Patents by Inventor Bob Melendes

Bob Melendes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8511229
    Abstract: A microcavity structure. In an illustrative embodiment, the microcavity structure includes a first substrate, which has a region of interest. A second substrate with a perforation therein is bonded to the first substrate. The perforation coincides with the region of interest. In a specific embodiment, the first substrate is implemented via a Printed Circuit Board (PCB). The region of interest includes one or more circuit components, including an actuator, such as a bridgewire, thereon or therein. A smoothing layer is included between the PCB and the actuator. A bonding gasket adheres the first substrate to the second substrate. The perforation accommodates energetic material that is selectively ignited via the actuator.
    Type: Grant
    Filed: May 9, 2007
    Date of Patent: August 20, 2013
    Inventors: Amish Desai, Bob Melendes, Ming Lu, Brian Fuchs, Stephen Chau
  • Publication number: 20080276819
    Abstract: A microcavity structure. In an illustrative embodiment, the microcavity structure includes a first substrate, which has a region of interest. A second substrate with a perforation therein is bonded to the first substrate. The perforation coincides with the region of interest. In a specific embodiment, the first substrate is implemented via a Printed Circuit Board (PCB). The region of interest includes one or more circuit components, including an actuator, such as a bridgewire, thereon or therein. A smoothing layer is included between the PCB and the actuator. A bonding gasket adheres the first substrate to the second substrate. The perforation accommodates energetic material that is selectively ignited via the actuator.
    Type: Application
    Filed: May 9, 2007
    Publication date: November 13, 2008
    Inventors: Amish Desai, Bob Melendes, Ming Lu, Brian Fuchs, Stephen Chau