Patents by Inventor Bo Hee Kang
Bo Hee Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150270463Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.Type: ApplicationFiled: June 3, 2015Publication date: September 24, 2015Applicant: LG INNOTEK CO., LTD.Inventors: Byung Mok KIM, Bo Hee KANG, Ha Na KIM, Hiroshi KODAIRA, Yuichiro TANDA, Satoshi OZEKI
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Patent number: 9127827Abstract: A lighting device may be provided that includes: a heat sink; a member which has a polygonal pillar shape having at least three sides and is disposed on the heat sink, wherein the sides are inclined at a predetermined angle toward the center of the heat sink; and a light source which is disposed on at least one among the sides of the member, wherein the light source includes: a substrate; at least two light emitting devices which are symmetrically disposed on the substrate with respect to the center of the substrate; and at least two lens units which are disposed on the light emitting devices respectively, and consequently, it is possible to meet U.S. Energy Star and ANSI specifications, to remarkably improve rear light distribution characteristics and to remove a dark portion.Type: GrantFiled: January 30, 2013Date of Patent: September 8, 2015Assignee: LG INNOTEK CO., LTD.Inventors: Ki Hyun Kim, Eun Hwa Kim, Bo Hee Kang
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Patent number: 9076949Abstract: A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.Type: GrantFiled: September 25, 2014Date of Patent: July 7, 2015Assignee: LG INNOTEK CO., LTD.Inventors: Byung Mok Kim, Bo Hee Kang, Ha Na Kim, Hiroshi Kodaira, Yuichiro Tanda, Satoshi Ozeki
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Publication number: 20150054403Abstract: A lighting device may be provided that includes: a heat sink which includes a top surface and a member which has a side and is disposed on the top surface; a light source which includes a substrate disposed on the side of the member and light emitting devices disposed on the substrate, and has a reference point; and a cover which is coupled to the heat sink and includes an upper portion and a lower portion, which are divided by an imaginary plane passing through the reference point and being parallel with the top surface of the heat sink, wherein a distance from the reference point of the light source to the upper portion of the cover is larger than a distance from the reference point of the light source to the lower portion of the cover.Type: ApplicationFiled: November 4, 2014Publication date: February 26, 2015Applicant: LG INNOTEK CO., LTD.Inventors: Chul Ho JANG, Bo Hee KANG, Ki Hyun KIM
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Publication number: 20150048262Abstract: A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.Type: ApplicationFiled: September 25, 2014Publication date: February 19, 2015Applicant: LG INNOTEK CO., LTD.Inventors: Byung Mok Kim, Bo Hee Kang, Ha Na Kim, Hiroshi Kodaira, Yuichiro Tanda, Satoshi Ozeki
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Patent number: 8905580Abstract: A lighting device may be provided that includes: a heat sink which includes a top surface and a member which has a side and is disposed on the top surface; a light source which includes a substrate disposed on the side of the member and light emitting devices disposed on the substrate, and has a reference point; and a cover which is coupled to the heat sink and includes an upper portion and a lower portion, which are divided by an imaginary plane passing through the reference point and being parallel with the top surface of the heat sink, wherein a distance from the reference point of the light source to the upper portion of the cover is larger than a distance from the reference point of the light source to the lower portion of the cover.Type: GrantFiled: August 31, 2012Date of Patent: December 9, 2014Assignee: LG Innotek Co., Ltd.Inventors: Chul Ho Jang, Bo Hee Kang, Ki Hyun Kim
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Patent number: 8872195Abstract: A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.Type: GrantFiled: May 12, 2014Date of Patent: October 28, 2014Assignee: LG Innotek Co., Ltd.Inventors: Byung Mok Kim, Bo Hee Kang, Ha Na Kim, Hiroshi Kodaira, Yuichiro Tanda, Satoshi Ozeki
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Publication number: 20140246604Abstract: A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.Type: ApplicationFiled: May 12, 2014Publication date: September 4, 2014Applicant: LG Innotek Co., Ltd.Inventors: Byung Mok Kim, Bo Hee Kang, Ha Na KIM, Hiroshi Kodaira, Yuichiro Tanda, Satoshi Ozeki
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Publication number: 20140167095Abstract: Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction.Type: ApplicationFiled: December 13, 2013Publication date: June 19, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Byung Mok KIM, Young Jin NO, Bo Hee KANG, Hiroshi KODAIRA
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Patent number: 8754423Abstract: Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.Type: GrantFiled: September 24, 2013Date of Patent: June 17, 2014Assignee: LG Innotek Co., Ltd.Inventors: Byung Mok Kim, Bo Hee Kang, Ha Na Kim, Hiroshi Kodaira, Yuichiro Tanda, Satoshi Ozeki
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Publication number: 20140084182Abstract: Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.Type: ApplicationFiled: September 24, 2013Publication date: March 27, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Byung Mok KIM, Bo Hee KANG, Ha Na KIM, Hiroshi KODAIRA
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Publication number: 20140042482Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.Type: ApplicationFiled: June 21, 2013Publication date: February 13, 2014Inventors: Byung Mok KIM, Kodaira Hiroshi, Su Jung Jung, Bo Hee Kang, Young Jin No
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Publication number: 20130194802Abstract: A lighting device may be provided that includes: a heat sink; a member which has a polygonal pillar shape having at least three sides and is disposed on the heat sink, wherein the sides are inclined at a predetermined angle toward the center of the heat sink; and a light source which is disposed on at least one among the sides of the member, wherein the light source includes: a substrate; at least two light emitting devices which are symmetrically disposed on the substrate with respect to the center of the substrate; and at least two lens units which are disposed on the light emitting devices respectively, and consequently, it is possible to meet U.S. Energy Star and ANSI specifications, to remarkably improve rear light distribution characteristics and to remove a dark portion.Type: ApplicationFiled: January 30, 2013Publication date: August 1, 2013Inventors: Ki Hyun KIM, Eun Hwa KIM, Bo Hee KANG
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Publication number: 20130070456Abstract: A lighting device may be provided that includes: a heat sink which includes a top surface and a member which has a side and is disposed on the top surface; a light source which includes a substrate disposed on the side of the member and light emitting devices disposed on the substrate, and has a reference point; and a cover which is coupled to the heat sink and includes an upper portion and a lower portion, which are divided by an imaginary plane passing through the reference point and being parallel with the top surface of the heat sink, wherein a distance from the reference point of the light source to the upper portion of the cover is larger than a distance from the reference point of the light source to the lower portion of the cover.Type: ApplicationFiled: August 31, 2012Publication date: March 21, 2013Inventors: Chul Ho Jang, Bo Hee Kang, Ki Hyun Kim