Abstract: A non-volatile memory chip has word lines spaced a sub-F (sub-minimum feature size F) width apart with extensions of the word lines in at least two transition areas. Neighboring extensions are spaced at least F apart. The present invention also includes a method for word-line patterning of a non-volatile memory chip which includes generating sub-F word lines with extensions in transition areas for connecting to peripheral transistors from mask generated elements with widths of at least F.

Abstract: A non-volatile memory device includes a plurality of word line areas each separated from its neighbor by a contact area, an oxide-nitride-oxide (ONO) layer within the word line areas and at least partially within the contact areas and protective elements, generated when spacers are formed in the periphery area, to protect silicon under the ONO layer in the contact areas. A non-volatile memory device includes a plurality of word line areas each separated from its neighbor by a contact area and bit line oxides whose height is at least a quarter of the distance between neighboring bit line oxides.

Abstract: The present invention is a method, circuit and system for erasing a non-volatile memory cell. A shunting element (e.g. transistor) may be introduced and/or activated between bit-lines to which one or more NVM cells being erased are connected. The shunting element may be located and/or activated across two bit-lines defining a given column of cells, where one or a subset of cells from the column may be undergoing an erase operation or procedure. The shunting element may be located, and/or activated, at some distance from the two bit-lines defining the given column of cells, and the shunting element may be electrically connected to the bit-lines defining the column through select transistors and/or through global bit-lines.

Abstract: A method and a system for operating bits of memory cells in a memory array, the method including applying a first operating pulse to a terminal of a first cell, the first operating pulse is intended to place the first cell into a predefined state; and applying a second operating pulse to a terminal of a second cell in the set, the second operating pulse is intended to place the second cell to the predefined state, and the pulse characteristics of the second operating pulse are a function of the response of the first cell to the first operating pulse.

Abstract: A non-volatile memory array includes a multiplicity of memory cells, each of whose area is less than 4 F2 per cell (where F is a minimum feature size), and periphery elements to control the memory cells. The present invention also includes a non-volatile memory array which includes word lines and bit lines generally perpendicular to the word lines, with a word line pitch of less than 2 F. In one embodiment, the word lines are made of polysilicon spacers.

Abstract: A non-volatile memory array has word lines spaced a sub-F (sub-minimum feature size F) width apart and bit lines generally perpendicular to the word lines. The present invention also includes a method for word-line patterning of a non-volatile memory array which includes generating sub-F word lines from mask generated elements with widths of at least a minimum feature size F.

Abstract: A method includes determining groups of rows to erase together in order to minimize the margin loss associated with bake after a large number of program and erasure cycles. The method alternatively includes determining groups of rows to erase together to minimize the width of a resultant erase threshold voltage distribution, erasing the groups together, stopping erasure of a group when the group is erase verified and performing the step of erasing on those groups which were not previously erase verified.

Abstract: A method protecting a non-volatile memory device, the method including forming a non-volatile memory device including a polycide structure formed over a non-conducting charge trapping layer, and forming a protective layer over at least a portion of the polycide structure, die protective layer being adapted to absorb electromagnetic wave energy having a wavelength shorter than visible light. A device constructed in accordance with the method is also disclosed.

Abstract: A method for programming one or more reference cells is described. The reference cell is programmed a predetermined amount, its program state is sensed relative to a prescribed cell on the same die (e.g., a memory cell or a golden bit cell), and the programming process continues until the reference cell fails a preselected read operation. In one preferred embodiment, the memory cell used during the reference cell programming process is the cell in the memory array having the highest native threshold value. In another preferred embodiment, the memory cell used during the reference cell programming process is a native cell that is on-board the die containing the memory array, but not a cell within the memory array.

Abstract: A non-volatile electrically erasable programmable read only memory (EEPROM) capable of storing two bit of information having a nonconducting charge trapping dielectric, such as silicon nitride, sandwiched between two silicon dioxide layers acting as electrical insulators is disclosed. The invention includes a method of programming, reading and erasing the two bit EEPROM device. The nonconducting dielectric layer functions as an electrical charge trapping medium. A conducting gate layer is placed over the upper silicon dioxide layer. A left and a right bit are stored in physically different areas of the charge trapping layer, near left and right regions of the memory cell, respectively. Each bit of the memory device is programmed in the conventional manner, using hot electron programming, by applying programming voltages to the gate and to either the left or the right region while the other region is grounded.

Abstract: A buried bitline (BB) may be formed in at least two separate implantation steps, in addition to a pocket implant step. The pocket implant has a first width (W1) and a first depth (D1); the first BB implant has a second width (W2) defined by first sidewall spacers and a second depth (D2); the third BB implant has a third width (W3) defined by second sidewall spacers and a third depth (D3); the second width (W2) is less than the first width (W1), and the third width (W3) is less than or equal to the second width (W2); and the second depth (D2) is greater than the first depth (D1), and the third depth (D3) is greater than the second depth (D2). The first BB implant may provide for pocket implant (PI) to bitline (BL) edge optimization; and the second BB implant may provide for controlling BL resistance.

Abstract: The present invention is a multi-phase method, circuit and system for programming non-volatile memory (“NVM”) cells in an NVM array. The present invention may include a controller to determine when, during a first programming phase, one or more NVM cells of a first set of cells reaches or exceeds to first intermediate voltage, and to cause a charge pump circuit to apply to a terminal of the one or more cells in the first set second phase programming pulses to induce relatively greater threshold voltage changes in cells having less stored charge than in cells having relatively more stored charge.

Abstract: A method for reading a bit of a memory cell in a non-volatile memory (NVM) cell array, the method comprising providing a memory cell comprising a bit to be read and at least one other bit not to be read, and reading the bit to be read with respect to a multi-bit reference cell, the reference cell comprising a first bit at a first non-ground programmed state and a second bit at a second non-ground programmed state. Compared with the prior art, the present invention may enable achieving an improved sensing accuracy together with improved read disturb immunity.

Abstract: A non-volatile electrically erasable programmable read only memory (EEPROM) capable of storing two bit of information having a nonconducting charge trapping dielectric, such as silicon nitride, sandwiched between two silicon dioxide layers acting as electrical insulators is disclosed. A left and a right bit are stored in physically different areas of the charge trapping layer, near left and right regions of the memory cell, respectively. Two bits are able to be programmed and read due to a combination of relatively low gate voltages with reading in the reverse direction. This greatly reduces the potential across the trapped charge region. This permits much shorter programming times by amplifying the effect of the charge trapped in the localized trapping region associated with each of the bits.

Abstract: A method for creating a non-volatile memory array includes implanting pocket implants in a substrate at least between mask columns of a given width and at least through an ONO layer covering the substrate, generating increased-width polysilicon columns from the mask columns, generating bit lines in the substrate at least between the increased-width polysilicon columns and depositing oxide at least between the polysilicon columns.

Abstract: A method and a system for operating bits of memory cells in a memory array, the method including applying a first operating pulse to a terminal of a first cell, the first operating pulse is intended to place the first cell into a predefined state; and applying a second operating pulse to a terminal of a second cell in the set, the second operating pulse is intended to place the second cell to the predefined state, and the pulse characteristics of the second operating pulse are a function of the response of the first cell to the first operating pulse.

Abstract: A die for a memory array may store Flash and EEPROM bits in at least one Nitride Read Only Memory (NROM) array. Each array may store Flash, EEPROM or both types of bits.

Abstract: A method for programming one or more reference cells is described. The reference cell is programmed a predetermined amount, its program state is sensed relative to a prescribed cell on the same die (e.g., a memory cell or a golden bit cell), and the programming process continues until the reference cell fails a preselected read operation. In one preferred embodiment, the memory cell used during the reference cell programming process is the cell in the memory array having the highest native threshold value. In another preferred embodiment, the memory cell used during the reference cell programming process is a native cell that is on-board the die containing the memory array, but not a cell within the memory array.

Abstract: A method and a system for operating bits of memory cells in a memory array, the method including applying a first operating pulse to a terminal of a first cell, the first operating pulse is intended to place the first cell into a predefined state; and applying a second operating pulse to a terminal of a second cell in the set, the second operating pulse is intended to place the second cell to the predefined state, and the pulse characteristics of the second operating pulse are a function of the response of the first cell to the first operating pulse.

Abstract: A method includes changing a read reference level for reading a group of memory cells as a function of changes in a threshold voltage distribution of a different group of memory cells. The changing step includes determining a history read reference level for correct reading of at least one history cell, selecting a memory read reference level according to the first read reference level, and reading non-volatile memory array cells associated with the at least one history cell using the memory read reference level.