Abstract: A light emitting diode (LED) package including: an LED chip; a first lead frame having a heat transfer unit with a top where a groove for stably mounting the LED chip is formed; a second lead frame disposed separately from the first lead frame; a package body having a concave portion encapsulating a portion of the heat transfer unit and the second lead frame but exposing a portion of the top of the heat transfer unit and a portion of the lead frame, and a ring-shaped portion extended in a ring shape along an inner wall of the groove of the heat transfer unit and forming an aperture in a center thereof; and a phosphor layer formed on the aperture of the ring-shaped portion and applied to the LED chip, wherein the LED chip is disposed in the inside of the aperture of the ring-shape portion.

Abstract: Provided is a light emitting diode package in accordance with the present invention including a lead frame composed of at least a pair of lead terminals; a mold receiving a part of the lead frame therein and equipped with an irradiation window opened to radiate light, and further including one or more holes formed to expose a part of a bottom surface of the lead frame received in the inside of the mold; an LED chip mounted on the lead frame positioned in the mold; an electrode connection unit for electrically connecting the LED chip and the lead frame; and a molding agent composed of any one selected from transparent epoxy, silicon, and phosphor blends charged in the mold and protecting the LED chip.

Abstract: Provided is a light emitting diode package in accordance with the present invention including a lead frame composed of at least a pair of lead terminals; a mold receiving a part of the lead frame therein and equipped with an irradiation window opened to radiate light, and further including one or more holes formed to expose a part of a bottom surface of the lead frame received in the inside of the mold; an LED chip mounted on the lead frame positioned in the mold; an electrode connection unit for electrically connecting the LED chip and the lead frame; and a molding agent composed of any one selected from transparent epoxy, silicon, and phosphor blends charged in the mold and protecting the LED chip.

Abstract: A light emitting diode (LED) package including: an LED chip; a first lead frame having a heat transfer unit with a top where a groove for stably mounting the LED chip is formed; a second lead frame disposed separately from the first lead frame; a package body having a concave portion encapsulating a portion of the heat transfer unit and the second lead frame but exposing a portion of the top of the heat transfer unit and a portion of the lead frame, and a ring-shaped portion extended in a ring shape along an inner wall of the groove of the heat transfer unit and forming an aperture in a center thereof; and a phosphor layer formed on the aperture of the ring-shaped portion and applied to the LED chip, wherein the LED chip is disposed in the inside of the aperture of the ring-shape portion.

Abstract: Disclosed herein is an optical read and write apparatus. The optical read and write apparatus includes a deck base, a pickup base, a transfer guide and one or more tension springs. In the deck base, an opening is formed in the center portion thereof, a main shaft and a secondary shaft are disposed at both sides of the opening, and a turntable is mounted on one side thereof. In the pickup base, an object lens is provided in the center portion thereof, a guide member having a guide groove fitted around the secondary shaft is formed in the rear portion thereof, and an adjusting screw is extended from the front thereof. In the transfer guide, a connection hole is formed to receive the adjusting screw and to allow the transfer guide to be joined to the pickup base by an adjusting nut and a guide hole is formed to be fitted around the main shaft. The tension springs are positioned between the pickup base and the transfer guide to elastically press the pickup base.

Abstract: An optical writing and reading apparatus is disclosed. The apparatus has a deck base having an opening at its center, on which an optical pickup including an object-glass is mounted to be moved along both sides of the opening, and which is formed adjacent to the opening with a center hole elongated in a direction perpendicular to a moving direction of the optical pickup, and is formed around the center hole with a plurality of fastening holes into which screws are screwed, and a spindle motor having a turntable at its shaft and having an integral bracket at its bottom surface, the bracket being formed at its center with a center reference hole and formed around the center reference hole with assembling holes elongated in a direction perpendicular to a moving direction of the optical pickup, the assembling holes being arranged at positions corresponding to the fastening holes of the deck base.

Abstract: Disclosed herein is an optical read and write apparatus. The optical read and write apparatus includes a deck base, a pickup base, a transfer guide and one or more tension springs. In the deck base, an opening is formed in the center portion thereof, a main shaft and a secondary shaft are disposed at both sides of the opening, and a turntable is mounted on one side thereof. In the pickup base, an object lens is provided in the center portion thereof, a guide member having a guide groove fitted around the secondary shaft is formed in the rear portion thereof, and an adjusting screw is extended from the front thereof. In the transfer guide, a connection hole is formed to receive the adjusting screw and to allow the transfer guide to be joined to the pickup base by an adjusting nut and a guide hole is formed to be fitted around the main shaft. The tension springs are positioned between the pickup base and the transfer guide to elastically press the pickup base.

Abstract: An optical writing and reading apparatus is disclosed. The apparatus has a deck base having an opening at its center, on which an optical pickup including an object-glass is mounted to be moved along both sides of the opening, and which is formed adjacent to the opening with a center hole elongated in a direction perpendicular to a moving direction of the optical pickup, and is formed around the center hole with a plurality of fastening holes into which screws are screwed, and a spindle motor having a turntable at its shaft and having an integral bracket at its bottom surface, the bracket being formed at its center with a center reference hole and formed around the center reference hole with assembling holes elongated in a direction perpendicular to a moving direction of the optical pickup, the assembling holes being arranged at positions corresponding to the fastening holes of the deck base.

Abstract: An apparatus for controlling an optical pickup and an optical writing and reading apparatus having the same are disclosed. A main shaft and a sub shaft, on which an optical pickup for writing and reading information is movably mounted, are raised and lowered at opposite ends of the shafts by adjusters. The adjusters each comprise a casing fixed to four corners of a deck base and having an inner space and a side gate into which an end of the main and sub shafts is inserted, a spring disposed between the casing and the end of the main and sub shafts to bias the end downward, a base plate attached to a lower surface of the casing, and an adjustable screw tightened to the base plate to move the end of the main and sub shafts upward.