Patents by Inventor Bong Su Ko

Bong Su Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969011
    Abstract: A cigarette includes a tobacco rod, a front end plug positioned at a front end of the tobacco rod, a filter rod positioned at a rear end of the tobacco rod, and a wrapper surrounding the tobacco rod, the front end plug, and the filter rod and including at least one perforation formed in an area of the wrapper to allow air to flow to the inside of the wrapper.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: April 30, 2024
    Assignee: KT&G CORPORATION
    Inventors: Jung Seop Hwang, Dong Kyun Ko, Jae Sung Noh, Bong Su Cheong, Sang Won Choi
  • Patent number: 11944118
    Abstract: Provided is an aerosol-generating article including a wrapper which is discolored as the aerosol-generating material is heated, the aerosol-generating article including: a tobacco rod; a front-end plug arranged on a side of the tobacco rod; a filter rod arranged on the other side of the tobacco rod; and the wrapper surrounding the tobacco rod, the front-end plug, and the filter rod, wherein the wrapper includes a thermochromic material which is heated and discolored by an aerosol-generating device when the aerosol-generating article is inserted into the aerosol-generating device.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: April 2, 2024
    Assignee: KT&G CORPORATION
    Inventors: Bong Su Cheong, Dong Kyun Ko, Jae Sung Noh, Sang Won Choi, Jung Seop Hwang
  • Publication number: 20220392778
    Abstract: A semiconductor package manufacturing method of the disclosure includes providing a PCB substrate that extends in a first direction and a second direction perpendicular to the first direction, forming a solder resist layer on the PCB substrate, partially removing the solder resist layer, thereby forming solder resist patterns, disposing semiconductor chips at opposite sides of each of the solder resist patterns, forming a mold layer covering a portion of the PCB substrate, covering the semiconductor chips, and covering at least a portion of each of the solder resist patterns, and cutting the PCB substrate and the mold layer, thereby forming semiconductor packages. In a third direction perpendicular to the first and second directions a height of the solder resist patterns may be greater than a height of the semiconductor chips while being smaller than a height of the mold layer.
    Type: Application
    Filed: January 4, 2022
    Publication date: December 8, 2022
    Inventor: Bong Su KO
  • Patent number: 6292185
    Abstract: A method and apparatus for tailoring the appearance of a graphical user interface, specifically an internet web browser. A host server receives a request over the internet or an intranet for a web page. The host server provides the necessary data and executable files for the user's personal computer. A computer program executed on a personal computer alters the appearance of a user's graphical web browser by accessing data files. The appearance of a web browser can be tailored using an editor program to provide data files used to tailor the appearance of a web browser.
    Type: Grant
    Filed: April 27, 1998
    Date of Patent: September 18, 2001
    Assignee: C.C.R., Inc.
    Inventors: Bong Su Ko, Jae Hyun Kim, Seok Ho Youn