a polymeric compound. The pigtail connector is attached to the circuit board assembly. The imager device is attached to the circuit board assembly. The lens assembly is configured to focus the image of the field-of-view about the vehicle on the imager device. The polymeric compound is configured to encapsulate the circuit board assembly, seal/protect the molded camera and define an external portion of an exterior surface of the molded camera.Type: ApplicationFiled: July 3, 2014Publication date: January 7, 2016Inventors: BINGHUA PAN, YEW KWANG LOW, SIM YING YONG, LAY BOON ONG, ZHIWU ZHANG
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Patent number: 9231124Abstract: An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink.Type: GrantFiled: September 25, 2013Date of Patent: January 5, 2016Assignee: Delphi Technologies, Inc.Inventors: Binghua Pan, Yew Kwang Low, Sim Ying Yong
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Publication number: 20150084150Abstract: An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink.Type: ApplicationFiled: September 25, 2013Publication date: March 26, 2015Inventors: BINGHUA PAN, YEW KWANG LOW, SIM YING YONG
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Publication number: 20110037530Abstract: A stripline to waveguide transition is provided that includes a shielded stripline having a transmission line in a dielectric, between two ground planes. The transition includes a stripline patch electrically coupled to the transmission line within an opening of the first ground plane and a stripline impedance matching transformer. The transition further includes a waveguide comprising a waveguide wall defining a waveguide opening. The waveguide is arranged substantially perpendicular to the patch, and the waveguide opening is aligned with an opening in the first ground plane. The electric field of the stripline transitions to a transverse electric propagation in the waveguide. The transition may be integrated with a transceiver and antenna.Type: ApplicationFiled: August 11, 2009Publication date: February 17, 2011Applicant: DELPHI TECHNOLOGIES, INC.Inventors: Sankara N. Mangalahgari, Kiat C. Teo, Binghua Pan, Wun Leng Lee
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Patent number: 7453154Abstract: An electronic device that facilitates improved electrical and thermal performance and/or allows fabrication of smaller electronic devices exhibiting excellent performance characteristics, especially for devices operating at microwave frequencies, includes an input/output pad, and a carbon nanotube extending from the input/output pad to provide wafer-level nano-interconnect for flip chip interconnections and die stacking on a substrate.Type: GrantFiled: March 29, 2006Date of Patent: November 18, 2008Assignee: Delphi Technologies, Inc.Inventors: Kiat Choon Teo, Wai Kwan Wong, Binghua Pan
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Patent number: 7324715Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.Type: GrantFiled: December 12, 2002Date of Patent: January 29, 2008Assignee: Delphi Technologies, Inc.Inventors: Tecktiong Tan, Binghua Pan, Jeffrey H. Burns, Arun K. Chaudhuri, John R. Troxell, Su Liang Chan
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Patent number: 7294827Abstract: An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.Type: GrantFiled: September 21, 2004Date of Patent: November 13, 2007Assignee: Delphi Technologies, Inc.Inventors: Teck Tiong Tan, Binghua Pan, Jeffrey H. Burns, John R. Troxell
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Publication number: 20070228926Abstract: An electronic device that facilitates improved electrical and thermal performance and/or allows fabrication of smaller electronic devices exhibiting excellent performance characteristics, especially for devices operating at microwave frequencies, includes an input/output pad, and a carbon nanotube extending from the input/output pad to provide wafer-level nano-interconnect for flip chip interconnections and die stacking on a substrate.Type: ApplicationFiled: March 29, 2006Publication date: October 4, 2007Inventors: Kiat Teo, Wai Wong, Binghua Pan
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Publication number: 20070119911Abstract: A composite standoff is formed on a circuit board during the processing of the circuit board while an array of electrical circuit traces including contact pads are formed, portions of the electrical circuit traces are covered by a solder mask, and legend ink is applied to the circuit board for locating electronic components on the circuit board without any need for an additional step.Type: ApplicationFiled: November 28, 2005Publication date: May 31, 2007Inventors: Su Chan, Binghua Pan, Cheng Cheok, Chih Nah, Robert Schofield, Mahesh Chengalva
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Patent number: 7148554Abstract: An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.Type: GrantFiled: December 16, 2004Date of Patent: December 12, 2006Assignee: Delphi Technologies, Inc.Inventors: Chih Kai Nah, Morris D Stillabower, Binghua Pan, Sim Ying Yong, Przemyslaw Gromala
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Publication number: 20060131732Abstract: An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.Type: ApplicationFiled: December 16, 2004Publication date: June 22, 2006Inventors: Chih Nah, Morris Stillabower, Binghua Pan, Sim Yong, Przemyslaw Gromala
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Publication number: 20060061889Abstract: An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.Type: ApplicationFiled: September 21, 2004Publication date: March 23, 2006Applicant: DELPHI TECHNOLOGIES, INC.Inventors: Tech Tiong Tan, Binghua Pan, Jeffrey Burns, John Troxell
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Publication number: 20040114851Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.Type: ApplicationFiled: December 12, 2002Publication date: June 17, 2004Inventors: Tecktiong Tan, Binghua Pan, Jeffrey H. Burns, Arun K. Chaudhuri, John R. Troxell, Su Liang Chan