Abstract: An electronic module that includes a plurality of electrically conductive leads, an electrically conductive base plate, a first integrated circuit (IC) die, at least one material block and an electrically non-conductive overmold. The at least one material block functions to more closely match coefficient of thermal expansion (CTE) differences between components of the electronic module.

Abstract: A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the microelectronic device package are performed resulting in savings from the removal of more expensive batch processing steps.

Abstract: A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the microelectronic device package are performed resulting in savings from the removal of more expensive batch processing steps.

Abstract: A multilayer circuit is provided characterized by a multilayer conductor structure. The multilayer conductor structure is composed of at least two conductor layers, with each adjacent layer being separated by a dielectric material in the form of one or more dielectric layers. The multilayer circuit further includes electrically conductive members or features for electrically interconnecting the conductor layers at two or more locations along the lengths of the conductor layers. As a result, portions of the conductor layers between two or more locations are electrically in parallel with each other, such that the multilayer conductor is characterized by an electrical resistance between the locations which is less than the electrical resistance of the individual conductor layers between the locations. The multilayer conductor is therefore characterized by an augmented current-carrying capacity as compared to a single layer conductor of the same length and width.

Abstract: A rotational accelerometer has a pair of coplanar, operationally independent linear acceleration sensors. Coplanarity is provided by a unitary substrate which forms the base structure of the operationally independent linear acceleration sensors.

Abstract: An accelerometer is provided which is suitably rugged for use in on-board automotive safety control and navigational systems. The preferred thick film accelerometer is formed from an alumina substrate having an integrally formed U-shaped flexure member which surrounds an intermediate support member. A mass is provided on the unsupported end of the U-shaped flexure member. Deflection is maximum at the unsupported end of the U-shaped flexure member, while strain is maximum at the supported end of the flexure member. Four piezoresistors for detecting the strain within the flexure member corresponding to the acceleration in the direction perpendicular to the plane of the support member are provided on the U-shaped flexure member adjacent its supported ends. The four piezoresistors form a Wheatstone bridge, whose analog output voltage is conditioned and amplified to provide the output signal. The signal conditioning and amplifying circuitry are preferably located on the support member.