Patents by Inventor Bo Cheng JIANG

Bo Cheng JIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200135991
    Abstract: A lighting device is disclosed, including an LED die, a light-transmissive encapsulant and a light-transmissive wall. The light-transmissive encapsulant covers the light-emitting side surfaces and the top surface, and the light-transmissive wall surrounds the light-transmissive encapsulant and covers the side surfaces of the light-transmissive encapsulant. Furthermore, the refractive index of the light-transmissive encapsulant is not greater than the refractive index of the light-transmissive wall. A lighting module is further disclosed, including a circuit substrate and the lighting devices, as described above, which are disposed on the circuit substrate. Therefore, when lights generated from the LED die are transmitted into the light-transmissive wall from the light-transmissive encapsulant, the lights will be deflected towards the lateral direction, thereby increasing the viewing angle of the lighting device.
    Type: Application
    Filed: October 29, 2019
    Publication date: April 30, 2020
    Applicant: Everlight Electronics Co., Ltd.
    Inventors: Chun-Min LIN, Bo Cheng JIANG, Shang-Fu KAO, Yu Ju CHEN, Jen-hsiung LAI, Chung Chuan HSIEH