Abstract: A three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. The device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.

Abstract: A digital broadcasting data reception unit receives digital broadcasting data. A multimedia module parses the digital broadcasting data into video and audio data to output the video and audio data. A terminal control unit receives the digital broadcasting data from the digital broadcasting data reception unit when it is transmitted to the multimedia module, and parses the received digital broadcasting data into the video and audio data. A memory unit stores the video and audio data into which the digital broadcasting data is parsed by the terminal control unit according to a control operation of the terminal control unit.

Abstract: A digital broadcasting data reception unit receives digital broadcasting data. A multimedia module parses the digital broadcasting data into video and audio data to output the video and audio data. A terminal control unit receives the digital broadcasting data from the digital broadcasting data reception unit when it is transmitted to the multimedia module, and parses the received digital broadcasting data into the video and audio data. A memory unit stores the video and audio data into which the digital broadcasting data is parsed by the terminal control unit according to a control operation of the terminal control unit.