Abstract: A time domain reflectometry (“TDR”) testing method that includes storing test data resulted from a TDR test applied on an electronic component, displaying the test data, identifying a distinctive portion of the test data corresponding to a defective location in the electronic component, modifying the distinctive portion of the test data, and computing the modified test data to verify whether a predetermined requirement is satisfied.

Abstract: A TDR testing method comprises storing test data resulted from a TDR test applied on an electronic component, displaying the test data, identifying a distinctive portion of the test data corresponding to a defective location in the electronic component, modifying the distinctive portion of the test data, and computing the modified test data to verify whether a predetermined requirement is satisfied.

Abstract: The invention provides a substrate layout method and structure of a ball grid array to reduce cross talk of adjacent signals. The substrate comprises a plurality of signal pads formed on a die, a ring around the die, and a plurality of signal fingers around the ring. The substrate layout method for reducing cross talk of adjacent signals is as follows: First, forming a guard pad between two adjacent signal pads. Second, forming a guard finger between two adjacent signal fingers. Next, forming a bonding wire to connect the guard pad to the ring. Then, forming another bonding wire to connect the ring to the guard finger. Subsequently, forming a guard trace to connect the guard finger to a via at the edge of the substrate, and connecting the guard trace to a short-circuiting place through the via.

Abstract: The invention provides a substrate layout method and structure of a ball grid array to reduce cross talk of adjacent signals. The substrate comprises a plurality of signal pads formed on a die, a ring around the die, and a plurality of signal fingers around the ring. The substrate layout method for reducing cross talk of adjacent signals is as follows: First, forming a guard pad between two adjacent signal pads. Second, forming a guard finger between two adjacent signal fingers. Next, forming a bonding wire to connect the guard pad to the ring. Then, forming another bonding wire to connect the ring to the guard finger. Subsequently, forming a guard trace to connect the guard finger to a via at the edge of the substrate, and connecting the guard trace to a short-circuiting place through the via.