Abstract: A position measuring device and a position measuring method for accurately measuring a position of a movable member using a plurality of linear scales are provided. The position measuring device comprises a first linear scale elongated in a first direction, a second linear scale elongated in the first direction and separated from the first linear scale, and a head structure including a first scale head and a second scale head that are spaced apart from each other, wherein the head structure reads the first linear scale or the second linear scale while moving in the first direction, wherein the first scale head and the second scale head are activated or deactivated opposite to each other.

Abstract: In an apparatus and method of generating an ultrasonic vibration, an ultrasonic vibration generated in an ultrasonic vibration generator is transmitted through a material layer to control the intensity and the direction of the ultrasonic vibration. In an apparatus and method of cleaning a wafer, a cleaning solution supplier supplies a cleaning solution for cleaning the wafer onto the wafer. An ultrasonic vibration generator generates an ultrasonic vibration. The ultrasonic vibration is transmitted through a material layer of a transmission member to control the intensity and the direction of the ultrasonic vibration. The ultrasonic vibration is applied to the cleaning solution.

Abstract: A chucking member configured to chuck the edge of a substrate includes a chucking pin which is eccentric from the rotation center. The chucking pin has a streamline shape and includes a first front-end portion disposed at the front end relative to the flow of an air current generated by the rotation of the substrate and a first back-end portion disposed at the back end relative to the flow of the air current. The first front-end portion includes a first tip, and the first front-end portion has a round shape.

Abstract: An apparatus is provided for supplying a plurality of chemicals or gases to the surface of a substrate to clean and dry the substrate. The apparatus includes a substrate support unit with a chuck on which a substrate is loaded, a bottom chamber having an open top and configured to surround the circumference of the chuck, a top chamber configured to open or close the top of the bottom chamber such that a drying treatment for the substrate is performed while the substrate is isolated from the outside, and an indirect injection nozzle installed at the edge of the top chamber and configured to inject drying fluid toward the center of the top chamber such that the drying fluid is indirectly injected to the substrate. According to the apparatus, it is possible to enhance a substrate drying efficiency, suppress external contamination, and prevent the formation of an oxide layer.

Abstract: In an apparatus for transferring a substrate, a partition wall is disposed in a vertical direction in a housing to divide an interior space of the housing into a first space and a second space. A pressure generating member divides the first space into an upper space and a lower space and moves in a vertical direction in the first space such that a positive pressure and a negative pressure are alternately generated in the upper space and the lower space. A substrate supporting member is movably disposed in the second space to support and to transfer the substrate. A plurality of gates is disposed on a side wall of the housing and the partition wall, and is opened and closed by the positive pressure and the negative pressure such that the particles are eliminated from the second space to an exterior space via the first space.

Abstract: In an apparatus and method of generating an ultrasonic vibration, an ultrasonic vibration generated in an ultrasonic vibration generator is transmitted through a material layer to control the intensity and the direction of the ultrasonic vibration. In an apparatus and method of cleaning a wafer, a cleaning solution supplier supplies a cleaning solution for cleaning the wafer onto the wafer. An ultrasonic vibration generator generates an ultrasonic vibration. The ultrasonic vibration is transmitted through a material layer of a transmission member to control the intensity and the direction of the ultrasonic vibration. The ultrasonic vibration is applied to the cleaning solution.

Abstract: In an apparatus for transferring a substrate, a partition wall is disposed in a vertical direction in a housing to divide an interior space of the housing into a first space and a second space. A pressure generating member divides the first space into an upper space and a lower space and moves in a vertical direction in the first space such that a positive pressure and a negative pressure are alternately generated in the upper space and the lower space. A substrate supporting member is movably disposed in the second space to support and to transfer the substrate. A plurality of gates is disposed on a side wall of the housing and the partition wall, and is opened and closed by the positive pressure and the negative pressure such that the particles are eliminated from the second space to an exterior space via the first space.

Abstract: A chucking member configured to chuck the edge of a substrate includes a chucking pin which is eccentric from the rotation center. The chucking pin has a streamline shape and includes a first front-end portion disposed at the front end relative to the flow of an air current generated by the rotation of the substrate and a first back-end portion disposed at the back end relative to the flow of the air current. The first front-end portion includes a first tip, and the first front-end portion has a round shape.

Abstract: An apparatus is provided for supplying a plurality of chemicals or gases to the surface of a substrate to clean and dry the substrate. The apparatus includes a substrate support unit with a chuck on which a substrate is loaded, a bottom chamber having an open top and configured to surround the circumference of the chuck, a top chamber configured to open or close the top of the bottom chamber such that a drying treatment for the substrate is performed while the substrate is isolated from the outside, and an indirect injection nozzle installed at the edge of the top chamber and configured to inject drying fluid toward the center of the top chamber such that the drying fluid is indirectly injected to the substrate. According to the apparatus, it is possible to enhance a substrate drying efficiency, suppress external contamination, and prevent the formation of an oxide layer.