Patents by Inventor Bo-Tao Wang

Bo-Tao Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and method for testing motherboard
    Patent number: 7797581
    Abstract: A testing device for testing a motherboard is provided to include a server, a client terminal computer, a debug card and a receiving device. The server is connected to the client terminal computer, for inquiring test results. The debug card is attached to the motherboard, for getting test data. The receiving device connecting with the debug card transmits the test data to the server via a network. A testing method for testing a motherboard is provided to include the following steps: a debug card getting the test data from the motherboard; sending the test data to a receiving device, the receiving device transmitting the test data to a server, the server collating and analyzing the test data; and a client terminal computer inquiring test results via the server.
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: September 14, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Guang-Yu Zhu, Hoi Chan, Bo-Tao Wang, Li-Chuan Qiu, Da-Hua Xiao
  • DEVICE AND METHOD FOR TESTING MOTHERBOARD
    Publication number: 20080313503
    Abstract: A testing device for testing a motherboard is provided to include a server, a client terminal computer, a debug card and a receiving device. The server is connected to the client terminal computer, for inquiring test results. The debug card is attached to the motherboard, for getting test data. The receiving device connecting with the debug card transmits the test data to the server via a network. A testing method for testing a motherboard is provided to include the following steps: a debug card getting the test data from the motherboard; sending the test data to a receiving device, the receiving device transmitting the test data to a server, the server collating and analyzing the test data; and a client terminal computer inquiring test results via the server.
    Type: Application
    Filed: August 17, 2007
    Publication date: December 18, 2008
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: GUANG-YU ZHU, HOI CHAN, BO-TAO WANG, LI-CHUAN QIU, DA-HUA XIAO
  • Locking device for heat sink
    Patent number: 7272007
    Abstract: A locking device (10) for securing a heat sink to an electronic device includes a rectangular main frame (20), four first fasteners (30) respectively pivotably attached to four corners of the main frame and two second fasteners (40) pivotably attached to the main frame at opposite sides thereof. Each of the first and second fasteners respectively is capable of rotating relative to the main frame from a non-stretched position to a stretched position for attachment of the heat sink to the electronic device.
    Type: Grant
    Filed: December 14, 2004
    Date of Patent: September 18, 2007
    Assignees: Fu zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou, Bo-Tao Wang
  • Locking device for heat sink
    Publication number: 20060126301
    Abstract: A locking device (10) for securing a heat sink to an electronic device includes a rectangular main frame (20), four first fasteners (30) respectively pivotably attached to four corners of the main frame and two second fasteners (40) pivotably attached to the main frame at opposite sides thereof. Each of the first and second fasteners respectively is capable of rotating relative to the main frame from a non-stretched position to a stretched position for attachment of the heat sink to the electronic device.
    Type: Application
    Filed: December 14, 2004
    Publication date: June 15, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou, Bo-Tao Wang