Patents by Inventor Boris Bastien

Boris Bastien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11682737
    Abstract: A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: June 20, 2023
    Assignee: Maxeon Solar Pte. Ltd.
    Inventors: Pei Hsuan Lu, Benjamin I. Hsia, David Aaron Randolph Barkhouse, Lewis C. Abra, George G. Correos, Boris Bastien
  • Publication number: 20220158001
    Abstract: A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
    Type: Application
    Filed: January 31, 2022
    Publication date: May 19, 2022
    Inventors: Pei Hsuan Lu, Benjamin I. Hsia, David Aaron Randolph Barkhouse, Lewis C. Abra, George G. Correos, Boris Bastien
  • Patent number: 11276785
    Abstract: A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: March 15, 2022
    Assignee: SunPower Corporation
    Inventors: Pei Hsuan Lu, Benjamin I. Hsia, David Aaron Randolph Barkhouse, Lewis C. Abra, George G. Correos, Boris Bastien
  • Publication number: 20200105951
    Abstract: A solar cell can include a first plurality of metal contact fingers, and a second plurality of metal contact fingers interdigitated with the first plurality of metal contact fingers, wherein at least one of the first plurality of metal contact fingers comprises a wrap-around metal finger that passes between a first edge of the solar cell and at least one contact pads. A photovoltaic (PV) string including a solar cell with a wrap-around metal contact finger. A method of coupling an electrically conductive connector to a solar cell with a wrap-around metal contact finger.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 2, 2020
    Inventors: Matthieu Minault Reich, Lewis C. Abra, David Fredric Joel Kavulak, Andrea R. Bowring, Benjamin Francois, Peter J. Cousins, Boris Bastien, Benjamin I. Hsia, Raphael M. Manalo
  • Publication number: 20190312157
    Abstract: A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
    Type: Application
    Filed: April 5, 2019
    Publication date: October 10, 2019
    Inventors: Pei Hsuan Lu, Benjamin I. Hsia, David Aaron Randolph Barkhouse, Lewis C. Abra, George G. Correos, Boris Bastien