Patents by Inventor Bradford O. Doten

Bradford O. Doten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for bonding an article to a metallized substrate
    Patent number: 4295596
    Abstract: A chip carrier (5) having a plurality of first ends (21--21) is aligned with and bonded to mating lands (34--34) on a PCB substrate (31) by positioning the carrier in a recess of a nozzle (66) on the tool and directing individual streams of hot gas horizontally onto the terminals and lands to cause previously deposited solder thereon to reflow to bond the articles together. Alternatively, articles bonded with reflowable material may be de-bonded in a like manner.
    Type: Grant
    Filed: December 19, 1979
    Date of Patent: October 20, 1981
    Assignee: Western Electric Company, Inc.
    Inventors: Bradford O. Doten, John J. Svitak