Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A display-enabled eyewear device has an integrated head sensor that dynamically and continuously measures or detects various cephalic parameters of a wearer's head. The head sensor includes a loop coupler system integrated in a lens-carrying frame to sense proximate ambient RF absorption influenced by head presence, size, and/or distance. Autonomous device management dynamically adjust or cause adjustment of selected device features based on current detected values for the cephalic parameters, which can include wear status, head size, and frame-head spacing.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: An apparatus for probing a device-under-test (DUT) includes a fixture, a circuitry film attached to the fixture, a probing tip disposed on and electrically coupled to the circuitry film to probe a device-under-test, and a first signal connector disposed on the circuitry film and electrically coupled to the probing tip through the circuitry film. The first signal connector is oriented in a direction that is angularly offset from a lengthwise direction of the probing tip.

Abstract: An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film disposed along a contour of the fixture, a first signal connector, and a plurality of probing tips disposed on the circuitry film and extending toward the device-under-test. The circuitry film includes a first portion attached to a top sidewall of the fixture, and the first signal connector is disposed on and electrically connected to the first portion of the circuitry film. The first signal connector is electrically coupled to the probing tips through the circuitry film. A method for probing a DUT is also provided.

Abstract: A method includes forming a transistor over a substrate; and forming a resistive element over the transistor, in which forming the resistive element includes forming a bottom electrode electrically connected to a source/drain region of the transistor; forming a resistive switching layer over the bottom electrode, in which the resistive switching layer is made of metal halide; and forming a top electrode over the resistive switching layer.

Abstract: An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film disposed along a contour of the fixture, a first signal connector, and a plurality of probing tips disposed on the circuitry film and extending toward the device-under-test. The circuitry film includes a first portion attached to a top sidewall of the fixture, and the first signal connector is disposed on and electrically connected to the first portion of the circuitry film. The first signal connector is electrically coupled to the probing tips through the circuitry film. A method for probing a DUT is also provided.

Abstract: This invention provides a light-concentrating structure with photosensitivity enhancing effect, including the substrate, buried layer, first electrode layer, second electrode layer, dielectric layer and interconnection structure. The substrate is equipped with a housing space; the buried layer is arranged above the substrate with the housing space; the first electrode layer is arranged above the buried layer; the second electrode layer is arranged in the middle of the first electrode layer; the dielectric layer is arranged above the second electrode layer; the interconnection structure is arranged above the substrate and the first electrode layer surrounding the dielectric layer, which forms an opening and a light-concentrating recess groove.

Abstract: This invention provides a light-concentrating structure with photosensitivity enhancing effect, including the substrate, buried layer, first electrode layer, second electrode layer, dielectric layer and interconnection structure. The substrate is equipped with a housing space; the buried layer is arranged above the substrate with the housing space; the first electrode layer is arranged above the buried layer; the second electrode layer is arranged in the middle of the first electrode layer; the dielectric layer is arranged above the second electrode layer; the interconnection structure is arranged above the substrate and the first electrode layer surrounding the dielectric layer, which forms an opening and a light-concentrating recess groove.

Abstract: A light emitting diode (LED) lighting device is provided. The device includes a lamp shell which is a heat sink including a heat sink covering and a heat sink body and an LED light source assembly installed on top of the heat sink body. The device also includes a control module configured to control the LED light source assembly and an LED driving and power supply unit configured to drive the LED light source assembly and provide electrical power for the LED lighting device. Further, the device includes a reset button electrically connected to the control module, wherein the reset button is set inside the lamp shell and a control push-button of the reset button is set at the sidewall of the lamp shell.

Abstract: A light emitting diode (LED) lamp with at least one speaker is provided. The LED lamp includes a lamp base, a lamp cup installed on the lamp base, and a lamp socket installed under the lamp base. The LED lamp also includes a lamp plate installed on a top surface of the lamp cup, and a plurality of LEDs, set on the lamp plate, configured to emit light. Further, the LED lamp includes the at least one speaker, set at an outer surface of the lamp cup, configured to play audio signals. The top surface of the lamp cup including the lamp plate and the outer surface of the lamp cup including the at least one speaker are not coplanar.

Abstract: A light emitting diode (LED) lamp with at least one speaker is provided. The LED lamp includes a lamp base, a lamp cup installed on the lamp base, and a lamp socket installed under the lamp base. The LED lamp also includes a lamp plate installed on a top surface of the lamp cup, and a plurality of LEDs, set on the lamp plate, configured to emit light. Further, the LED lamp includes the at least one speaker, set at an outer surface of the lamp cup, configured to play audio signals. The top surface of the lamp cup including the lamp plate and the outer surface of the lamp cup including the at least one speaker are not coplanar.

Abstract: A light emitting diode (LED) lighting device is provided. The device includes a lamp shell which is a heat sink including a heat sink covering and a heat sink body and an LED light source assembly installed on top of the heat sink body. The device also includes a control module configured to control the LED light source assembly and an LED driving and power supply unit configured to drive the LED light source assembly and provide electrical power for the LED lighting device. Further, the device includes a reset button electrically connected to the control module, wherein the reset button is set inside the lamp shell and a control push-button of the reset button is set at the sidewall of the lamp shell.

Abstract: A catalyst, including a conductive substrate coated with a metal-phosphorus-derived film, where the metal is Manganese, Iron, Cobalt, Nickel, or Copper. In some embodiments, the conductive substrate includes copper, titanium, glassy carbon, fluorine-doped tin oxide, indium-doped tin oxide, tin, nickel, or stainless steel. Methods for producing the catalysts and for hydrogen evolution reactions and oxygen evolution reactions employing the catalysts are also described herein.

Abstract: Disclosed is a cloud agent realizing method, including that: an agent is communicatively connected to a cloud agent server, acquires a parameter of the agent and a parameter of the cloud agent server from the cloud agent server, and logs in to the cloud agent server according to the acquired parameters. Also disclosed are a cloud agent realizing system and a cloud agent server. With the disclosure, cloud agent registration and management are realized in a Next Generation Call Center Cloud NGC3.

Abstract: Disclosed is a cloud agent realizing method, including that: an agent is communicatively connected to a cloud agent server, acquires a parameter of the agent and a parameter of the cloud agent server from the cloud agent server, and logs in to the cloud agent server according to the acquired parameters. Also disclosed are a cloud agent realizing system and a cloud agent server. With the disclosure, cloud agent registration and management are realized in a Next Generation Call Center Cloud NGC3.

Abstract: A high efficiency colored solar cell is described. The high efficiency colored solar cell includes a substrate, a first antireflection layer formed on the substrate, a second antireflection layer formed on the first antireflection layer. A color of a reflecting light of the high efficiency colored solar cell can be controlled according to the combination of the first antireflection layer and the second antireflection layer.

Abstract: A high solid polyester polyol/silica nanocomposite resin with low viscosity is synthesized by an in situ polymerization method, namely conducting condensation polymerization of polyol/diacid monomer with a molar ratio of 1.1˜1.5 in the presence of colloidal silica nanoparticles with a diameter of 10˜150 nm. The resulted nanocomposite resins has a solid content of >95%, molecular weight of 1000˜5000 g/mol and hydroxyl value of 80-200 mg KOH/g, and a viscosity in the range of 800-2000 mPa.s. The viscosities are especially lower than those obtained by a blending method. The nanosilica content in the nanocomposite resin is 1˜15% (based on the total solid content of nanocomposite resin). The high solid polyester polyol/silica nanocomposite resin was curable with isocyanate or melamine to prepare high solid transparent nanocomposite coatings with obviously improved abrasion and scratch resistance, hardness, weatherability etc.

Abstract: A high solid polyester polyol/silica nanocomposite resin with low viscosity is synthesized by an in situ polymerization method, namely conducting condensation polymerization of polyol/diacid monomer with a molar ratio of 1.1˜1.5 in the presence of colloidal silica nanoparticles with a diameter of 10˜150 nm. The resulted nanocomposite resins has a solid content of >95%, molecular weight of 1000˜5000 g/mol and hydroxyl value of 80-200 mg KOH/g, and a viscosity in the range of 800-2000 mPa.s. The viscosities are especially lower than those obtained by a blending method. The nanosilica content in the nanocomposite resin is 1˜15% (based on the total solid content of nanocomposite resin). The high solid polyester polyol/silica nanocomposite resin was curable with isocyanate or melamine to prepare high solid transparent nanocomposite coatings with obviously improved abrasion and scratch resistance, hardness, weatherability etc.