Patents by Inventor Bradley J. Brennan

Bradley J. Brennan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography
    Patent number: 11884859
    Abstract: This invention pertains to compositions, methods and systems that can be used in chemical mechanical planarization (CMP) of a tungsten containing semiconductor device. CMP slurries comprising bicyclic amidine additives provide low dishing and low erosion topography.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: January 30, 2024
    Assignee: Versum Materials US, LLC
    Inventors: Matthias Stender, Agnes Derecskei, Bradley J. Brennan
  • Tungsten Chemical Mechanical Planarization (CMP) With Low Dishing And Low Erosion Topography
    Publication number: 20210340445
    Abstract: This invention pertains to compositions, methods and systems that can be used in chemical mechanical planarization (CMP) of a tungsten containing semiconductor device. CMP slurries comprising bicyclic amidine additives provide low dishing and low erosion topography.
    Type: Application
    Filed: July 16, 2021
    Publication date: November 4, 2021
    Applicant: Versum Materials US, LLC
    Inventors: Matthias Stender, Agnes Derecskei, Bradley J. Brennan
  • Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography
    Patent number: 11111435
    Abstract: This invention pertains to compositions, methods and systems that can be used in chemical mechanical planarization (CMP) of a tungsten containing semiconductor device. CMP slurries comprising bicyclic amidine additives provide low dishing and low erosion topography.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: September 7, 2021
    Assignee: VERSUM MATERIALS US, LLC
    Inventors: Matthias Stender, Agnes Derecskei, Bradley J. Brennan
  • Tungsten Chemical Mechanical Planarization (CMP) With Low Dishing And Low Erosion Topography
    Publication number: 20200040256
    Abstract: This invention pertains to compositions, methods and systems that can be used in chemical mechanical planarization (CMP) of a tungsten containing semiconductor device. CMP slurries comprising bicyclic amidine additives provide low dishing and low erosion topography.
    Type: Application
    Filed: July 24, 2019
    Publication date: February 6, 2020
    Applicant: Versum Materials US, LLC
    Inventors: Matthias Stender, Agnes Derecskei, Bradley J. Brennan