Abstract: A method for depth mapping includes providing a depth mapping device comprising a projector, which is configured to project a pattern of optical radiation onto a target area over a first field of view about a projection axis, and a camera, which is configured to capture images of the target area within a second field of view, narrower than the first field of view, about a camera axis, which is offset transversely relative to the projection axis. The projector projects the pattern onto first and second planes at first and second distances from the camera, and the camera captures first and second reference images containing first and second parts of the pattern on the first and second planes, respectively. The first and second reference images are combined to produce an extended reference image including both the first and second parts of the pattern.

Abstract: One disclosed embodiment includes techniques for temperature-dependent reference image correction in structured light projectors that may be used for generating three-dimensional (3D) scene depth maps. The techniques disclosed herein include receiving an indication of a temperature (e.g., an actual current operating temperature or a change in the current operating temperature relative to an established reference temperature) associated with one or more components of a projector and then determining, based on the temperature indication, an amount of adjustment needed to correct a reference pattern image based on an estimated effective focal length change of the projector. Next, a reference pattern image may be appropriately adjusted, e.g.

Abstract: One disclosed embodiment includes techniques for temperature-dependent reference image correction in structured light projectors that may be used for generating three-dimensional (3D) scene depth maps. The techniques disclosed herein include receiving an indication of a temperature (e.g., an actual current operating temperature or a change in the current operating temperature relative to an established reference temperature) associated with one or more components of a projector and then determining, based on the temperature indication, an amount of adjustment needed to correct a reference pattern image based on an estimated effective focal length change of the projector. Next, a reference pattern image may be appropriately adjusted, e.g.

Abstract: An optical apparatus includes a transparent envelope having opposing first and second faces. An electro-optic material is contained within the transparent envelope and includes molecules oriented in respective predefined directions selected so as to form a geometric-phase structure across an area of the transparent envelope. First and second transparent electrodes are disposed respectively across the first and second faces of the transparent envelope. A controller is coupled to apply a voltage between the first and second transparent electrodes that is sufficient to displace the molecules of the electro-optic material from the predefined directions.

Abstract: An optoelectronic device includes a semiconductor substrate, an array of optical emitters arranged on the substrate in a two-dimensional pattern, a projection lens and a diffractive optical element (DOE). The projection lens is mounted on the semiconductor substrate and is configured to collect and focus light emitted by the optical emitters so as to project optical beams containing a light pattern corresponding to the two-dimensional pattern of the optical emitters on the substrate. The DOE is mounted on the substrate and is configured to produce and project multiple overlapping replicas of the pattern.

Abstract: An optoelectronic device includes a semiconductor substrate, an array of optical emitters arranged on the substrate in a two-dimensional pattern, a projection lens and a diffractive optical element (DOE). The projection lens is mounted on the semiconductor substrate and is configured to collect and focus light emitted by the optical emitters so as to project optical beams containing a light pattern corresponding to the two-dimensional pattern of the optical emitters on the substrate. The DOE is mounted on the substrate and is configured to produce and project multiple overlapping replicas of the pattern.

Abstract: An optoelectronic device includes a semiconductor substrate, an array of optical emitters arranged on the substrate in a two-dimensional pattern, a projection lens and a diffractive optical element (DOE). The projection lens is mounted on the semiconductor substrate and is configured to collect and focus light emitted by the optical emitters so as to project optical beams containing a light pattern corresponding to the two-dimensional pattern of the optical emitters on the substrate. The DOE is mounted on the substrate and is configured to produce and project multiple overlapping replicas of the pattern.

Abstract: An optoelectronic device includes a semiconductor substrate, an array of optical emitters arranged on the substrate in a two-dimensional pattern, a projection lens and a diffractive optical element (DOE). The projection lens is mounted on the semiconductor substrate and is configured to collect and focus light emitted by the optical emitters so as to project optical beams containing a light pattern corresponding to the two-dimensional pattern of the optical emitters on the substrate. The DOE is mounted on the substrate and is configured to produce and project multiple overlapping replicas of the pattern.

Abstract: An optoelectronic device includes a semiconductor substrate, an array of optical emitters arranged on the substrate in a two-dimensional pattern, a projection lens and a diffractive optical element (DOE). The projection lens is mounted on the semiconductor substrate and is configured to collect and focus light emitted by the optical emitters so as to project optical beams containing a light pattern corresponding to the two-dimensional pattern of the optical emitters on the substrate. The DOE is mounted on the substrate and is configured to produce and project multiple overlapping replicas of the pattern.

Abstract: An optoelectronic device includes a semiconductor substrate, an array of optical emitters arranged on the substrate in a two-dimensional pattern, a projection lens and a diffractive optical element (DOE). The projection lens is mounted on the semiconductor substrate and is configured to collect and focus light emitted by the optical emitters so as to project optical beams containing a light pattern corresponding to the two-dimensional pattern of the optical emitters on the substrate. The DOE is mounted on the substrate and is configured to produce and project multiple overlapping replicas of the pattern.

Abstract: An optoelectronic device includes a semiconductor substrate, an array of optical emitters arranged on the substrate in a two-dimensional pattern, a projection lens and a diffractive optical element (DOE). The projection lens is mounted on the semiconductor substrate and is configured to collect and focus light emitted by the optical emitters so as to project optical beams containing a light pattern corresponding to the two-dimensional pattern of the optical emitters on the substrate. The DOE is mounted on the substrate and is configured to produce and project multiple overlapping replicas of the pattern.

Abstract: An inspection system includes a first focusing unit configured to perform fast focus changes to a first focusing function applied to an incident light beam. A traveling lens acousto-optic device is arranged to receive the light beam focused by the first focusing function and produce focused spots using a plurality of traveling lenses generated in response to radio frequency signals. The traveling lenses apply a second focusing function and the traveling lens acousto-optic device is arranged to alter the second focusing function at a fast rate. The inspection system also includes optics arranged to direct the focused spots onto an inspected object and to direct radiation from the inspected object to a sensor.

Abstract: An inspection system includes a first focusing unit configured to perform fast focus changes to a first focusing function applied to an incident light beam. A traveling lens acousto-optic device is arranged to receive the light beam focused by the first focusing function and produce focused spots using a plurality of traveling lenses generated in response to radio frequency signals. The traveling lenses apply a second focusing function and the traveling lens acousto-optic device is arranged to alter the second focusing function at a fast rate. The inspection system also includes optics arranged to direct the focused spots onto an inspected object and to direct radiation from the inspected object to a sensor.

Abstract: An inspection system includes a first focusing unit configured to perform fast focus changes to a first focusing function applied to an incident light beam. A traveling lens acousto-optic device is arranged to receive the light beam focused by the first focusing function and produce focused spots using a plurality of traveling lenses generated in response to radio frequency signals. The traveling lenses apply a second focusing function and the traveling lens acousto-optic device is arranged to alter the second focusing function at a fast rate. The inspection system also includes optics arranged to direct the focused spots onto an inspected object and to direct radiation from the inspected object to a sensor.

Abstract: An inspection system includes a first focusing unit configured to perform fast focus changes to a first focusing function applied to an incident light beam. A traveling lens acousto-optic device is arranged to receive the light beam focused by the first focusing function and produce focused spots using a plurality of traveling lenses generated in response to radio frequency signals. The traveling lenses apply a second focusing function and the traveling lens acousto-optic device is arranged to alter the second focusing function at a fast rate. The inspection system also includes optics arranged to direct the focused spots onto an inspected object and to direct radiation from the inspected object to a sensor.