Abstract: A fiber array unit (200) and a photonics system (890), a fiber array unit (200) comprises a substrate (205) with a first el end and a second end. A first mesa (207) is adjacent to the first end and a second mesa (209) is adjacent to the second end. A v-groove (211) is in the first mesa (207) and a slot (213) is in the second mesa (209). The v-groove (211) is aligned with the slot (213).

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.

Abstract: A semiconductor photonic package can include a laser module and a photonic integrated circuit (PIC), each having a different operating temperature. The two modules are placed on a common substrate allowing accurate optical alignment. In addition, a thermal barrier is integrated into the substrate between the laser module and the PIC to provide thermal stability, especially to the laser module. The substrate can include a housing with good electrical conductivity or an optical substrate and housing. The thermal barrier is integrated into the optical substrate, the housing, or both. The thermal barrier in the optical substrate can be a cutout that does not divide the optical substrate into two separate pieces.

Abstract: Technologies for beam expansion and collimation for photonic integrated circuits (PICs) are disclosed. In one embodiment, an ancillary die is bonded to a PIC die. Vertical couplers in the PIC die direct light from waveguides to flat mirrors on a top side of the ancillary die. The flat mirrors reflect the light towards curved mirrors defined in the bottom surface of the ancillary die. The curved mirrors collimate the light from the waveguides. In another embodiment, a cavity is formed in a PIC die, and curved mirrors are formed in the cavity. Light beams from waveguides in the PIC die are directed to the curved mirrors, which collimate the light beams.

Abstract: Technologies for coupling to and from a photonic integrated circuit (PIC) with an optical isolator are disclosed. In one embodiment, light beams from waveguides on a PIC die are reflected towards flat mirrors on the bottom surface of the PIC die. The flat mirrors reflect the light towards curved mirrors defined in a top surface of the PIC die, which collimate the beam and direct the collimated beams out the bottom surface of the PIC die. An optical isolator below the PIC die can allow the beams to pass while blocking beams in the opposite direction.

Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

Abstract: A photonic integrated circuit (PIC) package comprising a first die, the first die comprising a first optical waveguide and a first trench extending from a first edge of the first die to the first optical waveguide. The first trench is aligned with the first optical waveguide. A second die comprises a second optical waveguide and a second trench extending from a second edge of the second die to the second optical waveguide. The second trench is aligned with the second optical waveguide. An optical wire comprising an uncladded glass fiber comprises a first terminal portion extending within the first trench and a second terminal portion extending within the second trench. The first terminal portion is aligned with the first optical waveguide and the second terminal portion is aligned with the second optical waveguide.

Abstract: Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.

Abstract: In one embodiment, a package includes: a substrate; a photonic integrated circuit (PIC) adapted to the substrate, the PIC including at least one optical circuit, a first plurality of waveguides, a second plurality of waveguides, and a laser to output optical energy via the first plurality of waveguides; and a prism assembly adapted to the substrate to reflect the optical energy output from the first plurality of waveguides to the second plurality of waveguides, the prism assembly including a prism and at least one isolator. Other embodiments are described and claimed.

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Abstract: Embodiments of the present disclosure are directed to an optical transceiver within a single device. The optical transceiver incorporates an optical isolator, thus eliminating the need for an external isolator unit. In embodiments, transmitter channels and receiver channels share a single lens array and incorporate a compensator block to equalize the transmitter and receiver optical signals in the transceiver. Other embodiments may be described and/or claimed.

Abstract: An apparatus comprises a horizontal array of emitter/detector pairs; an array of lens pairs mounted above and aligned with emitter/detector pairs; and a first curved reflective surface positioned such that for each emitter/detector pair and corresponding lens pair, light from the emitter that passes through a lens of the lens pair is redirected into the far field, and light arriving from the far field is redirected through the other lens of the lens pair onto the detector. Light from each emitter is emitted upwards along a vertical axis, and light received by each detector is incident on the detector downwards along a vertical axis. If light emitted from the first array and reflected by the first surface into the far field reflects off an object in the far field and returns to the apparatus, the returning light is reflected off the first surface and detected by the first array.

Abstract: Disclosed herein are photonic package assemblies, packages, and devices that include photonic dies and optical coupling structures aligned with photonic dies to enable exchange of electromagnetic signals. In one aspect, a photonic package assembly includes a photonic integrated circuit (PIC) die having one or more PICs, and an optical coupling structure (OCS) positioned adjacent to the PIC die such that electromagnetic signals may be exchanged between at least one of the one or more PICs and the OCS. The assembly further includes a structure that forms a bridge, and, thereby, provides mechanical coupling, between the OCS and the PIC die. Providing a bridge structure that directly attaches an OCS to a PIC die may improve achieving and maintaining the desired alignment between the OCS and the PIC die, which may lead to an improved coupling performance over the lifetime of products.

Abstract: Disclosed herein are photonic package assemblies, packages, and devices that include photonic dies and optical coupling structures aligned with photonic dies to enable exchange of electromagnetic signals. In one aspect, a photonic package assembly includes a photonic integrated circuit (PIC) die having one or more PICs, and an optical coupling structure (OCS) positioned adjacent to the PIC die such that electromagnetic signals may be exchanged between at least one of the one or more PICs and the OCS. The assembly further includes a structure that forms a bridge, and, thereby, provides mechanical coupling, between the OCS and the PIC die. Providing a bridge structure that directly attaches an OCS to a PIC die may improve achieving and maintaining the desired alignment between the OCS and the PIC die, which may lead to an improved coupling performance over the lifetime of products.

Abstract: Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.

Abstract: An apparatus comprises a horizontal array of emitter/detector pairs; an array of lens pairs mounted above and aligned with emitter/detector pairs; and a first curved reflective surface positioned such that for each emitter/detector pair and corresponding lens pair, light from the emitter that passes through a lens of the lens pair is redirected into the far field, and light arriving from the far field is redirected through the other lens of the lens pair onto the detector. Light from each emitter is emitted upwards along a vertical axis, and light received by each detector is incident on the detector downwards along a vertical axis. If light emitted from the first array and reflected by the first surface into the far field reflects off an object in the far field and returns to the apparatus, the returning light is reflected off the first surface and detected by the first array.

Abstract: Direct pin attachment is the most compact method to connect the OSA and the PCBA, due to better performance in general and allows maximum PCBA space for more functionality. However, direct pin attachment can result in concentrated stress in the OSA-PCBA joint area, which can affect the reliability and yield of the module. To overcome the problem, an integrated transceiver cage and housing is provided including a direct pin attachment with reinforcing tabs, which are fixed to the PCBA prior to the pins to transfer any stress between the OSA and PCBA, thereby reducing the amount of stress applied to the pins.

Abstract: An optical module is provided for mounting in a cage of a host device. The optical module includes at least one optical subassembly (OSA) and a printed circuit board (PCB) supported by a first housing structure. The optical module also includes a latch mechanism, which includes a lever and a latch, as well as a clamp. A pivot pin of the latch is rotatably supported by the first housing structure and the clamp in cooperation. Advantageously, the clamp secures both the OSA and the latch, while providing access to the PCB.

Abstract: Direct pin attachment is the most compact method to connect the OSA and the PCBA, due to better performance in general and allows maximum PCBA space for more functionality. However, direct pin attachment can result in concentrated stress in the OSA-PCBA joint area, which can affect the reliability and yield of the module. To overcome the problem, an integrated transceiver cage and housing is provided including a direct pin attachment with reinforcing tabs, which are fixed to the PCBA prior to the pins to transfer any stress between the OSA and PCBA, thereby reducing the amount of stress applied to the pins.

Abstract: An optical module is provided for mounting in a cage of a host device. The optical module includes at least one optical subassembly (OSA) and a printed circuit board (PCB) supported by a first housing structure. The optical module also includes a latch mechanism, which includes a lever and a latch, as well as a clamp. A pivot pin of the latch is rotatably supported by the first housing structure and the clamp in cooperation. Advantageously, the clamp secures both the OSA and the latch, while providing access to the PCB.