Abstract: A cable processing apparatus including a frame; a cable guide coupled to the frame; a first cable clamp adjacent the cable guide; a second cable clamp adjacent the cable guide where the first cable clamp is disposed between the cable guide and the second cable clamp; and a controller configured to move the second cable clamp to a clamped position such that a cable extending through the cable guide is clamped by the second cable clamp, move the second cable clamp, relative to the cable guide, in a direction extending along the cable such that a first portion of the insulation is removed from the cable at the first score to expose shielding of the cable, and move the second cable clamp, relative to the first cable clamp, in the direction extending along the cable to cut the shielding to expose one or more conductor of the cable.

Abstract: A method of reducing entanglement of wires includes receiving, at a tray, one or more first wires of a first wire group from a wire feed system of a wire processing machine. In addition, the method includes receiving, at the tray, one or more second wires of a second wire group from the wire feed system after receiving the first wire group at the tray. The method further includes physically separating, using a separator device associated with the tray, at least a portion of the first wire group from the second wire group. The method also includes moving the second wire group relative to the first wire group, reducing movement of at least a portion of the first wire group relative to a tray surface during movement of the second wire group relative to the first wire group.

Abstract: A method of reducing entanglement of wires includes receiving from a wire feed system of a wire processing machine a first wire on a tray surface providing a wire-to-surface coefficient of friction between the tray surface and the first wire. In addition, the method includes receiving from the wire feed system a second wire at least partially on top of the first wire, the wire-to-surface coefficient of friction being higher than a wire-to-wire coefficient of friction between the first wire and the second wire. The method also includes moving the second wire relative to the first wire, and reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire due to the wire-to-surface coefficient of friction being higher than the wire-to-wire coefficient of friction.

Abstract: A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

Abstract: A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

Abstract: A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

Abstract: A method and system for fabricating a part includes sectionalizing a computer-generated representation of a part into strata having an order, forming layers corresponding to the strata from sheet material, stacking at least two of the layers in the order, and joining the layers together. The method and system are suitable for producing a phase-change material container for a thermal energy harvesting device, for example.

Abstract: A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

Abstract: A method and an apparatus relate to the insertion of one or more wires into a cavity of a fixture of a structure or component. The wire insertion apparatus includes a grommet, a gripper adapted to interface with the grommet, and at least a first vibrating element. The first vibrating element is connected to and vibrates one or more of the apparatus, the grommet, the gripper, the wire, and/or a component of the apparatus. Vibration, induced in any direction, enables the cavities to shift position during insertion relative to the contact, thus increasing the tolerance of the cavity, reducing the failure rate of wire insertion, and reducing total production time. The vibration breaks the static friction of the contact in the grommet or dielectric opening, creates the positive locating required to insert the contact in the grommet and/or dielectric, and/or pivots the contact.

Abstract: Data is remotely collected from a plurality of fasteners in response to a query signal wirelessly transmitted by a reader. Each of the fasteners includes a sensor for measuring a parameter related to the stress on the fastener. A device adapted to be attached to each of the fasteners receives the query signal, activates the sensor to measure the parameter and wirelessly transmits the data including the parameter to the reader.

Abstract: A wire insertion system includes a fixture, a first vibrating element connected to the fixture, and a gripper adapted to interface with the fixture and to support a plurality of wires, in which the gripper includes a body, at least one gripping member coupled to the body, and a second vibrating element connected to the gripper. The wire insertion system further includes a sensor coupled to the fixture, and a controller coupled to the sensor and in communication with the first vibrating element, the second vibrating element, and the gripper, and configured to vibrate the first vibrating element and the second vibrating element using signals from the sensor.

Abstract: A method of inspecting a wire contact includes determining, at a processor, a striation metric of a particular image of the wire contact. The particular image depicts an inspection hole in the wire contact. The method also includes comparing the striation metric to a wire-in-hole detection threshold and determining that a threshold number of visible wire strands are oriented along a particular axis in the inspection hole if the striation metric satisfies the wire-in-hole detection threshold.

Abstract: A cable processing apparatus including a frame; a cable guide coupled to the frame; a first cable clamp adjacent the cable guide; a second cable clamp adjacent the cable guide where the first cable clamp is disposed between the cable guide and the second cable clamp; and a controller configured to move the second cable clamp to a clamped position such that a cable extending through the cable guide is clamped by the second cable clamp, move the second cable clamp, relative to the cable guide, in a direction extending along the cable such that a first portion of the insulation is removed from the cable at the first score to expose shielding of the cable, and move the second cable clamp, relative to the first cable clamp, in the direction extending along the cable to cut the shielding to expose one or more conductor of the cable.

Abstract: Systems and methods are provided for wire processing. In certain examples, a wire processing system is disclosed. The wire processing system includes an electrical wire and solder sleeve joining system. The electrical wire and solder sleeve joining system includes an end effector configured to hold a solder sleeve and a split funnel configured to guide insertion of wire into the solder sleeve, allow movement of the solder sleeve through the split funnel in a second position, and prevent movement of the solder sleeve through the split funnel in a first position. The end effector can additionally be configured to remove a slug from the wire.

Abstract: A method for health monitoring of a damper associated with a landing gear is described which includes receiving sensor data from a pressure transducer and an accelerometer and optionally a thermal sensor operably mounted on or near the damper, a computer system, and applying, using the computer system, a diagnostic algorithm to the sensor data to induce and predict the health of the damper.

Abstract: An apparatus for processing a cable including an insulating member, a shielding layer, and a conductor, the apparatus includes a frame forming a housing having an aperture configured to receive an end portion of the cable; a first gripping member disposed within the housing and being configured to grip the cable; and a second gripping member disposed within the housing and being configured to grip the cable; wherein the second gripping member is mounted within the housing so as to be movable relative to the first gripping member to effect fanning and cutting of a portion of the shielding layer,

Abstract: An apparatus for processing a cable including an insulating member, a shielding layer, and a conductor, the apparatus includes a frame forming a housing having an aperture configured to receive an end portion of the cable; a first gripping member disposed within the housing and being configured to grip the cable; and a second gripping member disposed within the housing and being configured to grip the cable; wherein the second gripping member is mounted within the housing so as to be movable relative to the first gripping member to effect fanning and cutting of a portion of the shielding layer.

Abstract: A method of inspecting a wire contact includes determining, at a processor, a striation metric of a particular image of the wire contact. The particular image depicts an inspection hole in the wire contact. The method also includes comparing the striation metric to a wire-in-hole detection threshold and determining that a threshold number of visible wire strands are oriented along a particular axis in the inspection hole if the striation metric satisfies the wire-in-hole detection threshold.