Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: A heat dissipation system for use with a computer chip includes a heat sink with a fan mounted aslant to the lateral side thereof. The heat sink includes a base having a first surface and a second surface. The computer chip is positioned in contact with the first surface. A heat dissipation unit is mounted on the second surface of the base. The heat dissipation unit includes a plurality of heat dissipation fins. An air-conducting device has a shape of an inverted U and is used to cover the heat dissipation unit. A fan is mounted aslant to a lateral side of the heat dissipation unit. The heat dissipation unit includes a plurality of rectangular dissipation fins. The fins are mutually parallel and are collocated above the base. The heat dissipation unit includes a predetermined number of heat dissipation fins having a common inclination to form an accommodating area on the lateral side of the heat dissipation unit.

Abstract: A storage box for hard disk drive (HDD) is provided. The storage box includes an outer frame, a first holder, a second holder, a cooling module and a back panel board. The first and second holders are opposite and for supporting the HDD. The cooling module, for cooling the HDD, is fixed in the storage box via the second holder and the outer frame. The cooling air is drawn into the storage box by the cooling module. The back panel board is electrically connected to the cooling module. The back panel board has an outlet positioned relative to the cooling module. The cooling air is flowed through surface of the HDD and a heat sink of the cooling module, and then exhausted from the outlet of the back panel board.

Abstract: A heat dissipation system for use with a computer chip includes a heat sink with a fan mounted aslant to the lateral side thereof. The heat sink includes a base having a first surface and a second surface. The computer chip is positioned in contact with the first surface. A heat dissipation unit is mounted on the second surface of the base. The heat dissipation unit includes a plurality of heat dissipation fins. An air-conducting device has a shape of an inverted U and is used to cover the heat dissipation unit. A fan is mounted aslant to a lateral side of the heat dissipation unit. The heat dissipation unit includes a plurality of rectangular dissipation fins. The fins are mutually parallel and are collocated above the base. The heat dissipation unit includes a predetermined number of heat dissipation fins having a common inclination to form an accommodating area on the lateral side of the heat dissipation unit.