Abstract: A disclosed example brush for dispensing multiple fluids during cleaning of a surface includes: an annular porous polymeric brush body configured to dispense a first fluid through the brush; and a first annular plate mechanically coupled to the brush body, wherein the plate includes: a channel to direct the first fluid from an inlet of the channel to the brush body; and a plate annulus aligned with a brush annulus of the brush body, such that the brush annulus and the plate annulus direct a second fluid from an inlet to the surface.

Abstract: An example brush for cleaning of a substrate includes: a porous polymeric brush body having one or more contact surfaces for cleaning the substrate, the one or more contact surfaces comprising a microtexture; and a brush support configured to mechanically couple the brush body to an actuator.

Abstract: Provided is disclosure for embodiments providing delivery of chemicals for conditioning a brush offline, where the brush is not coupled to a machine that makes use of the brush to clean a surface of an object.

Abstract: Systems and methods of forming a brush for advanced semiconductor contact cleaning applications are disclosed. For example, a contact surface or surfaces, such as a nodule, of a brush can be cut by a laser cutting system. The use of a laser cutting system allows for uniform cutting of the contact surface across a length of the brush.

Abstract: Provided is a disclosure for a brush for cleaning a surface, where the brush comprises a center core and cleaning material around the center core. Modules are found on the cleaning material, where nodule density on the cleaning material varies. Accordingly, a first nodule density of a first region of the cleaning material is different than a second nodule density of a second region of the cleaning material.

Abstract: Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.

Abstract: A system for monitoring contamination level of effluent of an offline brush conditioning system includes a first set of reservoirs configured to collect first effluents from corresponding portions of a first brush and a second set of reservoirs configured to collect second effluents from corresponding portions of a second brush, and the first and second effluents are from a fluid used to condition the first and second brushes that are configured to clean a surface of a semiconductor wafer. An effluent contamination monitor is configured to monitor contamination levels of the first and second effluents, wherein the monitored contamination levels may provide feedback for use in the brush conditioning.

Abstract: Provided is a disclosure for a brush for cleaning a surface, where the brush comprises a center core and cleaning material around the center core. Modules are found on the cleaning material, where nodule density on the cleaning material varies.

Abstract: Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.

Abstract: Provided is a disclosure for embodiments that perform effluent monitoring for brush conditioning, where the monitored data may be fed back for use in the conditioning.

Abstract: An example system for monitoring contamination level of effluent of an offline brush conditioning system includes a first reservoir configured to collect a first effluent from a first portion of a brush in the offline brush conditioning system and a second reservoir configured to collect a second effluent from a second portion of the brush, where the second portion is different from the first portion, and the first and second effluents are from a fluid used to condition a brush configured to clean a surface of a semiconductor wafer. An effluent contamination monitor is configured to monitor a first contamination level of the first effluent and a second contamination level of the second effluent.

Abstract: Provided is a disclosure for embodiments for a brush with communication capabilities, which is configured to clean a surface of, for example, a semiconductor wafer, as well as an offline brush conditioning system and a CMP system that can communicate with the brush.

Abstract: A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush engaged with a mandrel, and the brush forms an Archimedean screw thread form. The brush is formed of an absorbent material, preferably foam. In one aspect, the brush is seated within a groove in the mandrel.

Abstract: Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.

Abstract: Provided is a disclosure for embodiments for a brush with communication capabilities, which is configured to clean a surface of, for example, a semiconductor wafer, as well as an offline brush conditioning system and a CMP system that can communicate with the brush.

Abstract: Provided is a disclosure for embodiments for a brush with communication capabilities, which is configured to clean a surface of, for example, a semiconductor wafer, as well as an offline brush conditioning system and a CMP system that can communicate with the brush.

Abstract: Provided is a disclosure for embodiments for a brush with communication capabilities, which is configured to clean a surface of, for example, a semiconductor wafer, as well as an offline brush conditioning system and a CMP system that can communicate with the brush.

Abstract: Provided is disclosure for embodiments providing delivery of chemicals for conditioning a brush offline, where the brush is not coupled to a machine that makes use of the brush to clean a surface of an object.

Abstract: Provided is a disclosure for embodiments that perform effluent monitoring for brush conditioning, where the monitored data may be fed back for use in the conditioning.

Abstract: A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush engaged with a mandrel, and the brush forms an Archimedean screw thread form. The brush is formed of an absorbent material, preferably foam. In one aspect, the brush is seated within a groove in the mandrel.