Abstract: The invention provides a method for manufacturing a 3D item (10) comprising an electrically conductive coil (140) of at least part of an electrically conductive wire (51), wherein the method comprising printing with a fused deposition modeling (FDM) 3D printer (500) 3D printable material (201), wherein the 3D printable material (201) comprises the electrically conductive wire (51), to provide the 3D item (10) comprising the electrically conductive coil (140).

Abstract: An arrangement (100) and method for suspending a lighting device is provided. The arrangement comprises a spring element (110) having a central, U-shaped portion (120) and a first and a second coil (130a, 130b) extending from a respective first and second leg (140a, 140b) of the central portion and along an axis (A) parallel to a base (145) of the portion. The coils, in an unbiased state of the spring element, are spaced apart by a first distance (d) along the axis (A). The arrangement further comprises a housing (200) comprising a first and a second cavity (210a, 210b) spaced apart by the first distance (d) for fitting accommodation of the first and second coil, respectively. The arrangement further comprises a support element (300) arranged between the first and second cavities and configured to confine the first and second coil within the first and second cavity, respectively.

Abstract: The invention provides a method for manufacturing a 3D item (10) comprising an electrically conductive coil (140) of at least part of an electrically conductive wire (51), wherein the method comprising printing with a fused deposition modeling (FDM) 3D printer (500) 3D printable material (201), wherein the 3D printable material (201) comprises the electrically conductive wire (51), to provide the 3D item (10) comprising the electrically conductive coil (140).

Abstract: An arrangement (100) and method for suspending a lighting device is provided. The arrangement comprises a spring element (110) having a central, U-shaped portion (120) and a first and a second coil (130a, 130b) extending from a respective first and second leg (140a, 140b) of the central portion and along an axis (A) parallel to a base (145) of the portion. The coils, in an unbiased state of the spring element, are spaced apart by a first distance (d) along the axis (A). The arrangement further comprises a housing (200) comprising a first and a second cavity (210a, 210b) spaced apart by the first distance (d) for fitting accommodation of the first and second coil, respectively. The arrangement further comprises a support element (300) arranged between the first and second cavities and configured to confine the first and second coil within the first and second cavity, respectively.

Abstract: A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16. Solder 22 is present only on the at least one solder bonding area 16 and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe 10. Moreover, the reflecting material can function as a solder resist to self-align the solder 22 to the at least one solder bonding area 16.

Abstract: The invention provides a 3D printing method and product which makes use of a base module which comprises an electrical circuit, wherein the electrical circuit is incomplete. A 3D printed structure over the module completes the electrical circuit of the base module.

Abstract: The present invention relates to a lighting device (100, 200, 300) comprising a split lighting engine with at least two thermally separated sub-engines (104, 106, 202, 204, 206, 302). Each sub-engine comprises at least one solid state light source (114, 212, 306) and a component (118, 210, 304) adapted to regulate electric current or power to the at least one solid state light source (114, 212, 306), so that the sub-engines (104, 106, 202, 204, 206, 302) are individually drivable based on a thermal environment of each sub-engine.

Abstract: The present invention relates to a lighting device (100, 200, 300) comprising a split lighting engine with at least two thermally separated sub-engines (104, 106, 202, 204, 206, 302). Each sub-engine comprises at least one solid state light source (114, 212, 306) and a component (118, 210, 304) adapted to regulate electric current or power to the at least one solid state light source (114, 212, 306), so that the sub-engines (104, 106, 202, 204, 206, 302) are individually drivable based on a thermal environment of each sub-engine.

Abstract: A light source assembly, a method for producing a light source assembly, and a lamp are provided. In one example, the light source assembly comprises a substrate comprising first and second substrate portions being arranged at a tilt angle (?) to each other forming a V-shaped structure, wherein, at the tip of the V-shaped structure, the first portion comprises a first electrical terminal and the second portion comprises a second electrical terminal. The light source assembly further comprises a light source arranged to bridge a terminal gap between the first and second electrical terminals such that the light source is in electrical connection with the first and second electrical terminals.

Abstract: A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16. Solder 22 is present only on the at least one solder bonding area 16 and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe 10. Moreover, the reflecting material can function as a solder resist to self-align the solder 22 to the at least one solder bonding area 16.

Abstract: A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.

Abstract: A system (100) for receiving electrical power wirelessly comprises a first (101) and a second electrode (102), with sandwiched there between at least one load module (103) dispersed in a matrix (104). Wherein at least the matrix (104) is applied in wet form.

Abstract: A method for producing a lighting device is disclosed. The method comprises: providing two or more light sources (1, 9) sandwiched between and electrically connected to a first electrically conductive layer (5) and a second electrically conductive layer (7), the first electrically conductive layer (5) being transparent or translucent and both of the first (5) and second (7) electrically conductive layers initially lacking a conductive pattern; and thereafter forming a first electrically conductive pattern (16) in the first electrically conductive layer (5) and a second electrically conductive pattern (7) in the second electrically conductive layer (7) to provide at least one desired electrical circuit for the lighting device the first electrically conductive pattern (16) being different from the second electrically conductive pattern (17).

Abstract: A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.

Abstract: A system (100) for receiving electrical power wirelessly comprises a first (101) and a second electrode (102), with sandwiched there between at least one load module (103) dispersed in a matrix (104). Wherein at least the matrix (104) is applied in wet form.

Abstract: A light source assembly, a method for producing a light source assembly, and a lamp are provided. In one example, the light source assembly comprises a substrate comprising first and second substrate portions being arranged at a tilt angle (?) to each other forming a V-shaped structure, wherein, at the tip of the V-shaped structure, the first portion comprises a first electrical terminal and the second portion comprises a second electrical terminal. The light source assembly further comprises a light source arranged to bridge a terminal gap between the first and second electrical terminals such that the light source is in electrical connection with the first and second electrical terminals.