Patents by Inventor Björn Engler

Björn Engler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing an electrical through connection between opposite surfaces of a flexible substrate
    Patent number: 10687426
    Abstract: A method of producing an electrical through connection. A cut extending from a first surface to a second surface and separating the area into a first part and a second part is provided on an area of the flexible substrate. At least one of the first and second part is raised from a first plane of the first surface. A first wet conductive layer is printed on the first surface on and around the cut. The first wet layer is solidified into a first dried conductive layer. At least one of the first part and the second part is raised from a second plane of the second surface. A second wet conductive layer is printed on the second surface on and around the cut. The second wet conductive layer is solidified into a second dried conductive layer, which creates an electrical through connection with the first dried conductive layer.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: June 16, 2020
    Assignee: Saralon GmbH
    Inventors: Moazzam Ali, Björn Engler
  • METHOD OF PRODUCING AN ELECTRICAL THROUGH CONNECTION BETWEEN OPPOSITE SURFACES OF A FLEXIBLE SUBSTRATE
    Publication number: 20200100366
    Abstract: A method of producing an electrical through connection. A cut extending from a first surface to a second surface and separating the area into a first part and a second part is provided on an area of the flexible substrate. At least one of the first and second part is raised from a first plane of the first surface. A first wet conductive layer is printed on the first surface on and around the cut. The first wet layer is solidified into a first dried conductive layer. At least one of the first part and the second part is raised from a second plane of the second surface. A second wet conductive layer is printed on the second surface on and around the cut. The second wet conductive layer is solidified into a second dried conductive layer, which creates an electrical through connection with the first dried conductive layer.
    Type: Application
    Filed: November 22, 2019
    Publication date: March 26, 2020
    Inventors: Moazzam Ali, Björn Engler