Patents by Inventor Binhao Wang

Binhao Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11588298
    Abstract: Coupled-cavity vertical cavity surface emitting lasers (VCSELs) are provided by the present disclosure. The coupled-cavity VCSEL can comprise a VCSEL having a first mirror, a gain medium disposed above the first mirror, and a second mirror disposed above the gain medium, wherein a first cavity is formed by the first mirror and the second mirror. A second cavity is optically coupled to the VCSEL and configured to reflect light emitted from the VCSEL back into the first cavity of the VCSEL. In some embodiments, the second cavity can be an external cavity optically coupled to the VCSEL through a coupling component. In some embodiments, the second cavity can be integrated with the VCSEL to form a monolithic coupled-cavity VCSEL. A feedback circuit can control operation of the coupled-cavity VCSEL so the output comprises a target high frequency signal.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: February 21, 2023
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Stanley Cheung, Michael Renne Ty Tan, Binhao Wang, Wayne Victor Sorin, Chao-Kun Lin
  • Patent number: 11437323
    Abstract: A silicon interposer may include an on-chip DC blocking capacitor, comprising: a first electrical connection to couple to a supply voltage and to cathodes of a plurality of photodiodes formed in a two-dimensional photodiode array on a first substrate, and a second electrical connection to couple to ground and to ground inputs of a plurality of transimpedance amplifiers on a second substrate; wherein the on-chip DC blocking capacitor is configured to be shared among a plurality of receiver circuits comprising the plurality of photodiodes and the plurality of transimpedance amplifiers; and wherein the silicon interposer comprises a substrate separate from the first substrate and the second substrate.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: September 6, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Binhao Wang, Wayne Victor Sorin, Michael Renne Ty Tan
  • Publication number: 20210399522
    Abstract: Coupled-cavity vertical cavity surface emitting lasers (VCSELs) are provided by the present disclosure. The coupled-cavity VCSEL can comprise a VCSEL having a first mirror, a gain medium disposed above the first mirror, and a second mirror disposed above the gain medium, wherein a first cavity is formed by the first mirror and the second mirror. A second cavity is optically coupled to the VCSEL and configured to reflect light emitted from the VCSEL back into the first cavity of the VCSEL. In some embodiments, the second cavity can be an external cavity optically coupled to the VCSEL through a coupling component. In some embodiments, the second cavity can be integrated with the VCSEL to form a monolithic coupled-cavity VCSEL. A feedback circuit can control operation of the coupled-cavity VCSEL so the output comprises a target high frequency signal.
    Type: Application
    Filed: June 23, 2020
    Publication date: December 23, 2021
    Inventors: Stanley CHEUNG, Michael Renne Ty TAN, Binhao WANG, Wayne Victor SORIN, Chao-Kun LIN
  • Publication number: 20210384132
    Abstract: A silicon interposer may include an on-chip DC blocking capacitor, comprising: a first electrical connection to couple to a supply voltage and to cathodes of a plurality of photodiodes formed in a two-dimensional photodiode array on a first substrate, and a second electrical connection to couple to ground and to ground inputs of a plurality of transimpedance amplifiers on a second substrate; wherein the on-chip DC blocking capacitor is configured to be shared among a plurality of receiver circuits comprising the plurality of photodiodes and the plurality of transimpedance amplifiers; and wherein the silicon interposer comprises a substrate separate from the first substrate and the second substrate.
    Type: Application
    Filed: June 3, 2020
    Publication date: December 9, 2021
    Inventors: BINHAO WANG, WAYNE VICTOR SORIN, MICHAEL RENNE TY TAN
  • Patent number: 10985531
    Abstract: A VCSEL device includes a substrate and a first DBR structure disposed on the substrate. The VCSEL device further includes a cathode contact disposed on a top surface of the first DBR structure. In addition, the VCSEL device includes a VCSEL mesa that is disposed on the top surface of the first DBR structure. The VCSEL mesa includes a quantum well, a non-circularly-shaped oxide aperture region disposed above the quantum well, and a second DBR structure disposed above the non-circularly-shaped oxide aperture region. In addition, the VCSEL mesa includes a selective polarization structure disposed above the second DBR structure and an anode contact disposed above the selective polarization structure.
    Type: Grant
    Filed: January 27, 2019
    Date of Patent: April 20, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Binhao Wang, Wayne Sorin, Michael Renne Ty Tan, Sagi Varghese Mathai, Stanley Cheung
  • Patent number: 10795098
    Abstract: A VCSEL transmitter includes a first VCSEL terminal disposed on a substrate and a second VCSEL terminal adjacent thereto. The transmitter also includes a first diffraction element within a first optical path of the first VCSEL terminal which receives and changes a first direction of a first light transmission having a low-order Laguerre Gaussian mode emitted from the first VCSEL terminal. The transmitter further includes a second diffraction element within a second optical path of the second VCSEL terminal which receives the second light transmission and converts the received light into a high-order Laguerre Gaussian mode. The transmitter also includes a mode combiner to direct the first light transmission into a lens which directs the light into a multi-mode optical fiber.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 6, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Binhao Wang, Wayne V. Sorin, Michael R. Tan, Stanley Cheung
  • Publication number: 20200244040
    Abstract: A VCSEL device includes a substrate and a first DBR structure disposed on the substrate. The VCSEL device further includes a cathode contact disposed on a top surface of the first DBR structure. In addition, the VCSEL device includes a VCSEL mesa that is disposed on the top surface of the first DBR structure. The VCSEL mesa includes a quantum well, a non-circularly-shaped oxide aperture region disposed above the quantum well, and a second DBR structure disposed above the non-circularly-shaped oxide aperture region. In addition, the VCSEL mesa includes a selective polarization structure disposed above the second DBR structure and an anode contact disposed above the selective polarization structure.
    Type: Application
    Filed: January 27, 2019
    Publication date: July 30, 2020
    Inventors: Binhao Wang, Wayne Sorin, Michael Renne Ty Tan, Sagi Varghese Mathai, Stanley Cheung
  • Publication number: 20200200985
    Abstract: A VCSEL transmitter includes aa first VCSEL terminal disposed on a substrate and a second VCSEL terminal adjacent thereto. The transmitter also includes a first diffraction element within a first optical path of the first VCSEL terminal which receives and changes a first direction of a first light transmission having a low-order Laguerre Gaussian mode emitted from the first VCSEL terminal. The transmitter further includes a second diffraction element within a second optical path of the second VCSEL terminal which receives the second light transmission and converts the received light into a high-order Laguerre Gaussian mode. The transmitter also includes a mode combiner to direct the first light transmission into a lens which directs the light into a multi-mode optical fiber.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 25, 2020
    Inventors: Binhao Wang, Wayne V. Sorin, Michael R. Tan, Stanley Cheung
  • Patent number: 10177872
    Abstract: An example system may include a first vertical cavity surface emitting laser (VCSEL) that includes a first integrated polarization locking structure to produce a polarized optical data signal. The system may also comprise a second VCSEL that includes a second integrated polarization locking structure, the second integrated polarization locking structure orthogonal to the first integrated polarization locking structure, to produce an orthogonally polarized optical data signal. Lenses may be disposed on the substrate opposite the first VCSEL, to collimate the polarized optical data signal, and opposite the second VCSEL to collimate the orthogonally polarized optical data signal. A polarization division multiplexer may combine the first collimated polarized optical data signal and the second collimated orthogonally polarized optical data signal.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: January 8, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Binhao Wang, Wayne Victor Sorin, Michael Renne Ty Tan, Sagi Mathai, Stanley Cheung
  • Patent number: 10084285
    Abstract: An example system may include a first vertical cavity surface emitting laser (VCSEL) that includes a first integrated polarization locking structure to produce a polarized optical data signal. The system may also comprise a second VCSEL that includes a second integrated polarization locking structure, the second integrated polarization locking structure orthogonal to the first integrated polarization locking structure, to produce an orthogonally polarized optical data signal. Lenses may be disposed on the substrate opposite the first VCSEL, to collimate the polarized optical data signal, and opposite the second VCSEL to collimate the orthogonally polarized optical data signal. A polarization division multiplexer may combine the first collimated polarized optical data signal and the second collimated orthogonally polarized optical data signal.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: September 25, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Binhao Wang, Wayne Sorin, Michael Tan, Sagi Mathai, Stanley Cheung