Abstract: A data storage system may utilize a gimbal test system to find open circuits and short circuits in a head gimbal assembly. The gimbal test system can have a gimbal flexure suspended between a load beam and a data storage medium with a flex circuit physically attached to the gimbal flexure to electrically connect a transducing head to a controller. The flex circuit can be tested with a test via that continuously extends through the flex circuit to a probe portion and a test pad located on an air bearing side of the gimbal flexure. The probe portion can be backed by the gimbal flexure along a plane perpendicular to a recording surface of the data storage medium.

Abstract: A data storage system can employ at least one transducing head that is suspended above a data storage medium to access data. The transducing head suspension can be configured with a resonance system where a gimbal flexure is mounted to a load beam via a physical connection. The gimbal flexure may support a transducing head and contact the load beam via the physical connection, a dimple, and a first contact feature concurrently while the physical connection, dimple, and first contact feature are each separate and different points of physical contact.

Abstract: A slider adhesion system can be practiced in a data storage device with a flexure suspended from a load beam and a slider mounted to a gimbal tongue of the flexure. The slider can be aligned with an aperture of the gimbal tongue and attached to an adhesion feature of the gimbal tongue with an adhesive layer. The adhesion feature may consist of a plurality of cantilevered tabs extending into the aperture of the gimbal tongue.

Abstract: A data storage system can employ at least one transducing head that is suspended above a data storage medium to access data. The transducing head suspension can be configured with a resonance system where a gimbal flexure is mounted to a load beam via a physical connection. The gimbal flexure may support a transducing head and contact the load beam via the physical connection, a dimple, and a first contact feature concurrently while the physical connection, dimple, and first contact feature are each separate and different points of physical contact.

Abstract: A slider adhesion system can be practiced in a data storage device with a flexure suspended from a load beam and a slider mounted to a gimbal tongue of the flexure. The slider can be aligned with an aperture of the gimbal tongue and attached to an adhesion feature of the gimbal tongue with an adhesive layer. The adhesion feature may consist of a plurality of cantilevered tabs extending into the aperture of the gimbal tongue.

Abstract: A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer.

Abstract: A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer.

Abstract: A flex circuit including a dual sided interconnect structure to connect electrical components on a head or suspension assembly to head circuitry is described. The dual sided interconnect structure described has application for providing an electrical connection to one or more transducer elements on a slider and one or more elements of a heat assisted magnetic recording HAMR unit. In an illustrated embodiment, a flexible structure or insulating base layer includes one or more slider and heat assisted magnetic recording traces coupled to one or more slider or HAMR bond pads on an interconnect portion. As disclosed, the slider bond pads are on the obverse side of the flexible structure and the HAMR bond pads include a reverse side bonding surface to form reverse side bond pads to connect to one or more electrical or heating elements on the HAMR unit.

Abstract: A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer.

Abstract: A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer.

Abstract: A flex circuit including a dual sided interconnect structure to connect electrical components on a head or suspension assembly to head circuitry is described. The dual sided interconnect structure described has application for providing an electrical connection to one or more transducer elements on a slider and one or more elements of a heat assisted magnetic recording HAMR unit. In an illustrated embodiment, a flexible structure or insulating base layer includes one or more slider and heat assisted magnetic recording traces coupled to one or more slider or HAMR bond pads on an interconnect portion. As disclosed, the slider bond pads are on the obverse side of the flexible structure and the HAMR bond pads include a reverse side bonding surface to form reverse side bond pads to connect to one or more electrical or heating elements on the HAMR unit.

Abstract: A device comprises a fluid bearing including a textured fluid bearing surface and a second surface and a recordable disc. The recordable disc includes a substrate, a recordable media layer on the substrate, and at least one of the textured fluid bearing surface and the second surface. The device may be manufactured using MEMS techniques. MEMS techniques provide the high precision necessary to create the textured fluid bearing surface. MEMS techniques also allow the recordable disc to be batch-fabricated with one or more additional recordable discs.

Abstract: A device comprises a recordable disc, a substrate adjacent to the recordable disc, and an actuation mechanism fixed to the substrate. The recordable disc includes a base layer and a recordable layer on the base layer. Additional electrodes or magnetic components may be placed on the base layer to provide electromagnetic or electrostatic forces to rotate the recordable disc when acted on by the actuation mechanism. As an example, the invention may utilize MEMS techniques in order to integrate a disc and motor of a disc drive as a common component.

Abstract: In general, the invention is directed to techniques for integrated interconnects with a set of disc drives. The interconnects allow for a set of disc drives to be positioned in an array; for example, as set of disc drives may be stacked to communicate with a device through a single interface of the device. The interconnects may be formed as vias within the housing of the disc drives. Vias may produced using MEMS techniques, e.g., electroplating, as part of the manufacturing processes of the disc drive itself.

Abstract: A micro-electromechanical systems (MEMS) disc drive includes high-precision and integrated components to allow for increased functionality, robustness and reduced size as compared to currently produced disc drives. Integrating multiple subcomponents of the disc drive using batch processing provides low manufacturing costs. Furthermore, using MEMS techniques, new features can be added to disc drives. For example, an environmental control component, an accelerometer and/or a thermometer may be integrated into the housing of the disc drive.

Abstract: An integrated suspension assembly including interconnect is used to provide an electrical and mechanical connection between an actuation system and a slider. The suspension assembly includes a multi-layer laminate substrate having a base layer, an insulator layer and a conductor layer. The laminate substrate further includes an attachment region for attaching the suspension assembly to an actuator arm, a load beam region, a flexure region for supporting the slider, and an interconnect path. The interconnect path extends along the flexure region, the load beam region and the attachment region wherein the path terminates at the attachment region at a connection point to provide an electro-mechanical attachment to the actuator arm.

Abstract: An integrated suspension assembly including interconnect is used to provide an electrical and mechanical connection between an actuation system and a slider. The suspension assembly includes a multi-layer laminate substrate having a base layer, an insulator layer and a conductor layer. The laminate substrate further includes an attachment region for attaching the suspension assembly to an actuator arm, a load beam region, a flexure region for supporting the slider, and an interconnect path. The interconnect path extends along the flexure region, the load beam region and the attachment region wherein the path terminates at the attachment region at a connection point to provide an electromechanical attachment to the actuator arm.