Abstract: The present invention relates to an insulating gas used for electrical insulation or arc extinguishing of an electrical device, and an electrical device for insulating electricity using the same. The insulating gas of the present invention, which may replace SF6 gas, consists of a mixed gas of trifluoromethyl trifluorovinyl ether (CF3OCFCF2) and a carrier gas. The insulating gas of the present invention has the characteristics of a low boiling point, high dielectric strength, low toxicity, and a low global warming potential (GWP=1 or less), and thus may replace SF6, and the low global warming potential with no loss of high insulating capacity and arc extinguishing capability may reduce greenhouse gases.

Abstract: A light emitting element includes: a first semiconductor layer; an active layer provided on the first semiconductor layer; a second semiconductor layer provided on the active layer; and an insulative film around at least a portion of the first semiconductor layer, the active layer, and the second semiconductor layer, which are sequentially provided in a first direction. The active layer may include a first barrier layer, a first well layer, and a second barrier layer, which are sequentially provided in the first direction, and the first well layer may include first holes penetrating the first well layer.

Abstract: A device to prevent fire of a fusing belt having a heater positioned inside includes at least one temperature control member adjacent to one side of the fusing belt and, when the at least one temperature control member detects abnormal heat from the fusing belt based on a temperature of the fusing belt, the at least one temperature control member to cut off a supply of electricity to the heater to prevent the fire. The device also includes a heat absorption member adjacent to the other side of the fusing belt and to absorb latent heat from the fusing belt to lower the temperature of the fusing belt to prevent the fire.

Abstract: An embodiment armrest assembly for a vehicle includes an armrest rotatably coupled to an armrest board and configured to be extended from the armrest board by rotating forward or to be housed in the armrest board by rotating and standing and a speed-reduction damper mechanism connecting the armrest and the armrest board and configured to make a rotational speed of the armrest uniform by reducing the rotational speed when the armrest rotates to be extended.

Abstract: An embodiment armrest assembly for a vehicle includes an armrest including a main body and a lid, an armrest board to which the armrest is rotatably coupled and in which the armrest is accommodated in an erect state, and a skirt coupled to a rear bezel housing of the lid and to the armrest board and correspondingly covering a rear space of the lid when the armrest is rotated forward, wherein the skirt has a panel shape and includes a hard material.

Abstract: The inventive concept relates to a three-dimensional crosslinker composition and a method of manufacturing an electronic device using the same. According to the inventive concept, the three-dimensional crosslinker composition may be represented by Formula 1 below.

Abstract: A thermoplastic resin composition of the present invention comprises: approximately 100 parts by weight of a polyester resin; approximately 5-30 parts by weight of a polycarbonate resin; approximately 50-150 parts by weight of a flat glass fiber; approximately 2-10 parts by an epoxy-modified olefin-based copolymer; and approximately 2-10 parts by weight of a maleic anhydride-modified ethylene-propylene-diene monomer terpolymer, wherein the weight ratio of the epoxy-modified olefin-based copolymer and the maleic anhydride-modified ethylene-propylene-diene monomer terpolymer is approximately 1:0.5 to 1:2. The thermoplastic resin composition has excellent metal bonding property, impact resistance, stiffness, retention heat stability, balance of physical properties thereof, and the like.

Abstract: A polyamide resin composition includes: about 100 parts by weight of a polyamide resin including about 5% by weight (wt%) to about 55 wt% of an aromatic polyamide resin and about 45 wt% to about 95 wt% of an aliphatic polyamide resin; about 100 parts by weight to about 200 parts by weight of glass fiber; about 20 parts by weight to about 25 parts by weight of a poly(ether ester amide) block copolymer; and about 0.1 parts by weight to about 2 parts by weight of talc, wherein the poly(ether ester amide) block copolymer is a block copolymer of a reaction mixture including an amino carboxylic acid having 6 or more carbon atoms, a lactam or a salt of diamine-dicarboxylic acid, poly(tetramethylene glycol), and a dicarboxylic acid having 4 to 20 carbon atoms. The polyamide resin composition can have good properties in terms of bonding strength and detachability with respect to a polyurethane bonding agent, impact resistance, heat resistance, rigidity, and the like.

Abstract: A thermoplastic resin composition according to the present invention contains about 100 parts by weight of a polycarbonate resin, about 5 to about 50 parts by weight of a polyolefin resin, about 5 to about 50 parts by weight of a glass fiber, and about 1 to about 20 parts by weight of a modified olefin-based copolymer, wherein the modified olefin-based copolymer includes an epoxy-modified olefin-based copolymer and a maleic acid anhydride-modified olefin-based copolymer, and the weight ratio of the epoxy-modified olefin-based copolymer to the maleic acid anhydride-modified olefin-based copolymer is about 1:0.05 to about 1:15. The thermoplastic resin composition has excellent stiffness, impact resistance, and the like, and has a low specific gravity, dielectric constant, dielectric dissipation factor, and the like.

Abstract: A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a thermoplastic resin including a polyester resin; about 50-150 parts by weight of glass fibers; and about 1-10 parts by weight of a polyether-ester copolymer, wherein the polyether-ester copolymer has a melt volume flow rate (MVR) of about 30-120 cm3/10 min as measured under conditions of 230° C. and 2.16 kg based on ISO 1133. The thermoplastic resin composition is excellent in impact resistance, appearance characteristics, metal joining properties, and the like.

Abstract: A thermoplastic resin composition includes about 100 parts by weight of a polybutylene terephthalate resin, about 3 parts by weight to about 33 parts by weight of a polycarbonate resin, about 60 parts by weight to about 120 parts by weight of glass fiber, and about 1 part by weight to about 9 parts by weight of a glycidyl methacrylate-modified polyolefin, wherein the glass fiber and the glycidyl methacrylate-modified polyolefin are present in a weight ratio of about 1:0.02 to about 1:0.12. The thermoplastic resin composition can have good properties in terms of glass adhesion, metal bonding, impact resistance, and balance therebetween.

Abstract: A thermoplastic resin composition includes about 100 parts by weight of a polybutylene terephthalate resin, about 3 parts by weight to about 33 parts by weight of a polycarbonate resin, about 60 parts by weight to about 120 parts by weight of glass fiber, and about 0.01 parts by weight to about 1.6 parts by weight of talc having an average particle diameter of about 3 µm to about 6 µm, wherein the glass fiber and the talc are present in a weight ratio of about 50:1 to about 5,000:1. The thermoplastic resin composition can have good properties in terms of glass adhesion, metal bonding, fluidity, impact resistance, and balance therebetween.

Abstract: A thermoplastic resin composition according to the present invention comprises: about 100 parts by weight of a polycarbonate resin; about 5 to about 100 parts by weight of an inorganic filler; about 0.1 to about 2 parts by weight of a maleic anhydride-modified olefin-based copolymer; and about 0.1 to about 2 parts by weight of a phosphite compound represented by chemical formula 1. The thermoplastic resin composition is excellent in terms of chemical resistance, impact resistance, rigidity, physical property balance thereof, and the like.

Abstract: A thermoplastic resin composition of the present invention comprises: about 5 wt % to about 35 wt % of a modified polyaryletherketone resin comprising a repeat unit represented by chemical formula 1; about 5 wt % to about 35 wt % of a polyether ether ketone resin; about 20 wt % to about 40 wt % of a polyphenylsulfone resin; and about 15 wt % to about 50 wt % of glass fibers. The thermoplastic resin composition has good properties in terms of adhesion to metals, impact resistance, and so on.

Abstract: A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a polyester resin; about 15 to about 100 parts by weight of glass fibers; and about 2 to about 20 parts by weight of a modified olefin copolymer, the modified olefin copolymer comprising an epoxy modified olefin copolymer and a maleic anhydride modified olefin copolymer, wherein the weight ratio of the epoxy modified olefin copolymer and the maleic anhydride modified olefin copolymer is about 1:0.3 to about 1:3. The thermoplastic resin composition has excellent impact resistance, chemical resistance, and the like.

Abstract: A thermoplastic resin composition of the present invention comprises: approximately 100 parts by weight of a polycarbonate resin; approximately 1-10 parts by weight of an additive for laser direct structuring; approximately 0.1-7 parts by weight of a maleic anhydride-modified olefin-based copolymer; and approximately 0.1-4 parts by weight of a phosphite compound represented by chemical formula 1. The thermoplastic resin composition has excellent plating reliability, impact resistance, chemical resistance and the like, and generates a small amount of gas during injection molding, and thus has excellent injection stability.

Abstract: A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a thermoplastic resin including a polyester resin; about 50-150 parts by weight of glass fibers; and about 1-10 parts by weight of a polyether-ester copolymer, wherein the polyether-ester copolymer has a melt volume flow rate (MVR) of about 30-120 cm3/10 min as measured under conditions of 230° C. and 2.16 kg based on ISO 1133. The thermoplastic resin composition is excellent in impact resistance, appearance characteristics, metal joining properties, and the like.

Abstract: A thermoplastic resin composition according to the present invention contains about 100 parts by weight of a polycarbonate resin, about 5 to about 50 parts by weight of a polyolefin resin, about 5 to about 50 parts by weight of a glass fiber, and about 1 to about 20 parts by weight of a modified olefin-based copolymer, wherein the modified olefin-based copolymer includes an epoxy-modified olefin-based copolymer and a maleic acid anhydride-modified olefin-based copolymer, and the weight ratio of the epoxy-modified olefin-based copolymer to the maleic acid anhydride-modified olefin-based copolymer is about 1:0.05 to about 1:15. The thermoplastic resin composition has excellent stiffness, impact resistance, and the like, and has a low specific gravity, dielectric constant, dielectric dissipation factor, and the like.

Abstract: A semiconductor package includes a semiconductor chip and a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip and of which upper surface is exposed to the outside. Since the semiconductor package may include the PDMS layer, heat emitting performance of the semiconductor package in a vacuum state may improve.

Abstract: A thermoplastic resin composition according to the present invention comprises: about 100 parts by weight of a polycarbonate resin; about 5 to about 100 parts by weight of an inorganic filler; about 0.1 to about 2 parts by weight of a maleic anhydride-modified olefin-based copolymer; and about 0.1 to about 2 parts by weight of a phosphite compound represented by chemical formula 1. The thermoplastic resin composition is excellent in terms of chemical resistance, impact resistance, rigidity, physical property balance thereof, and the like.