Patents by Inventor Boudewijn van Blokland

Boudewijn van Blokland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Backend taping using fluid assisted fixation
    Patent number: 10600672
    Abstract: A method comprising; transferring a holding liquid into at least one pocket of a carrier tape, the at least one pocket comprising a recess within the carrier tape configured to receive an electronic component; placing an electronic component into the at least one pocket whereby the holding liquid acts to retain the electronic component within the pocket; and applying a sealing tape over the carrier tape to close the pocket with the electronic component therein.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: March 24, 2020
    Assignee: NEXPERIA B.V.
    Inventors: Boudewijn Van Blokland, Tom Kok
  • BACKEND TAPING USING FLUID ASSISTED FIXATION
    Publication number: 20170162419
    Abstract: A method comprising; transferring a holding liquid into at least one pocket of a carrier tape, the at least one pocket comprising a recess within the carrier tape configured to receive an electronic component; placing an electronic component into the at least one pocket whereby the holding liquid acts to retain the electronic component within the pocket; and applying a sealing tape over the carrier tape to close the pocket with the electronic component therein.
    Type: Application
    Filed: October 3, 2016
    Publication date: June 8, 2017
    Inventors: Boudewijn VAN BLOKLAND, Tom KOK
  • Dual interface IC card components and method for manufacturing the dual-interface IC card components
    Patent number: 9424507
    Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: August 23, 2016
    Assignee: NXP B.V.
    Inventors: Christian Zenz, Tonny Kamphuis, Johannes Wilhelmus van Rijckevorsel, Bodin Kasemset, David Ceccarelli, Boudewijn van Blokland, Patrick Schoengrundner
  • DUAL INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE DUAL-INTERFACE IC CARD COMPONENTS
    Publication number: 20150278673
    Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.
    Type: Application
    Filed: April 1, 2014
    Publication date: October 1, 2015
    Applicant: NXP B.V.
    Inventors: Christian Zenz, Tonny Kamphuis, Johannes Wilhelmus van Rijckevorsel, Bodin Kasemset, David Ceccarelli, Boudewijn van Blokland, Patrick Schoengrundner