Abstract: A carrier block and plug assembly for use in polishing semiconductor slices and includes a block of stainless steel onto which is secured a Delrin retainer with Delrin plugs seated on the block and within the retainer. A Mylar spacer of variable predetermined thickness is positioned between the block and retainer and around the plugs. The bottom side of the block as well as the top sides of the plug and retainer are machined to be parallel to each other. The thickness of the spacer determines the amount of the slice protruding above the retainer, thickness being based upon the thickness of the slice being polished.The slice is placed over a plug after water or other appropriate liquid has been placed on the plug or slice to provide adhesion of the slice to the plug by surface tension, whereby the slice can freely rotate on the plug and within the retainer during polishing.