Abstract: An optical encoder assembly has an encoder sensor, a code strip, and a base having a first portion and a second portion, wherein the encoder sensor is mounted on one of either the first portion or the second portion and the code strip is mounted on the other portion. An optical encoder assembly has a base having an upper base and a lower base, the upper base joined to the lower base with at least one flexible beam, an encoder sensor mounted to one of the upper base or the lower base, and a code strip mounted to the other of the upper base or the lower base. A method includes mounting an encoder sensor to a first mating surface on the first side of a base, mounting a code strip to a second mating surface on the second side of the base with the first and second sides of the base connected by at least one flexible beam, and attaching the base to an object to be measured such that deflections between the first and second mating surfaces can be measured using the encoder sensor.

Abstract: There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.

Abstract: There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.