Patents by Inventor Blake Rogers

Blake Rogers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SPACE TRANSPORT SYSTEM
    Publication number: 20210078736
    Abstract: A space transport system includes one or more cyclers orbiting between a first planetary body and another planetary body. The space transport system also includes one or more taxi vehicles, each of which carry cargo, humans, or both. The one or more taxi vehicles dock with the one or more cyclers and undock with the one or more cyclers when landing on the first planetary body or the second planetary body.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 18, 2021
    Inventors: Blake A. ROGERS, Randy M. VILLAHERMOSA, Joshua P. DAVIS, Lael F. WOODS, Barik SMITH
  • Heat management system
    Patent number: 10468331
    Abstract: A heat management system may include a die package. The die package may include a housing. The housing may include a housing surface. The housing may include a housing inlet port. The housing inlet port may be in communication with the housing surface. The housing may include a housing outlet port. The housing outlet port may be in communication with the housing surface. The heat management system may include a manifold. The manifold may be configured to couple with the housing. The manifold may include a manifold surface. The manifold surface may be configured to mate with the housing surface. The manifold may include a manifold inlet port. The manifold inlet port may be in communication with the manifold surface. The manifold may include a manifold outlet port. The manifold outlet port may be in communication with the manifold surface.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: November 5, 2019
    Assignee: Intel Corporation
    Inventors: Je-young Chang, Jae W. Kim, Ravindranath V. Mahajan, Blake Rogers, Devdatta Kulkarni
  • HEAT MANAGEMENT SYSTEM
    Publication number: 20190221499
    Abstract: A heat management system may include a die package. The die package may include a housing. The housing may include a housing surface. The housing may include a housing inlet port. The housing inlet port may be in communication with the housing surface. The housing may include a housing outlet port. The housing outlet port may be in communication with the housing surface. The heat management system may include a manifold. The manifold may be configured to couple with the housing. The manifold may include a manifold surface. The manifold surface may be configured to mate with the housing surface. The manifold may include a manifold inlet port. The manifold inlet port may be in communication with the manifold surface. The manifold may include a manifold outlet port. The manifold outlet port may be in communication with the manifold surface.
    Type: Application
    Filed: January 12, 2018
    Publication date: July 18, 2019
    Inventors: Je-young Chang, Jae W. Kim, Ravindranath V. Mahajan, Blake Rogers, Devdatta Kulkarni
  • Systems and methods for interconnect simulation and characterization
    Patent number: 10043720
    Abstract: Exemplary systems and methods allow for precise formation and subsequent characterization of electrical interconnects, for example solder joints associated with integrated circuit packages. The system may utilize a cartridge-like structure for use in aligning the metal components to be interconnected, and to facilitate subsequent testing of the interconnect.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: August 7, 2018
    Assignee: Arizona Board of Regents
    Inventors: Blake Rogers, Amaneh Tasooji
  • SYSTEMS AND METHODS FOR INTERCONNECT SIMULATION AND CHARACTERIZATION
    Publication number: 20170162454
    Abstract: Exemplary systems and methods allow for precise formation and subsequent characterization of electrical interconnects, for example solder joints associated with integrated circuit packages. The system may utilize a cartridge-like structure for use in aligning the metal components to be interconnected, and to facilitate subsequent testing of the interconnect.
    Type: Application
    Filed: December 2, 2016
    Publication date: June 8, 2017
    Inventors: Blake Rogers, Amaneh Tasooji