Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.

Abstract: A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.

Abstract: An electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode including a conductive resin layer, disposed on the body, and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a metal particle, a first intermetallic compound, and a base resin, and a second intermetallic compound is disposed on a boundary between the conductive resin layer and the plating layer.

Abstract: An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.

Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.

Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.

Abstract: A capacitor component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; first and second external electrodes including first and second connection portions, and first and second band portions extending onto portions of a surface from the first and second connection portions, respectively; first and second plating layers disposed on the first and second band portions, respectively; humidity resistant layers disposed between the first and second external electrodes, disposed on the first and second external electrodes, and having openings respectively exposing portions of the first and second band portions. The first and second plating layers are disposed in the openings of the humidity resistant layers, respectively, and are in contact with the first and second band portions, respectively.

Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.

Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.

Abstract: A capacitor component includes a humidity resistant layer formed on a portion of the external surface of a body on which an external electrode is not formed, and further includes a humidity resistant layer disposed inside the external electrode, to improve humidity resistance reliability. The capacitor component includes an opening portion formed by removing a portion of the humidity resistant layer disposed inside the external electrode to improve electrical connection.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.

Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes, and external electrodes disposed on at least one surface of the body. The external electrodes each includes an electrode layer in contact with the first or second internal electrodes, an intermediate layer disposed on the electrode layer and including a first intermetallic compound, and a conductive resin layer disposed on the intermediate layer and including a plurality of metal particles, a second intermetallic compound and a base resin.

Abstract: A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers.

Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.