Abstract: A semiconductor memory device may include a parity generating circuit, a memory cell array, an error calculating circuit and an error corrector. The parity generating circuit generates parities having different number of bits according to types of a partial array self-refresh mode, and selects one of the parities to output a first parity. The error calculating circuit calculates an error based on a first data corresponding to the input data and a second parity corresponding to the first parity and outputs a first error data. The error corrector corrects the first data based on the first data and the first error data.

Abstract: A semiconductor memory device includes a memory cell array and an error correction code (ECC) engine. The memory cell array stores bits of normal data and parity data therein. The ECC engine performs a masking operation in a masking mode, the ECC engine calculating the parity data using the normal data. The normal data includes a first section that is to be updated and a second section that is to be saved by the masking operation.

Abstract: A memory that includes a plurality of packet pins, a synchronous memory, and a packet controller. The synchronous memory receives address and control signals in synchronization with a clock signal. The packet controller sequentially receives packet data bits through the packet pins in synchronization with the clock signal when a packet enable signal is activated, and converts the inputted packet data into the address and control signals. Specifically, packet data bits that are first inputted through the packet pins represent an operation mode.

Abstract: A semiconductor memory device includes a fuse box including a plurality of address antifuse circuits, each address antifuse circuit outputting an address fuse signal according to a program state of an antifuse included in the corresponding address antifuse circuit, an address comparator including a plurality of address comparison signal generators, each address comparison signal generator combining a first test signal for determining an initial defect of the antifuse and a corresponding bit of an externally applied address signal to generate a test address, and comparing the test address with the address fuse signal to generate an address comparison signal, and a redundant enable signal generator for enabling a redundancy enable signal in response to a plurality of address comparison signals.

Abstract: A semiconductor memory device may include a parity generating circuit, a memory cell array, an error calculating circuit and an error corrector. The parity generating circuit generates parities having different number of bits according to types of a partial array self-refresh mode, and selects one of the parities to output a first parity. The error calculating circuit calculates an error based on a first data corresponding to the input data and a second parity corresponding to the first parity and outputs a first error data. The error corrector corrects the first data based on the first data and the first error data.

Abstract: A semiconductor memory device includes a memory cell array and an error correction code (ECC) engine. The memory cell array stores bits of normal data and parity data therein. The ECC engine performs a masking operation in a masking mode, the ECC engine calculating the parity data using the normal data. The normal data includes a first section that is to be updated and a second section that is to be saved by the masking operation.

Abstract: Example embodiments are directed to a parallel bit test device and method using error correcting code. The parallel bit test device may include an error detecting and correcting unit configured to count the number of fail bits in an m-bit data signal, for example, by comparing bits of the m-bit data signal with corresponding bits of expected data, where m is a positive integer, and to output correction signals. The error detecting and correcting unit may be further configured to perform at least one logic operation on a correction control signal and comparison signals. The correction control signal may be generated in response to a test mode register set (TMRS) signal set and input by a user such that the logic level of the correction control signal may vary according to the counted number of fail bits. Each comparison signal may include information about a fail bit and the address of the fail bit.

Abstract: A power supply device in a semiconductor memory includes a power control means and a power generation means. The power control means divides a self-refresh section into an active-precharge mode and an idle mode depending on an operation characteristic of the semiconductor memory, and generates a control signal for controlling power strength applied to the semiconductor memory during operation in each mode. The power generation mode generates a different power level in response to a power control signal from the power control means to provide to the semiconductor memory. Meanwhile, the power supply device according to the present invention provides relatively strong power to the semiconductor memory a predetermined time period in advance of the active-precharge mode.

Abstract: A power supply device in a semiconductor memory includes a power control means and a power generation means. The power control means divides a self-refresh section into an active-precharge mode and an idle mode depending on an operation characteristic of the semiconductor memory, and generates a control signal for controlling power strength applied to the semiconductor memory during operation in each mode. The power generation mode generates a different power level in response to a power control signal from the power control means to provide to the semiconductor memory. Meanwhile, the power supply device according to the present invention provides relatively strong power to the semiconductor memory a predetermined time period in advance of the active-precharge mode.

Abstract: A memory that includes a plurality of packet pins, a synchronous memory, and a packet controller. The synchronous memory receives address and control signals in synchronization with a clock signal. The packet controller sequentially receives packet data bits through the packet pins in synchronization with the clock signal when a packet enable signal is activated, and converts the inputted packet data into the address and control signals. Specifically, packet data bits that are first inputted through the packet pins represent an operation mode.

Abstract: A memory system includes a synchronous memory responding to a clock signal and a memory controller generating a chip selection signal, a clock signal, and data packets including commands and addresses. The memory controller includes a packet controller is synchronously operable with the clock signal and converting the data packets into address and control signals adapted to a communication protocol for the synchronous memory when the chip selection signal is active.