Patents by Inventor Boram HWANG

Boram HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134742
    Abstract: According to various embodiments, an electronic device comprises: at least one processor; and memory operatively connected to the at least one processor, wherein the memory may store instructions which, when executed by the at least one processor, cause the electronic device to: obtain, from a kernel, at least one address for a first memory area accessible through the kernel; store the at least one address in a second memory area accessible through a hypervisor; based on obtaining an address stored in a kernel stack from the kernel, identify whether the obtained address is defective, on the basis of the at least one stored address; and restore the defective address using at least one address stored in the second memory area in response to identifying the defect in the address.
    Type: Application
    Filed: December 8, 2023
    Publication date: April 25, 2024
    Inventors: Boram HWANG, Chulmin KIM, Hyunjoon CHA
  • Publication number: 20240113184
    Abstract: A semiconductor device may include a barrier layer on a channel layer, a gate electrode on the barrier layer, a gate semiconductor layer between the barrier layer and the gate electrode, and a source and a drain spaced apart from each other on the channel layer. The barrier layer may have a greater energy band gap than the channel layer. The gate semiconductor layer may include a first surface contacting the barrier layer and a second surface contacting the gate electrode, and a sidewall connecting the first surface with the second surface. An area of the second surface of the gate semiconductor layer may be narrower than an area of the first surface. The sidewall of the gate semiconductor layer may include a plurality of surfaces having different slopes.
    Type: Application
    Filed: March 31, 2023
    Publication date: April 4, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Junhyuk PARK, Jaejoon OH, Sunkyu HWANG, Boram KIM, Jongseob KIM, Joonyong KIM, Injun HWANG
  • Publication number: 20240096944
    Abstract: Provided are a power device and a manufacturing method thereof. A power device includes a compound semiconductor layer epitaxially grown on a substrate, a gate formed on the compound semiconductor layer, a source and a drain provided on either side of the gate, a passivation layer provided to cover the source, drain, and gate, and a cooling space region provided to form a cooling path inside the substrate. The cooling space region may be formed to a predetermined depth from the surface of the substrate and include an enlargement region having a width increasing according to a depth from the surface of the substrate. The width of an inlet of the cooling space region is less than a maximum width of the enlargement region, and the passivation layer and the compound semiconductor layer are provided to open the cooling space region.
    Type: Application
    Filed: April 11, 2023
    Publication date: March 21, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joonyong KIM, Sunkyu HWANG, Boram KIM, Jongseob KIM, Junhyuk PARK, Jaejoon OH, Injun HWANG
  • Publication number: 20210042125
    Abstract: In various embodiments, an electronic device may include: a processor including a plurality of cores, and a memory connected to the processor. The memory may store instructions which, when executed, cause the processor to, based on an abort of an execution of an instruction in a first core among the plurality of cores, determine whether a second core capable of executing the instruction exists in the plurality of cores, and to transfer the execution of the instruction to the second core, based at least on determining that the second core exists among the plurality of cores.
    Type: Application
    Filed: June 25, 2020
    Publication date: February 11, 2021
    Inventors: Hyun Joon CHA, Hyunchul SEOK, Daehyun CHO, Mooncheol KANG, Sangmin YI, Hyunkyu LEE, Boram HWANG