Abstract: Device for delivering heated fluid to the sides of a component to melt solder at terminals disposed at the periphery of the component. The device includes a nozzle for delivering heated fluid generally in a first direction to the sides of the component, and a baffle disposed within or above the nozzle for directing the heated fluid generally laterally with respect to the first direction prior to delivery of the heated fluid toward the sides of the component. The nozzle has downwardly extending sides, and the sides are dimensioned so that the component can be accommodated within the nozzle. The baffle produces good distribution and mixing of heated air above and about the terminals, and this avoids the generation of hot spots, and produces simultaneous or essentially simultaneous melting of the solder at all of the leads to facilitate quick and convenient attachment of the component to or removal of the component from a printed circuit board.

Abstract: A optical system for stand alone use or for use with a device for attaching modular electronic components to or removing them from a substrate, including a microscope which is horizontally rotatable through 0.degree., +90.degree.. and -90.degree. positions relative to a component to permit viewing of three sides of the component and thus facilitate alignment of the component terminals with leads on the substrate together with inspection of soldered joints. A unit for vertically rotating the microscope through 90.degree. with respect to the component is also disclosed which includes means for quickly positioning and locking the microscope at a preset vertical orientation such as 45.degree. to further facilitate the alignment and inspection functions. Mirrors are also disclosed which enable viewing of three or four sides of a component in the 0.degree. horizontal position of the microscope whereby the above rotation of the microscope to the +90.degree. and -90.degree. positions may be avoided.