Patents by Inventor Bobby Marion Hawkins

Bobby Marion Hawkins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reducing thermal expansion effects in semiconductor packages
    Patent number: 8809125
    Abstract: Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer can be made from a material that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature. The electronic component can be a laser. The first and second materials can be selected to disperse an optical emission from the optical transmitter.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: August 19, 2014
    Assignee: Finisar Corporation
    Inventors: Jose Joaquin Aizpuru, Christopher William Johnson, Bobby Marion Hawkins
  • REDUCING THERMAL EXPANSION EFFECTS IN SEMICONDUCTOR PACKAGES
    Publication number: 20110229702
    Abstract: Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer can be made from a material that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature. The electronic component can be a laser. The first and second materials can be selected to disperse an optical emission from the optical transmitter.
    Type: Application
    Filed: May 27, 2011
    Publication date: September 22, 2011
    Applicant: FINISAR CORPORATION
    Inventors: Jose Joaquin Aizpuru, Christopher William Johnson, Bobby Marion Hawkins
  • Reducing thermal expansion effects in semiconductor packages
    Patent number: 7952108
    Abstract: Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer can be made from a material that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature. The electronic component can be a laser. The first and second materials can be selected to disperse an optical emission from the optical transmitter.
    Type: Grant
    Filed: October 18, 2005
    Date of Patent: May 31, 2011
    Assignee: Finisar Corporation
    Inventors: Jose Joaquin Aizpuru, Christopher William Johnson, Bobby Marion Hawkins