Patents by Inventor Bon-youl Ku

Bon-youl Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer testing process of a semiconductor device comprising a redundancy circuit
    Patent number: 5326709
    Abstract: A wafer testing process of a semiconductor device provided with a redundancy circuit. The process comprises a step of removing a passivation film above a pad and link portion, pre-laser testing, laser-repairing, and final quality marking using an off-line inking method. Therefore, fabrication-test processes are simplified to one step by adopting the off-line inking method, thereby achieving productivity improvement, quality enhancement, and reduction of throughput time.
    Type: Grant
    Filed: December 18, 1992
    Date of Patent: July 5, 1994
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hong-bae Moon, Bon-youl Ku, Gi-seung Song, Tae-wook Seo