Patents by Inventor Boris Regaard
Boris Regaard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240168306Abstract: A focusing device for focusing at least two laser beams onto a moving target material in a target region for generating extreme ultraviolet (EUV) radiation is provided. The focusing device includes a first focusing element for focusing a first laser beam onto the target material at a first position in the target region, a second focusing element for focusing a second laser beam onto the target material at a second position in the target region, and a reflective optical element for reflecting the EUV radiation generated by the target material. An optical axis of the first focusing element and/or an optical axis of the second focusing element are aligned approximately parallel or congruently with respect to an optical axis of the reflective optical element.Type: ApplicationFiled: January 24, 2024Publication date: May 23, 2024Inventor: Boris Regaard
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Publication number: 20230381896Abstract: A method for identifying disruptions during a machining process, more particularly during a cutting process, includes: machining, more particularly cutting, a workpiece while moving a machining tool, in particular a laser machining head, and the workpiece relative to one another, recording an image of a region on the workpiece to be monitored, the region to be monitored being an interaction region of the machining tool with the workpiece, and evaluating the image of the region to be monitored. For the purpose of identifying at least one disruption of the machining process, the presence or the lack of a local intensity drop in an intensity profile within the interaction region is detected, during the evaluation of the image, in an advancement direction of the machining process. There is also described an associated machining apparatus.Type: ApplicationFiled: August 10, 2023Publication date: November 30, 2023Inventors: Winfried Magg, Boris Regaard, David Schindhelm, Steffen Kessler
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Patent number: 11612954Abstract: A method performed by a laser machine includes: before a laser-beam machining process, recording an influence of a change in a position of at least one movable laser machine component on a lateral position of a focal point of a laser beam in a focal plane or relative to a reference point, storing an association between the position of the movable laser machine component and the lateral position, and then, setting, based on the stored association, the focal point to a preset lateral position in the focal plane or relative to the reference point by setting the position of the movable laser machine component. The movable laser machine component can include at least one of at least one optical element in a beam path of the laser beam, a laser-beam machining head in a work area of a laser machine, or a movable part of the laser-beam machining head.Type: GrantFiled: January 21, 2020Date of Patent: March 28, 2023Assignee: TRUMPF Werkzeugmaschinen SE + Co. KGInventor: Boris Regaard
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Patent number: 11471977Abstract: A device for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece. The device includes a focusing unit for focusing a machining beam, in particular a laser beam, onto the workpiece for the formation of a kerf on the workpiece. The device also includes an image acquisition unit to generate at least one image of a region of the workpiece, and an evaluation unit configured to determine, based on the at least one image, at least one measured variable for the course of the gap width of the kerf in a thickness direction of the workpiece. The invention also relates to an associated method for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece.Type: GrantFiled: April 12, 2019Date of Patent: October 18, 2022Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KGInventors: Winfried Magg, David Schindhelm, Boris Regaard, Oliver Bocksrocker, Volker Rominger
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Patent number: 11440141Abstract: The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An control apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.Type: GrantFiled: August 20, 2019Date of Patent: September 13, 2022Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KGInventors: Boris Regaard, David Schindhelm
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Patent number: 11440135Abstract: Described is laser machining nozzles for laser machining devices. The laser machining nozzles includes a body having an inner surface and an outer surface. The inner surface of the laser machining nozzles include at least one subarea. The subarea includes a layer of at least one of the copper oxides CuO and Cu2O. The layer of CuO and/or Cu2O has an absorbing effect for radiation at an observation wavelength between 300 and 1100 nm or between 900 and 1700 nm.Type: GrantFiled: October 26, 2018Date of Patent: September 13, 2022Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KGInventors: David Schindhelm, Christian Greger, Boris Regaard
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Publication number: 20210229220Abstract: A method determines at least one parameter for a process quality during a processing process. The method includes: processing a workpiece while moving a processing tool and the workpiece relative to one another; monitoring a region on the workpiece; determining the at least one parameter for the process quality based on the monitored region; and determining at least one position-dependent parameter for the process quality based on a plurality of measured values of the at least one parameter at a same processing position, or determining at least one direction-dependent parameter for the process quality based on the plurality of measured values of the at least one parameter in a same processing direction.Type: ApplicationFiled: April 9, 2021Publication date: July 29, 2021Inventors: Boris Regaard, Winfried Magg
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Patent number: 10717151Abstract: A laser processing head comprising a focusing device for focusing a processing laser beam onto a workpiece, the focusing device arranged in a processing beam path, an optical imaging device comprising a detector, wherein the optical imaging device is configured to image observation radiation from a processing region of the workpiece onto the detector along an observation beam path passing through the focusing device, a beam splitter for separating the observation beam path from the processing beam path of the processing laser beam, imaging optics arranged in the observation beam path between the beam splitter and the detector; and a stop arranged between the imaging optics and the detector, wherein the imaging optics produces an image of the stop in the processing beam path of the processing laser beam between the beam splitter and the workpiece.Type: GrantFiled: December 20, 2017Date of Patent: July 21, 2020Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KGInventor: Boris Regaard
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Publication number: 20200156184Abstract: A method performed by a laser machine includes: before a laser-beam machining process, recording an influence of a change in a position of at least one movable laser machine component on a lateral position of a focal point of a laser beam in a focal plane or relative to a reference point, storing an association between the position of the movable laser machine component and the lateral position, and then, setting, based on the stored association, the focal point to a preset lateral position in the focal plane or relative to the reference point by setting the position of the movable laser machine component. The movable laser machine component can include at least one of at least one optical element in a beam path of the laser beam, a laser-beam machining head in a work area of a laser machine, or a movable part of the laser-beam machining head.Type: ApplicationFiled: January 21, 2020Publication date: May 21, 2020Inventor: Boris Regaard
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Publication number: 20190375051Abstract: The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An control apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.Type: ApplicationFiled: August 20, 2019Publication date: December 12, 2019Inventors: Boris Regaard, David Schindhelm
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Patent number: 10427242Abstract: The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An evaluation apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.Type: GrantFiled: March 11, 2016Date of Patent: October 1, 2019Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KGInventors: Boris Regaard, David Schindhelm
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Patent number: 10399185Abstract: An apparatus includes a focusing element arranged to focus a high-energy beam on a workpiece, an image detector for recording at least one image of an area to be monitored on the surface of the workpiece and/or the reference contour; imaging optics arranged to (a) receive process radiation radiation through the focusing element, from an area of the workpiece and/or the reference contour to be monitored, in the form of a first monitoring beam that is non-coaxial with the high-energy beam between the workpiece and the imaging optics and (b) redirect the first monitoring beam to the image detector to provide the at least one image of the area to be monitored and/or the reference contour; and an evaluation device operable to determine the focus position of the high-energy beam based on the at least one recorded image.Type: GrantFiled: November 25, 2015Date of Patent: September 3, 2019Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KGInventor: Boris Regaard
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Publication number: 20190240785Abstract: A device for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece. The device includes a focusing unit for focusing a machining beam, in particular a laser beam, onto the workpiece for the formation of a kerf on the workpiece. The device also includes an image acquisition unit to generate at least one image of a region of the workpiece, and an evaluation unit configured to determine, based on the at least one image, at least one measured variable for the course of the gap width of the kerf in a thickness direction of the workpiece. The invention also relates to an associated method for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece.Type: ApplicationFiled: April 12, 2019Publication date: August 8, 2019Inventors: Winfried Magg, David Schindhelm, Boris Regaard, Oliver Bocksrocker, Volker Rominger
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Publication number: 20190232434Abstract: The invention relates to a method for determining a focal position of a machining beam, in particular a laser beam, relative to a workpiece when machining the workpiece using the machining beam, having the following steps: receiving at least one spatially resolved image of a workpiece region to be monitored, said region comprising the cut edges of a cut gap formed during the machining process on the upper face of the workpiece, ascertaining a gap width of the cut gap on the upper face of the workpiece using the cut edges in the at least one spatially resolved image, and determining the focal position of the machining beam relative to the workpiece using the ascertained gap width. The invention also relates to a corresponding device.Type: ApplicationFiled: April 11, 2019Publication date: August 1, 2019Inventors: Winfried Magg, David Schindhelm, Boris Regaard
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Publication number: 20190061051Abstract: Described is laser machining nozzles for laser machining devices. The laser machining nozzles includes a body having an inner surface and an outer surface. The inner surface of the laser machining nozzles include at least one subarea. The subarea includes a layer of at least one of the copper oxides CuO and Cu2O. The layer of CuO and/or Cu2O has an absorbing effect for radiation at an observation wavelength between 300 and 1100 nm or between 900 and 1700 nm.Type: ApplicationFiled: October 26, 2018Publication date: February 28, 2019Inventors: David Schindhelm, Christian Greger, Boris Regaard
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Patent number: 10115190Abstract: This disclosure relates to methods and apparatuses for determining a material type and/or a surface condition of a workpiece. A surface of the workpiece is illuminated with illuminating radiation. At least one image of the illuminated surface is recorded. The material type and/or the surface condition of the workpiece is determined on the basis of a statistical analysis of the at least one image converted into a spatial frequency domain.Type: GrantFiled: December 29, 2016Date of Patent: October 30, 2018Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KGInventors: Dieter Hallasch, Tim Hesse, Boris Regaard, David Schindhelm
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Publication number: 20180111223Abstract: A laser processing head comprising a focusing device for focusing a processing laser beam onto a workpiece, the focusing device arranged in a processing beam path, an optical imaging device comprising a detector, wherein the optical imaging device is configured to image observation radiation from a processing region of the workpiece onto the detector along an observation beam path passing through the focusing device, a beam splitter for separating the observation beam path from the processing beam path of the processing laser beam, imaging optics arranged in the observation beam path between the beam splitter and the detector; and a stop arranged between the imaging optics and the detector, wherein the stop is spaced apart from the detector, and wherein the imaging optics is configured to produce an image of the stop in the processing beam path of the processing laser beam between the beam splitter and the workpiece.Type: ApplicationFiled: December 20, 2017Publication date: April 26, 2018Inventor: Boris Regaard
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Publication number: 20170109874Abstract: This disclosure relates to methods and apparatuses for determining a material type and/or a surface condition of a workpiece. A surface of the workpiece is illuminated with illuminating radiation. At least one image of the illuminated surface is recorded. The material type and/or the surface condition of the workpiece is determined on the basis of a statistical analysis of the at least one image converted into a spatial frequency domain.Type: ApplicationFiled: December 29, 2016Publication date: April 20, 2017Inventors: Dieter Hallasch, Tim Hesse, Boris Regaard, David Schindhelm
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Patent number: 9457427Abstract: Methods, devices and systems for detecting an incomplete cutting action when cutting a workpiece with a high-energy beam are disclosed. In one aspect, a method includes taking an image of a region of the workpiece to be monitored, the region including an interaction region of the high-energy beam with the workpiece, evaluating the image taken in order to detect pooled slag at an end of the interaction region opposite a cutting front, and detecting whether a related cutting action is incomplete based on an occurrence of detection of pooled slag.Type: GrantFiled: May 23, 2014Date of Patent: October 4, 2016Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KGInventors: Tim Hesse, David Schindhelm, Boris Regaard
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Publication number: 20160193692Abstract: The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An evaluation apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.Type: ApplicationFiled: March 11, 2016Publication date: July 7, 2016Inventors: Boris Regaard, David Schindhelm