Patents by Inventor Björn Keller

Björn Keller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling module for a cell stack, and a cell stack
    Patent number: 11923524
    Abstract: The present invention relates to the field of electrical energy storage devices and in particular enables simplified manufacture and/or optimised operation thereof in that a cooling module, a cell stack, the entire electrical energy storage device and/or a method for cooling cells are optimised.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: March 5, 2024
    Assignee: ElringKlinger AG
    Inventors: Torsten Stifel, Björn Betz, Martina Bulat, Stefan Dwenger, Matthias Biegerl, Melanie Kemnitz, Christian Wörsdörfer, Holger Keller
  • Method and apparatus for thin film module with dotted interconnects and vias
    Patent number: 8928105
    Abstract: A method to fabricate monolithically-integrated optoelectronic module apparatuses (100) comprising at least two series-interconnected optoelectronic components (104, 106, 108). The method includes deposition and scribing on an insulating substrate or superstate (110) of a 3-layer stack in order (a, b, c) or (c, b, a) comprising: (a) back-contact electrodes (122, 124, 126, 128), (b) semiconductive layer (130), and (c) front-contact components (152, 154, 156, 158). Via holes (153, 155, 157) are drilled so that heat of the drilling process causes a metallization at the surface of said via holes that renders conductive the semi-conductive layer's surface (132, 134, 136, 138) of said via holes, thereby establishing series-interconnecting electrical paths between optoelectronic components (104, 106, 108) by connecting first front-contact components (154, 156) to second back-contact electrodes (124, 126).
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: January 6, 2015
    Assignee: Flisom AG
    Inventors: Roger Ziltener, Roland Kern, David Bremaud, Björn Keller
  • METHOD AND APPARATUS FOR THIN FILM MODULE WITH DOTTED INTERCONNECTS AND VIAS
    Publication number: 20130056758
    Abstract: A method to fabricate monolithically-integrated optoelectronic module apparatuses (100) comprising at least two series-interconnected optoelectronic components (104, 106, 108). The method includes deposition and scribing on an insulating substrate or superstate (110) of a 3-layer stack in order (a, b, c) or (c, b, a) comprising: (a) back-contact electrodes (122, 124, 126, 128), (b) semiconductive layer (130), and (c) front-contact components (152, 154, 156, 158). Via holes (153, 155, 157) are drilled so that heat of the drilling process causes a metallization at the surface of said via holes that renders conductive the semi-conductive layer's surface (132, 134, 136, 138) of said via holes, thereby establishing series-interconnecting electrical paths between optoelectronic components (104, 106, 108) by connecting first front-contact components (154, 156) to second back-contact electrodes (124, 126).
    Type: Application
    Filed: May 27, 2011
    Publication date: March 7, 2013
    Applicant: FLISOM AG
    Inventors: Roger Ziltener, Roland Kern, David Bremaud, Björn Keller