Abstract: A handle for an oral-care implement for safe and hygienic use by multiple users includes an electrical motor and a detachable head. The handle has a display for displaying instructions to control functional operation of the handle, a microcontroller for controlling the motor and the display, and at least one switch to allow a user to control the functional operation of the handle, including causing the output element to vibrate in at least one oral-hygiene mode having an oral-hygiene frequency and causing the output element to vibrate in a disinfection mode when the handle is being disinfected before or after being used for the oral-hygiene routine. The disinfection mode has a modulated frequency, different from the oral-hygiene frequency, and alternating up and down between a low modulated frequency and a high modulated frequency, wherein the high modulated frequency is at least 50 percent greater than the low modulated frequency.

Abstract: A handle for an oral-care implement for safe and hygienic use by multiple users includes an electrical motor and a detachable head. The handle has a display for displaying instructions to control functional operation of the handle, a microcontroller for controlling the motor and the display, and at least one switch to allow a user to control the functional operation of the handle, including causing the output element to vibrate in at least one oral-hygiene mode having an oral-hygiene frequency and causing the output element to vibrate in a disinfection mode when the handle is being disinfected before or after being used for the oral-hygiene routine. The disinfection mode has a modulated frequency, different from the oral-hygiene frequency, and alternating up and down between a low modulated frequency and a high modulated frequency, wherein the high modulated frequency is at least 50 percent greater than the low modulated frequency.

Abstract: A handle for an oral-care implement, the handle comprises an electrical motor arranged to drive an output element structured and configured to couple the handle and a head attachable to and detachable from the handle; and a microcontroller for controlling the motor and to cause the output element to vibrate in (a) at least one oral-hygiene mode during which the oral-care implement is being used for an oral-hygiene routine, wherein the output element is vibrating at a substantially constant frequency, and (b) a disinfection mode during which the handle is being disinfected, before or after being used for the oral-hygiene routine, wherein the output element is continuously vibrating at a modulated frequency alternating within a frequency range of between about 140 Hz and about 250 Hz, for a duration of the disinfection mode.

Abstract: A temperature control system, a wafer chuck, a thermal module for use with the chuck, and an apparatus for use in semiconductor manufacture are disclosed herein. The temperature control system includes: a target having a temperature, a fluid circulation loop coupled to the target for controlling the temperature of the target, a heating heat exchanger coupled to the fluid circulation loop for selectively providing heat to the fluid circulation loop, a cooling heat exchanger coupled to the fluid circulation loop for selectively providing cooling to the fluid circulation loop and a plurality of thermal electric elements carried by the target for selectively providing heating or cooling to the target. The heating heat exchanger and cooling heat exchanger provide gross control of the temperature of the target, and the plurality of thermal electric elements provide fine control of the temperature of the target.

Abstract: A support pedestal device for an electrostatic chuck includes a base housing defining an internal cavity, and a base insert disposed proximate the internal cavity of the base housing. A fluid pathway is formed in the internal cavity and includes a plurality of linear-parallel cooling channels separated by corresponding plurality of linear-parallel cooling fins, a fluid supply channel, and a fluid return channel. A cooling fluid flows through the fluid supply channel, through the plurality of linear-parallel cooling channels, and back through the fluid return channel to cool the support pedestal device.

Abstract: A temperature control system for a semiconductor manufacturing process having at least one target includes: a heat exchange loop operatively associated with each target, and a mixing valve operatively associated with each heat exchange loop. This mixing valve has a body defining a mixing chamber. The mixing chamber has an inlet, an outlet, a hot inlet, a cold inlet, and a closure means associated with each inlet. Alternatively, the mixing valve may include: a body defining a mixing chamber, the mixing chamber having an inlet, an outlet, a hot inlet, and a cold inlet, a moveable gate operatively associated with each inlet for controlling the flow of fluid through said inlets, and a motor for moving the gates. A process for manufacturing semiconductors includes the step of providing a temperature control system having at least one target including a mixing valve, as described above.

Abstract: A temperature control system, a wafer chuck, a thermal module for use with the chuck, and an apparatus for use in semiconductor manufacture are disclosed herein. The temperature control system includes: a target having a temperature, a fluid circulation loop coupled to the target for controlling the temperature of the target, a heating heat exchanger coupled to the fluid circulation loop for selectively providing heat to the fluid circulation loop, a cooling heat exchanger coupled to the fluid circulation loop for selectively providing cooling to the fluid circulation loop and a plurality of thermal electric elements carried by the target for selectively providing heating or cooling to the target. The heating heat exchanger and cooling heat exchanger provide gross control of the temperature of the target, and the plurality of thermal electric elements provide fine control of the temperature of the target.

Abstract: A temperature control device for use in a process reactor system with a bubbler having a container provided with a side wall. The device includes a vessel having an internal chamber adapted to receive the container of the bubbler. An enclosure member is extendable between the container of the bubbler and the vessel for enclosing the side wall of the container within the internal chamber. A temperature-changing device is coupled to the vessel for providing heat or cold to the internal chamber.

Abstract: An apparatus for use with a process liquid for controlling the temperature of a semiconductor-processing target comprises first and second tanks adapted for holding process liquid, at least one fluid level sensor carried by the first tank for monitoring the amount of process liquid in the first tank, and a valve coupled to one of the at least one fluid level sensor and configured to increases the flow of process liquid from the second tank to the target when the amount of process liquid in the first tank drops to a first predetermined amount. The first tank may include first and second compartments partially separated by a divider with a top whereby process liquid in the first compartment flows over the top of the divider into the second compartment.

Abstract: An apparatus for use with a process liquid for controlling the temperature of a semiconductor-processing target comprises first and second tanks adapted for holding process liquid, at least one fluid level sensor carried by the first tank for monitoring the amount of process liquid in the first tank, and a valve coupled to one of the at least one fluid level sensor and configured to increases the flow of process liquid from the second tank to the target when the amount of process liquid in the first tank drops to a first predetermined amount. The first tank may include first and second compartments partially separated by a divider with a top whereby process liquid in the first compartment flows over the top of the divider into the second compartment.

Abstract: A temperature control system having a re-circulation loop that uses valves to selectively circulate a temperature control fluid through a cooling system, through a heating system, or through a through passage so as to controlling the temperature of the temperature control fluid, which, in turn, controls the temperature of a target. A temperature sensor monitors the target's temperature. A controller controls valve operation in response to the temperature measured by the temperature sensor to obtain a predetermined target temperature. Beneficially, the controller controls the target's temperature according to a predetermined temperature profile. Continuous etching along a predetermined temperature profile is possible.

Abstract: A temperature control system having a re-circulation loop that uses valves to selectively circulate a temperature control fluid through a cooling system, through a heating system, or through a through passage so as to controlling the temperature of the temperature control fluid, which, in turn, controls the temperature of a target. A temperature sensor monitors the target's temperature. A controller controls valve operation in response to the temperature measured by the temperature sensor to obtain a predetermined target temperature. Beneficially, the controller controls the target's temperature according to a predetermined temperature profile. Continuous etching along a predetermined temperature profile is possible.

Abstract: A temperature control system for multiple process components is a semiconductor processing facility includes a common cooling unit for controlling the temperature of a cooling fluid and multiple remote temperature control modules in fluid communications with the common cooling unit that separately control the temperature of the multiple process components. The remote temperature control modules are located near the process components and each remote temperature control module includes a circulation loop for the cooling fluid from the common cooling unit and circulation loop for a heat transfer fluid that received from a process component. A heat exchanger within the remote temperature control module allows heat transfer between the heat transfer fluid and the cooling fluid, thereby cooling the process component. A heat source may also be include within the remote temperature control module to provide heat to the heat transfer fluid and to the process component.

Abstract: A temperature control device for use in a process reactor system with a bubbler having a container provided with a side wall. The device includes a vessel having an internal chamber adapted to receive the container of the bubbler. An enclosure member is extendable between the container of the bubbler and the vessel for enclosing the side wall of the container within the internal chamber. A temperature-changing device is coupled to the vessel for providing heat or cold to the internal chamber.

Abstract: A temperature control system having a re-circulation loop that uses valves to selectively circulate a temperature control fluid through a cooling system, through a heating system, or through a through passage so as to controlling the temperature of the temperature control fluid, which, in turn, controls the temperature of a target. A temperature sensor monitors the target's temperature. A controller controls valve operation in response to the temperature measured by the temperature sensor to obtain a predetermined target temperature. Beneficially, the controller controls the target's temperature according to a predetermined temperature profile. Continuous etching along a predetermined temperature profile is possible.

Abstract: A temperature control system having a re-circulation loop that uses valves to selectively circulate a temperature control fluid through a cooling system, through a heating system, or through a through passage so as to controlling the temperature of the temperature control fluid, which, in turn, controls the temperature of a target. A temperature sensor monitors the target's temperature. A controller controls valve operation in response to the temperature measured by the temperature sensor to obtain a predetermined target temperature. Beneficially, the controller controls the target's temperature according to a predetermined temperature profile. Continuous etching along a predetermined temperature profile is possible.

Abstract: A temperature control system having a re-circulation loop that uses valves to selectively circulate a temperature control fluid through a cooling system, through a heating system, or through a through passage so as to controlling the temperature of the temperature control fluid, which, in turn, controls the temperature of a target. A temperature sensor monitors the target's temperature. A controller controls valve operation in response to the temperature measured by the temperature sensor to obtain a predetermined target temperature. Beneficially, the controller controls the target's temperature according to a predetermined temperature profile. Continuous etching along a predetermined temperature profile is possible.

Abstract: A compact heat exchanger for adjusting the temperature of a stream of liquid of unknown temperature. The heat exchanger includes a hollow core element provided with a passageway which extends therethrough. The core element has an outer surface extending therealong adjacent the passageway. A plurality of thermal electric elements are spaced apart along the outer surface of the core element for providing heating or cooling to the core element. Each thermal electric element has a heat transfer surface which generally conforms to the outer surface of the core element. An assembly is provided for clamping the plurality of thermal electric elements to the outer surface of the core element and includes a heat transfer member for each thermal electric element. The clamping assembly permits the heat transfer members to move independent of each other.