Abstract: An elastomeric sealing device operable at an operating temperature above an installation temperature. The sealing device includes a body fabricated from an elastomeric material. A channel is formed within the body. A mesh is disposed within the channel. The mesh includes a plurality of interwoven fibers forming an inner volume. A filler is disposed within the inner volume. At least a portion of the filler is a liquid at the installation temperature. The at least a portion of the filler is a gas at the operating temperature.

Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.

Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

Abstract: An elastomeric sealing device operable at an operating temperature above an installation temperature. The sealing device includes a body fabricated from an elastomeric material. A channel is formed within the body. A mesh is disposed within the channel. The mesh includes a plurality of interwoven fibers forming an inner volume. A filler is disposed within the inner volume. At least a portion of the filler is a liquid at the installation temperature. The at least a portion of the filler is a gas at the operating temperature.

Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.

Abstract: A heat transfer device includes a casing and a wick disposed within the casing. The wick includes a first sintered layer and a second sintered layer. The first sintered layer includes a plurality of first sintered particles, having a first porosity and a plurality of first pores. The first sintered layer is disposed proximate to an inner surface of the casing. The second sintered layer includes a plurality of second sintered particles, having a second porosity and a plurality of second pores. The second sintered layer is disposed on the first sintered layer. The heat transfer device includes at least one first sintered particle smaller than at least one second pore and the first porosity is smaller than the second porosity.

Abstract: A flexible wire assembly includes a plurality of elongated conductors and insulators each having a quadrilateral cross section and alternatingly laminated together, the flexible wire assembly having a wire width measured across the conductor and insulators, a wire height equivalent to the height of the conductors and insulators, and a wire length which is measured in a longitudinal direction orthogonal to the wire width and the wire height, wherein the wire length is one or more orders of magnitude greater than the wire width and the wire height; and a first device comprising a plurality of bond pads spaced to define a bond pad pitch, wherein the flexible wire assembly is coupled to the first device at the bond pads such that spacing of the conductor conductors is matched to the bond pad pitch.

Abstract: A system for heat transfer along with the method of preparation of the same is described. System includes a first surface, a second surface, and an interface material. The interface material is disposed between the first and second surfaces such that it is solid at an assembling temperature and liquid at an operating temperature. The first surface of the system is configured to adhere to the solid and liquid thermal interface material, and the second surface is configured to adhere to the liquid thermal interface material and be detachable from the solid interface material. The method of preparation of the system includes disposing the first surface, an interface material, and a second surface, heating the interface material to above its melting point and then cooling to a temperature below melting point to detach and remove the second surface from the interface material.