Abstract: A system for processing substrates is described. In one embodiment, the system comprises a process chamber, at least one electrical resistance heater, and at least one Coanda effect gas injector.

Abstract: A system for processing substrates is described. In one embodiment, the system comprises a process chamber, at least one electrical resistance heater, and at least one Coanda effect gas injector.

Abstract: A system for processing substrates is described. In one embodiment, the system comprises a process chamber, at least one electrical resistance heater, and at least one Coanda effect gas injector.

Abstract: A system for processing substrates is described. In one embodiment, the system comprises a process chamber and at least one Coanda effect gas injector. The at least one Coanda effect gas injector is disposed proximate a location for the peripheral edge of the substrate so as to provide a Coanda effect gas flow over the surface of the substrate. Apparatuses and methods are also described.

Abstract: Electrical resistance heater and heater assemblies are described. According to one embodiment, the heater comprises a sinusoidal heating element that provides substantially constant heating. According to another embodiment, the heater comprises a heating element and one or more press-fit coupled electrical adapters. Methods and systems are also disclosed.

Abstract: A generally horizontally-oriented quartz CVD chamber is disclosed with front and rear chamber divider plates adjacent a centrally positioned susceptor and surrounding temperature control ring which divide the chamber into upper and lower regions. Improvement to the lifetime of CVD process components and related throughput improvements are disclosed. A getter plate for attracting some of the unused reactant gas is positioned downstream from the susceptor extending generally parallel to and spaced between the divider plate and the upper chamber wall. This getter plate also minimizes deposition on the chamber walls and improves the efficiency of a cleaning step. Reradiating elements are also located adjacent side walls of the chamber to heat cooler chamber wall areas. The getter plate and the reradiating elements plus the susceptor and surrounding ring are all made of solid chemical vapor deposited SiC to improve the life of the chamber.